Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SLC6A4 | P31645 | 1/20 | 0.41 |
| ▸ | OPRM1 | P35372 | 1/20 | 0.41 |
| ▸ | KDR | P35968 | 1/20 | 0.41 |
| ▸ | SLC6A3 | Q01959 | 1/20 | 0.41 |
| ▸ | PTPN5 | P54829 | 3/20 | 0.37 |
| ▸ | PTPN2 | P17706 | 1/20 | 0.37 |
| ▸ | OPRD1 | P41143 | 1/20 | 0.36 |
| ▸ | OPRK1 | P41145 | 1/20 | 0.36 |
| ▸ | FEN1 | P39748 | 1/20 | 0.35 |
| ▸ | POLB | P06746 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29484419 | 1.00 | SLC6A4 (0.41) | SLC6A4OPRM1KDRSLC6A3PTPN5 | |
| SCHEMBL2513124 | 0.85 | FEN1 (0.36) | PTPN5PTPN2FEN1 | |
| SCHEMBL29484429 | 0.85 | FEN1 (0.36) | PTPN5PTPN2FEN1 | |
| SCHEMBL9135944 | 0.85 | FEN1 (0.41) | PTPN5PTPN2FEN1 | |
| SCHEMBL30103811 | 0.82 | SLC6A4 (0.40) | SLC6A4OPRM1KDRSLC6A3OPRD1 | |
| SCHEMBL28899040 | 0.82 | SLC6A4 (0.40) | SLC6A4OPRM1KDRSLC6A3OPRD1 | |
| SCHEMBL9137406 | 0.81 | SLC6A4 (0.40) | SLC6A4OPRM1KDRSLC6A3OPRD1 | |
| SCHEMBL29376176 | 0.81 | NUDT1 (0.44) | SLC6A4OPRM1KDRSLC6A3OPRD1 | |
| SCHEMBL30899189 | 0.81 | NUDT1 (0.44) | SLC6A4OPRM1KDRSLC6A3OPRD1 | |
| SCHEMBL761321 | 0.81 | NUDT1 (0.44) | SLC6A4OPRM1KDRSLC6A3OPRD1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 108 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240270891-A1 | PHENOLIC HYDROXY GROUP-CONTAINING RESIN, RESIN COMPOSITION FOR ALKALINE DEVELOPABLE RESIST, RESIST CURABLE RESIN COMPOSITION, AND METHOD FOR PRODUCING PHENOLIC HYDROXY GROUP-CONTAINING RESIN | DIC CORPORATION (JP) | 2024-08-15 | — | — | US | disclosed |
| CN-118325004-A | Phenolic hydroxyl group-containing resin, photosensitive resin composition, curable composition, and resist film | DIC株式会社 | 2024-07-12 | — | — | CN | disclosed |
| CN-114902135-B | Positive photosensitive resin composition, cured film, and resist film | DIC株式会社 | 2024-07-02 | — | — | CN | disclosed |
| CN-113348188-B | Phenolic hydroxyl group-containing resin, photosensitive composition, resist film, curable composition, and cured product | DIC株式会社 | 2024-05-10 | — | — | CN | disclosed |
| CN-117321109-A | Phenolic hydroxyl group-containing resin | DIC株式会社 | 2023-12-29 | — | — | CN | disclosed |
| CN-113227181-B | Resist composition | DIC株式会社 | 2023-07-18 | — | — | CN | disclosed |
| CN-116430671-A | Photoresist composition and photoetching process | 上海飞凯材料科技股份有限公司 | 2023-07-14 | — | — | CN | disclosed |
| CN-110959138-B | Resist material | DIC株式会社 | 2023-06-30 | — | — | CN | disclosed |
| CN-116209690-A | Phenolic hydroxyl group-containing resin, resin composition for alkali-developable resist, resist-curable resin composition, and method for producing phenolic hydroxyl group-containing resin | DIC株式会社 | 2023-06-02 | — | — | CN | disclosed |
| CN-116023607-A | Phenolic hydroxyl group-containing resin | DIC株式会社 | 2023-04-28 | — | — | CN | disclosed |
| US-20060177764-A1 | Positive-tone photosensitivity resin composition | EVERLIGHT USA, INC. (US) | 2006-08-10 | — | — | US | disclosed |
| EP-1469353-A1 | TWO-LAYER FILM AND METHOD OF FORMING PATTERN WITH THE SAME | JSR Corporation (JP) | 2004-10-20 | — | — | EP | disclosed |
| US-20040131963-A1 | Two-layer film and method of forming pattern with the same | JSR CORPORATION (JP) | 2004-07-08 | — | — | US | disclosed |
| US-6641972-B2 | Mixture of alakli solubile phenolic resin, another resin and quinonediazido compound | TOKYO OHKA KOGYO CO., LTD. (JP) | 2003-11-04 | — | — | US | disclosed |
| US-20030059706-A1 | Positive photoresist composition for the formation of thick films, photoresist film and method of forming bumps using the same | TOKYO OHKA KOGYO CO., LTD. | 2003-03-27 | — | — | US | disclosed |
| EP-0855620-B1 | Positive photoresist composition | JSR CORP (JP) | 2002-09-11 | — | — | EP | disclosed |
| US-5942369-A | ALKALI-SOLUBLE NOVOLAK RESIN; ALKALI SOLUBLE ACRYLIC RESIN OF RADICAL-POLYMERIZABLE UNITS CONTAINING A: HYDROXYL GROUP, CARBOXYL GROUP, OR PHENOLIC HYDROXYL GROUP; QUINONEDIAZIDE AND SOLVENT; THICK FILMS AS BUMP FORMING MATERIALS | JSR CORPORATION (JP) | 1999-08-24 | — | — | US | disclosed |
| EP-0855620-A1 | Positive photoresist composition | JSR Corporation (JP) | 1998-07-29 | — | — | EP | disclosed |
| US-5677102-A | DISSOLVING AN ALKALI SOLUBLE RESIN AND A QUINONEDIAZIDE GROUP CONTAINING COMPOUND; HEATING | TOKYO OHKA KOGYO CO., LTD. (JP) | 1997-10-14 | — | — | US | disclosed |
| US-5604077-A | MIXTURE OF ALKALI-SOLUBLE NOVOLAK AND A QUINONE DIAZIDE PHOTOSENSITIZER; HEAT RESISTANCE, RESOLUTION, ANTIFOULING AGENTS | TOKYO OHKA KOGYO CO., LTD. (JP) | 1997-02-18 | — | — | US | disclosed |