SCHEMBL476617

SCHEMBL476617

CN(C)c1ccc(C=Cc2nc3ccccc3o2)cc1

nearest known ligand 0.59

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 4/20 0.59
RAB9A P51151 4/20 0.59
KMT2A Q03164 4/20 0.59
NPC1 O15118 2/20 0.59
GAA P10253 1/20 0.56
CASP3 P42574 1/20 0.56
SENP8 Q96LD8 1/20 0.56
SENP6 Q9GZR1 1/20 0.56
APP P05067 2/20 0.56
ATP4A P20648 13/20 0.55
ATP4B P51164 13/20 0.55
MAPT P10636 2/20 0.54
SNCA P37840 1/20 0.54
KDM4E B2RXH2 1/20 0.54
MAPK1 P28482 1/20 0.54
RXFP1 Q9HBX9 1/20 0.54
L3MBTL1 Q9Y468 1/20 0.54
RELA Q04206 1/20 0.53
INSR P06213 1/20 0.51
NCOA1 Q15788 1/20 0.51

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29397958 1.00 MEN1 (0.59) MEN1RAB9AKMT2ANPC1GAA
SCHEMBL476616 1.00 MEN1 (0.59) MEN1RAB9AKMT2ANPC1GAA
SCHEMBL11136666 0.85 INSR (0.51) MEN1RAB9AKMT2ANPC1APP
SCHEMBL11136663 0.85 INSR (0.51) MEN1RAB9AKMT2ANPC1APP
SCHEMBL31252954 0.85 ATP4A (0.61) MEN1RAB9AKMT2ANPC1ATP4A
SCHEMBL2494947 0.85 ATP4A (0.61) MEN1RAB9AKMT2ANPC1ATP4A
SCHEMBL29521633 0.85 ATP4A (0.61) MEN1RAB9AKMT2ANPC1ATP4A
SCHEMBL2494945 0.85 ATP4A (0.61) MEN1RAB9AKMT2ANPC1ATP4A
Hydrochloric Acid SCHEMBL6491469 0.83 ATP4A (0.61) MEN1RAB9AKMT2ANPC1ATP4A
SCHEMBL708951 0.83 NPC1 (0.63) MEN1RAB9AKMT2ANPC1ATP4A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 740 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111522200-B Negative PSPI resin for 12-inch silicon wafer and preparation method and application thereof 中国科学院化学研究所 2021-07-27 CN claimed
CN-111522200-A Negative PSPI resin for 12-inch silicon wafer and preparation method and application thereof 中国科学院化学研究所 2020-08-11 CN claimed
CN-104685416-B Photosensitive polymer combination, using its cured film preparation method, cured film, liquid crystal display device and organic EL display device 富士胶片株式会社 2019-05-14 CN claimed
US-4985470-A Three component photoinitiator system, printing plates, photoresists, inks, paints, adhesives MITSUBISHI KASEI CORPORATION (JP) 1991-01-15 US claimed
JP-3086760-A None JP disclosed
WO-2026100338-A1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN 旭化成株式会社 2026-05-15 WO disclosed
WO-2026100508-A1 RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND RESIN 富士フイルム株式会社 2026-05-15 WO disclosed
US-12613465-B2 Photosensitive resin composition and method for producing cured relief pattern ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-28 US disclosed
US-20260104641-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-04-16 US disclosed
US-20260099093-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-09 US disclosed
US-12559468-B2 Method for producing organic compound DAIKIN INDUSTRIES, LTD. (JP) 2026-02-24 US disclosed
US-20260036904-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-02-05 US disclosed
EP-0532798-A1 An electroluminescent element ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1993-03-24 EP disclosed
EP-0475086-A1 Photo-sensitive polymer composition HITACHI, LTD. (JP) 1992-03-18 EP disclosed
EP-0430220-A2 Photosensitive resin composition and semiconductor apparatus using it SUMITOMO BAKELITE COMPANY LIMITED (JP) 1991-06-05 EP disclosed
EP-0430221-A2 Photosensitive resin composition SUMITOMO BAKELITE COMPANY LIMITED (JP) 1991-06-05 EP disclosed
JP-H0386760-A PHOTOSENSITIVE RESIN COMPOSITION SUMITOMO BAKELITE CO LTD 1991-04-11 JP disclosed
US-4985470-A Three component photoinitiator system, printing plates, photoresists, inks, paints, adhesives MITSUBISHI KASEI CORPORATION (JP) 1991-01-15 US disclosed
EP-0107792-B1 PHOTOPOLYMERIZABLE COMPOSITIONS MITSUBISHI KASEI CORPORATION (JP) 1985-12-27 EP disclosed
EP-0107792-A1 Photopolymerizable compositions MITSUBISHI KASEI CORPORATION (JP) 1984-05-09 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (5 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12613465-B2 Photosensitive resin composition and method for producing cured relief pattern ARCN1, GLRA1, PSMA1 MEN1 3372/4885RAB9A 2463/4885KMT2A 483/4885
US-20260104641-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT ARCN1, PRDM9, LBR MEN1 4037/4885RAB9A 576/4885KMT2A 668/4885
US-20260099093-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME CD79B, ITGA1, PTK2 MEN1 2775/4885RAB9A 797/4885KMT2A 373/4885
US-20260036904-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE RER1, ASIC1, FRG1 MEN1 2602/4885RAB9A 2300/4885KMT2A 805/4885
US-12559468-B2 Method for producing organic compound FOXM1, FOXO3, FOXO1 MEN1 693/4885RAB9A 1260/4885KMT2A 3164/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.