SCHEMBL2494947

SCHEMBL2494947

CCN(CC)c1ccc(C=Cc2nc3ccccc3o2)cc1

nearest known ligand 0.61

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ATP4A P20648 14/20 0.61
ATP4B P51164 14/20 0.61
MEN1 O00255 5/20 0.58
KMT2A Q03164 5/20 0.58
NPC1 O15118 4/20 0.58
RAB9A P51151 3/20 0.58
MAPT P10636 3/20 0.54
SMN1; SMN2 Q16637 2/20 0.54
CYP2D6 P10635 2/20 0.54
CYP1A2 P05177 1/20 0.54
CYP3A4 P08684 1/20 0.54
CYP2C19 P33261 1/20 0.54
NPSR1 Q6W5P4 1/20 0.54
ALDH1A1 P00352 3/20 0.51
USP2 O75604 1/20 0.51
MAPK1 P28482 1/20 0.51
CTNNB1 P35222 1/20 0.51
ATM Q13315 1/20 0.51
RXFP1 Q9HBX9 1/20 0.51
TDP1 Q9NUW8 1/20 0.51

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29521633 1.00 ATP4A (0.61) ATP4AATP4BMEN1KMT2ANPC1
SCHEMBL31252954 1.00 ATP4A (0.61) ATP4AATP4BMEN1KMT2ANPC1
SCHEMBL2494945 1.00 ATP4A (0.61) ATP4AATP4BMEN1KMT2ANPC1
Hydrochloric Acid SCHEMBL6491469 0.99 ATP4A (0.61) ATP4AATP4BMEN1KMT2ANPC1
SCHEMBL6819056 0.86 ATP4A (0.48) ATP4AATP4BMEN1KMT2ANPC1
SCHEMBL6819062 0.86 ATP4A (0.48) ATP4AATP4BMEN1KMT2ANPC1
SCHEMBL476617 0.85 MEN1 (0.59) ATP4AATP4BMEN1KMT2ANPC1
SCHEMBL29397958 0.85 MEN1 (0.59) ATP4AATP4BMEN1KMT2ANPC1
SCHEMBL476616 0.85 MEN1 (0.59) ATP4AATP4BMEN1KMT2ANPC1
SCHEMBL11119879 0.83 ATP4A (0.59) ATP4AATP4BMEN1KMT2ANPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4985470-A Three component photoinitiator system, printing plates, photoresists, inks, paints, adhesives MITSUBISHI KASEI CORPORATION (JP) 1991-01-15 US claimed
JP-60019145-A None JP disclosed
US-20250355350-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-11-20 US disclosed
EP-4650874-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-11-19 EP disclosed
WO-2020162630-A1 METHOD FOR PRODUCING ORGANIC COMPOUND ダイキン工業株式会社 2020-08-13 WO disclosed
US-8575288-B2 Photocurable resin composition for forming overcoats RGB pixels black matrixes or spacers in color filter production, and color filters DAI NIPPON PRINTING CO., LTD. (JP) 2013-11-05 US disclosed
US-8029877-B2 Curable resin composition, curable resin composition for forming photosensitive pattern, color filter, liquid crystal panel substrate and liquid crystal panel DAI NIPPON PRINTING CO., LTD. (JP) 2011-10-04 US disclosed
US-20100238388-A1 CURABLE RESIN COMPOSITION, CURABLE RESIN COMPOSITION FOR FORMING PHOTOSENSITIVE PATTERN, COLOR FILTER, LIQUID CRYSTAL PANEL SUBSTRATE AND LIQUID CRYSTAL PANEL DAI NIPPON PRINTING CO., LTD. (JP) 2010-09-23 US disclosed
US-7550556-B1 Highly stable resin, hardenable resin composition, production method therefor, color filter and liquid crystal panel DAI NIPPON PRINTING CO., LTD. (JP) 2009-06-23 US disclosed
US-7537810-B2 Curable resin composition, photosensitive pattern-forming curable resin composition, color filter, substrate for liquid crystalline panel, and liquid crystalline panel DAI NIPPON PRINTING CO., LTD. (JP) 2009-05-26 US disclosed
US-6582862-B1 Curable resin comprising polymer having main chain comprising constitutional unit having acid group and one having hydroxyl group, wherein isocyanate compound containing radical polymerizable group is bonded with acid and/or hydroxy groups DAI NIPPON PRINTING CO., LTD. (JP) 2003-06-24 US disclosed
EP-1141063-A1 HIGH PHOTO-SENSITIVITY CURABLE RESIN, PHOTO-CURABLE RESIN COMPOSITION, PRODUCTION METHOD THEREOF, COLOR FILTER AND LIQUID CRYSTAL DISPLAY PANEL DAI NIPPON PRINTING CO., LTD. (JP) 2001-10-10 EP disclosed
WO-2001027182-A1 HIGH PHOTO-SENSITIVITY CURABLE RESIN, PHOTO-CURABLE RESIN COMPOSITION, PRODUCTION METHOD THEREOF, COLOR FILTER AND LIQUID CRYSTAL DISPLAY PANEL DAI NIPPON PRINTING CO., LTD. (JP) 2001-04-19 WO disclosed
EP-1076070-A2 Highly stable resin, hardenable resin composition, production method therefor, color filter and liquid crystal panel DAI NIPPON PRINTING CO., LTD. (JP) 2001-02-14 EP disclosed
US-4985470-A Three component photoinitiator system, printing plates, photoresists, inks, paints, adhesives MITSUBISHI KASEI CORPORATION (JP) 1991-01-15 US disclosed
EP-0107792-B1 PHOTOPOLYMERIZABLE COMPOSITIONS MITSUBISHI KASEI CORPORATION (JP) 1985-12-27 EP disclosed
JP-S6019145-A COMPOSITE TYPE ELECTROPHOTOGRAPHIC SENSITIVE BODY HITACHI LTD 1985-01-31 JP disclosed
US-4477547-A POLYAMIDE BINDER MITSUBISHI PAPER MILLS, LTD. (JP) 1984-10-16 US disclosed
EP-0107792-A1 Photopolymerizable compositions MITSUBISHI KASEI CORPORATION (JP) 1984-05-09 EP disclosed
US-4346157-A CHARGE GENERATING AND CHARGE TRANSPORT LAYERS HITACHI, LTD. (JP) 1982-08-24 US disclosed