Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MEN1 | O00255 | 4/20 | 0.59 |
| ▸ | RAB9A | P51151 | 4/20 | 0.59 |
| ▸ | KMT2A | Q03164 | 4/20 | 0.59 |
| ▸ | NPC1 | O15118 | 2/20 | 0.59 |
| ▸ | GAA | P10253 | 1/20 | 0.56 |
| ▸ | CASP3 | P42574 | 1/20 | 0.56 |
| ▸ | SENP8 | Q96LD8 | 1/20 | 0.56 |
| ▸ | SENP6 | Q9GZR1 | 1/20 | 0.56 |
| ▸ | APP | P05067 | 2/20 | 0.56 |
| ▸ | ATP4A | P20648 | 13/20 | 0.55 |
| ▸ | ATP4B | P51164 | 13/20 | 0.55 |
| ▸ | MAPT | P10636 | 2/20 | 0.54 |
| ▸ | SNCA | P37840 | 1/20 | 0.54 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.54 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.54 |
| ▸ | RXFP1 | Q9HBX9 | 1/20 | 0.54 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.54 |
| ▸ | RELA | Q04206 | 1/20 | 0.53 |
| ▸ | INSR | P06213 | 1/20 | 0.51 |
| ▸ | NCOA1 | Q15788 | 1/20 | 0.51 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL476617 | 1.00 | MEN1 (0.59) | MEN1RAB9AKMT2ANPC1GAA | |
| SCHEMBL29397958 | 1.00 | MEN1 (0.59) | MEN1RAB9AKMT2ANPC1GAA | |
| SCHEMBL11136666 | 0.85 | INSR (0.51) | MEN1RAB9AKMT2ANPC1APP | |
| SCHEMBL11136663 | 0.85 | INSR (0.51) | MEN1RAB9AKMT2ANPC1APP | |
| SCHEMBL31252954 | 0.85 | ATP4A (0.61) | MEN1RAB9AKMT2ANPC1ATP4A | |
| SCHEMBL2494947 | 0.85 | ATP4A (0.61) | MEN1RAB9AKMT2ANPC1ATP4A | |
| SCHEMBL29521633 | 0.85 | ATP4A (0.61) | MEN1RAB9AKMT2ANPC1ATP4A | |
| SCHEMBL2494945 | 0.85 | ATP4A (0.61) | MEN1RAB9AKMT2ANPC1ATP4A | |
| Hydrochloric Acid SCHEMBL6491469 | 0.83 | ATP4A (0.61) | MEN1RAB9AKMT2ANPC1ATP4A | |
| SCHEMBL708951 | 0.83 | NPC1 (0.63) | MEN1RAB9AKMT2ANPC1ATP4A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 444 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-111522200-B | Negative PSPI resin for 12-inch silicon wafer and preparation method and application thereof | 中国科学院化学研究所 | 2021-07-27 | — | — | CN | claimed |
| CN-111522200-A | Negative PSPI resin for 12-inch silicon wafer and preparation method and application thereof | 中国科学院化学研究所 | 2020-08-11 | — | — | CN | claimed |
| US-4985470-A | Three component photoinitiator system, printing plates, photoresists, inks, paints, adhesives | MITSUBISHI KASEI CORPORATION (JP) | 1991-01-15 | — | — | US | claimed |
| JP-3086760-A | — | — | None | — | — | JP | disclosed |
| WO-2026100508-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND RESIN | 富士フイルム株式会社 | 2026-05-15 | — | — | WO | disclosed |
| WO-2026100338-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN | 旭化成株式会社 | 2026-05-15 | — | — | WO | disclosed |
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-28 | — | — | US | disclosed |
| US-20260099093-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-09 | — | — | US | disclosed |
| US-20260036904-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-02-05 | — | — | US | disclosed |
| US-20260003274-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORP (JP) | 2026-01-01 | — | — | US | disclosed |
| US-20260003276-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2026-01-01 | — | — | US | disclosed |
| US-5238784-A | PHOTOSENSITIVE RESIN COMPOSITION WITH POLYAMIC ACID POLYMER | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1993-08-24 | — | — | US | disclosed |
| EP-0532798-A1 | An electroluminescent element | ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) | 1993-03-24 | — | — | EP | disclosed |
| EP-0475086-A1 | Photo-sensitive polymer composition | HITACHI, LTD. (JP) | 1992-03-18 | — | — | EP | disclosed |
| EP-0430220-A2 | Photosensitive resin composition and semiconductor apparatus using it | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1991-06-05 | — | — | EP | disclosed |
| EP-0430221-A2 | Photosensitive resin composition | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1991-06-05 | — | — | EP | disclosed |
| JP-H0386760-A | PHOTOSENSITIVE RESIN COMPOSITION | SUMITOMO BAKELITE CO LTD | 1991-04-11 | — | — | JP | disclosed |
| US-4985470-A | Three component photoinitiator system, printing plates, photoresists, inks, paints, adhesives | MITSUBISHI KASEI CORPORATION (JP) | 1991-01-15 | — | — | US | disclosed |
| EP-0107792-B1 | PHOTOPOLYMERIZABLE COMPOSITIONS | MITSUBISHI KASEI CORPORATION (JP) | 1985-12-27 | — | — | EP | disclosed |
| EP-0107792-A1 | Photopolymerizable compositions | MITSUBISHI KASEI CORPORATION (JP) | 1984-05-09 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (5 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ARCN1, GLRA1, PSMA1 | MEN1 3372/4885RAB9A 2463/4885KMT2A 483/4885 |
| US-20260099093-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | CD79B, ITGA1, PTK2 | MEN1 2775/4885RAB9A 797/4885KMT2A 373/4885 |
| US-20260003274-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | SEM1, ASIC1, SMARCB1 | MEN1 1997/4885RAB9A 3500/4885KMT2A 887/4885 |
| US-20260036904-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE | RER1, ASIC1, FRG1 | MEN1 2602/4885RAB9A 2300/4885KMT2A 805/4885 |
| US-20260003276-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | RER1, SEM1, RAD51 | MEN1 1805/4885RAB9A 2161/4885KMT2A 517/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.