SCHEMBL2509239

SCHEMBL2509239

CC(c1ccc(Oc2ccc(N)cc2)c(Cl)c1)c1ccc(Oc2ccc(N)cc2)c(Cl)c1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PDE7A Q13946 2/20 0.56
FFAR1 O14842 2/20 0.47
MAOA P21397 1/20 0.43
MAOB P27338 1/20 0.43
NPBWR1 P48145 1/20 0.41
MCHR1 Q99705 1/20 0.41
ALDH1A1 P00352 6/20 0.41
TDP1 Q9NUW8 2/20 0.41
CYP3A4 P08684 1/20 0.41
TSHR P16473 1/20 0.41
SMN1; SMN2 Q16637 3/20 0.41
HTR2A P28223 1/20 0.40
SLC6A4 P31645 1/20 0.40
MAPT P10636 4/20 0.40
MEN1 O00255 3/20 0.40
KMT2A Q03164 3/20 0.40
KDM4E B2RXH2 1/20 0.40
CYP1A2 P05177 1/20 0.40
CYP2D6 P10635 1/20 0.40
CYP2C9 P11712 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22069710 0.89 PDE7A (0.54) PDE7AFFAR1MAOAMAOBNPBWR1
SCHEMBL22452604 0.87 PDE7A (0.52) PDE7AFFAR1MAOAMAOBNPBWR1
SCHEMBL9180757 0.85 PDE7A (0.46) PDE7AFFAR1MAOAMAOBNPBWR1
SCHEMBL2515877 0.82 ALDH1A1 (0.46) PDE7AFFAR1MAOAALDH1A1TDP1
SCHEMBL10589944 0.81 PDE7A (0.45) PDE7AFFAR1ALDH1A1CYP3A4SMN1; SMN2
SCHEMBL8904604 0.81 PDE7A (0.59) PDE7AMAOAMAOBALDH1A1TDP1
SCHEMBL4318630 0.81 PDE7A (0.63) PDE7AMAOAMAOBALDH1A1TDP1
SCHEMBL7611680 0.81 MAPT (0.43) PDE7AFFAR1MAOAMAOBALDH1A1
SCHEMBL8151816 0.81 SMN1; SMN2 (0.44) PDE7AALDH1A1TDP1CYP3A4TSHR
SCHEMBL8153814 0.81 P2RX3 (0.41) PDE7AMAOANPBWR1MCHR1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 97 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4435560-A HEAT RESISTANT, GOOD PROCESSABILITY HITACHI, LTD. (JP) 1984-03-06 US claimed
EP-2662378-B1 IMIDE COMPOUND, METHOD FOR PRODUCING SAME, THICKENING AGENT FOR GREASE, AND GREASE COMPOSITION JX NIPPON OIL & ENERGY CORP (JP) 2018-10-10 EP disclosed
US-9487726-B2 Imide compound, method for producing same, thickening agent for grease, and grease composition JX NIPPON OIL & ENERGY CORPORATION (JP) 2016-11-08 US disclosed
US-20130345102-A1 IMIDE COMPOUND, METHOD FOR PRODUCING SAME, THICKENING AGENT FOR GREASE, AND GREASE COMPOSITION JX NIPPON OIL & ENERGY CORPORATION (JP) 2013-12-26 US disclosed
EP-2662378-A1 IMIDE COMPOUND, METHOD FOR PRODUCING SAME, THICKENING AGENT FOR GREASE, AND GREASE COMPOSITION JX Nippon Oil & Energy Corporation (JP) 2013-11-13 EP disclosed
US-8034893-B2 Resin resolution composition, polyimide resin, and semiconductor device SHIN-ETSU CHEMICAL CO., LTD. (JP) 2011-10-11 US disclosed
US-20100285292-A1 Aromatic Polyimide Film and Process for the Production Thereof TEIJIN LIMITED (JP) 2010-11-11 US disclosed
US-7820742-B2 Adhesive exhibiting maximum melt viscosity of 10,000 Pa s at 40 to 80 degrees C SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-10-26 US disclosed
US-7714080-B2 comprising alkoxysilyl-containing polyamide-imide resin, epoxy resin, curing promoter, and organic solvent; forms cured coating having heat resistance and water resistance through brief low-temperature heating and helps bonding of epoxy resin molding compound to semiconductor SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-05-11 US disclosed
US-7683152-B2 Partial block polyimide-polysiloxane copolymer, making method, and resin composition comprising the copolymer SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-03-23 US disclosed
US-4954612-A ORIENTATION CONTROL FOR LIQUID CRYSTAL DISPLAY HITACHI CHEMICAL CO., LTD. (JP) 1990-09-04 US disclosed
EP-0336536-A2 Organic-solvent soluble polyimide and production thereof Hitachi Chemical Co., Ltd. (JP) 1989-10-11 EP disclosed
US-4791157-A REACTING TRIMELLITIC ACID WITH AROMATIC DIAMINE WITH ETHER GROUPS HITACHI CHEMICAL CO. (JP) 1988-12-13 US disclosed
US-4758875-A Resin encapsulated semiconductor device HITACHI, LTD. (JP) 1988-07-19 US disclosed
EP-0032745-B1 ETHER IMIDES AND PROCESS FOR PRODUCING THE SAME Hitachi, Ltd. (JP) 1987-01-07 EP disclosed
EP-0047530-B1 MALEIMIDE RESIN COMPOSITION AND PROCESS FOR ITS PRODUCTION Hitachi, Ltd. (JP) 1986-12-10 EP disclosed
US-4460783-A AMIDATION, CYCLIZATION, DEHYDRATION HITACHI, LTD. (JP) 1984-07-17 US disclosed
US-4435560-A HEAT RESISTANT, GOOD PROCESSABILITY HITACHI, LTD. (JP) 1984-03-06 US disclosed
EP-0047530-A2 Maleimide resin composition and process for its production Hitachi, Ltd. (JP) 1982-03-17 EP disclosed
EP-0032745-A2 Ether imides and process for producing the same Hitachi, Ltd. (JP) 1981-07-29 EP disclosed