Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | FEN1 | P39748 | 3/20 | 0.36 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.36 |
| ▸ | GAA | P10253 | 1/20 | 0.36 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.36 |
| ▸ | PTPN5 | P54829 | 4/20 | 0.36 |
| ▸ | PTPN2 | P17706 | 1/20 | 0.36 |
| ▸ | PTGDR2 | Q9Y5Y4 | 1/20 | 0.33 |
| ▸ | MIF | P14174 | 1/20 | 0.33 |
| ▸ | ESR2 | Q92731 | 3/20 | 0.32 |
| ▸ | ALOX5AP | P20292 | 2/20 | 0.32 |
| ▸ | ESR1 | P03372 | 2/20 | 0.32 |
| ▸ | DEGS1 | O15121 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2513124 | 1.00 | FEN1 (0.36) | FEN1KMT2AALDH1A1GAATDP1 | |
| SCHEMBL9135944 | 0.87 | FEN1 (0.41) | FEN1KMT2APTPN5PTPN2PTGDR2 | |
| SCHEMBL2512539 | 0.85 | SLC6A4 (0.41) | FEN1PTPN5PTPN2 | |
| SCHEMBL29484419 | 0.85 | SLC6A4 (0.41) | FEN1PTPN5PTPN2 | |
| SCHEMBL2514437 | 0.80 | PTPN5 (0.39) | FEN1KMT2APTPN5PTPN2PTGDR2 | |
| SCHEMBL29484423 | 0.80 | PTPN5 (0.39) | FEN1KMT2APTPN5PTPN2PTGDR2 | |
| SCHEMBL15253060 | 0.79 | FEN1 (0.40) | FEN1KMT2APTPN5PTPN2PTGDR2 | |
| SCHEMBL17222749 | 0.78 | SLC6A4 (0.31) | — | |
| SCHEMBL17222748 | 0.78 | SLC6A4 (0.31) | — | |
| SCHEMBL4960398 | 0.76 | PTPN5 (0.46) | FEN1KMT2APTPN5PTPN2PTGDR2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119575759-A | Positive photosensitive resin composition, photosensitive film, resist underlayer film, resist permanent film, and method for producing film | DIC株式会社 | 2025-03-07 | — | — | CN | disclosed |
| CN-118672058-A | Photosensitive resin composition, resist film, resist underlayer film, and resist permanent film | DIC株式会社 | 2024-09-20 | — | — | CN | disclosed |
| CN-118325004-A | Phenolic hydroxyl group-containing resin, photosensitive resin composition, curable composition, and resist film | DIC株式会社 | 2024-07-12 | — | — | CN | disclosed |
| CN-114902135-B | Positive photosensitive resin composition, cured film, and resist film | DIC株式会社 | 2024-07-02 | — | — | CN | disclosed |
| CN-113348188-B | Phenolic hydroxyl group-containing resin, photosensitive composition, resist film, curable composition, and cured product | DIC株式会社 | 2024-05-10 | — | — | CN | disclosed |
| CN-117321109-A | Phenolic hydroxyl group-containing resin | DIC株式会社 | 2023-12-29 | — | — | CN | disclosed |
| CN-113227181-B | Resist composition | DIC株式会社 | 2023-07-18 | — | — | CN | disclosed |
| CN-116430671-A | Photoresist composition and photoetching process | 上海飞凯材料科技股份有限公司 | 2023-07-14 | — | — | CN | disclosed |
| CN-110959138-B | Resist material | DIC株式会社 | 2023-06-30 | — | — | CN | disclosed |
| CN-116209690-A | Phenolic hydroxyl group-containing resin, resin composition for alkali-developable resist, resist-curable resin composition, and method for producing phenolic hydroxyl group-containing resin | DIC株式会社 | 2023-06-02 | — | — | CN | disclosed |
| CN-116023607-A | Phenolic hydroxyl group-containing resin | DIC株式会社 | 2023-04-28 | — | — | CN | disclosed |
| CN-115873214-A | Epoxy resin, photosensitive resin composition, resist film, curable composition, and cured film | DIC株式会社 | 2023-03-31 | — | — | CN | disclosed |
| CN-107703717-B | Positive photosensitive resin composition, method for producing metal wiring, and laminate | 东京应化工业株式会社 | 2023-01-24 | — | — | CN | disclosed |
| CN-114902135-A | Positive photosensitive resin composition, cured film and resist film | DIC株式会社 | 2022-08-12 | — | — | CN | disclosed |
| CN-114326300-A | Positive photoresist composition, preparation method and photoresist pattern forming method | 上海飞凯材料科技股份有限公司 | 2022-04-12 | — | — | CN | disclosed |
| WO-2022065041-A1 | RESIN CONTAINING PHENOLIC HYDROXYL GROUP, RESIN COMPOSITION FOR ALKALI-DEVELOPABLE RESISTS, RESIST CURABLE RESIN COMPOSITION, AND METHOD FOR PRODUCING RESIN CONTAINING PHENOLIC HYDROXYL GROUP | DIC株式会社 | 2022-03-31 | — | — | WO | disclosed |
| WO-2022059448-A1 | METHOD FOR PRODUCING RESIST PATTERN, RESIST PATTERN AND POSITIVE PHOTOSENSITIVE RESIN COMPOSITION FOR PRODUCTION OF TRANSPARENT MULTILAYER MEMBER | DIC株式会社 | 2022-03-24 | — | — | WO | disclosed |
| CN-107703685-B | Laminate and method for producing laminate | 东京应化工业株式会社 | 2022-03-18 | — | — | CN | disclosed |