SCHEMBL2513124

SCHEMBL2513124

Oc1ccc(C(c2cccc(C3CCCCC3)c2O)c2cccc(C3CCCCC3)c2O)cc1

nearest known ligand 0.36

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
▸ FEN1 P39748 3/20 0.36
▸ KMT2A Q03164 2/20 0.36
▸ ALDH1A1 P00352 1/20 0.36
▸ GAA P10253 1/20 0.36
▸ TDP1 Q9NUW8 1/20 0.36
▸ PTPN5 P54829 4/20 0.36
▸ PTPN2 P17706 1/20 0.36
▸ PTGDR2 Q9Y5Y4 1/20 0.33
▸ MIF P14174 1/20 0.33
▸ ESR2 Q92731 3/20 0.32
▸ ALOX5AP P20292 2/20 0.32
▸ ESR1 P03372 2/20 0.32
▸ DEGS1 O15121 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29484429 1.00 FEN1 (0.36) FEN1KMT2AALDH1A1GAATDP1
SCHEMBL9135944 0.87 FEN1 (0.41) FEN1KMT2APTPN5PTPN2PTGDR2
SCHEMBL2512539 0.85 SLC6A4 (0.41) FEN1PTPN5PTPN2
SCHEMBL29484419 0.85 SLC6A4 (0.41) FEN1PTPN5PTPN2
SCHEMBL2514437 0.80 PTPN5 (0.39) FEN1KMT2APTPN5PTPN2PTGDR2
SCHEMBL29484423 0.80 PTPN5 (0.39) FEN1KMT2APTPN5PTPN2PTGDR2
SCHEMBL15253060 0.79 FEN1 (0.40) FEN1KMT2APTPN5PTPN2PTGDR2
SCHEMBL17222749 0.78 SLC6A4 (0.31) —
SCHEMBL17222748 0.78 SLC6A4 (0.31) —
SCHEMBL4960398 0.76 PTPN5 (0.46) FEN1KMT2APTPN5PTPN2PTGDR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 97 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240270891-A1 PHENOLIC HYDROXY GROUP-CONTAINING RESIN, RESIN COMPOSITION FOR ALKALINE DEVELOPABLE RESIST, RESIST CURABLE RESIN COMPOSITION, AND METHOD FOR PRODUCING PHENOLIC HYDROXY GROUP-CONTAINING RESIN DIC CORPORATION (JP) 2024-08-15 — — US disclosed
CN-118325004-A Phenolic hydroxyl group-containing resin, photosensitive resin composition, curable composition, and resist film DIC株式会社 2024-07-12 — — CN disclosed
CN-114902135-B Positive photosensitive resin composition, cured film, and resist film DIC株式会社 2024-07-02 — — CN disclosed
CN-113348188-B Phenolic hydroxyl group-containing resin, photosensitive composition, resist film, curable composition, and cured product DIC株式会社 2024-05-10 — — CN disclosed
CN-117321109-A Phenolic hydroxyl group-containing resin DIC株式会社 2023-12-29 — — CN disclosed
CN-113227181-B Resist composition DIC株式会社 2023-07-18 — — CN disclosed
CN-116430671-A Photoresist composition and photoetching process 上海飞凯材料科技股份有限公司 2023-07-14 — — CN disclosed
CN-110959138-B Resist material DIC株式会社 2023-06-30 — — CN disclosed
CN-116209690-A Phenolic hydroxyl group-containing resin, resin composition for alkali-developable resist, resist-curable resin composition, and method for producing phenolic hydroxyl group-containing resin DIC株式会社 2023-06-02 — — CN disclosed
CN-116023607-A Phenolic hydroxyl group-containing resin DIC株式会社 2023-04-28 — — CN disclosed
US-20060177764-A1 Positive-tone photosensitivity resin composition EVERLIGHT USA, INC. (US) 2006-08-10 — — US disclosed
EP-1469353-A1 TWO-LAYER FILM AND METHOD OF FORMING PATTERN WITH THE SAME JSR Corporation (JP) 2004-10-20 — — EP disclosed
US-20040131963-A1 Two-layer film and method of forming pattern with the same JSR CORPORATION (JP) 2004-07-08 — — US disclosed
US-6641972-B2 Mixture of alakli solubile phenolic resin, another resin and quinonediazido compound TOKYO OHKA KOGYO CO., LTD. (JP) 2003-11-04 — — US disclosed
US-20030059706-A1 Positive photoresist composition for the formation of thick films, photoresist film and method of forming bumps using the same TOKYO OHKA KOGYO CO., LTD. 2003-03-27 — — US disclosed
EP-0855620-B1 Positive photoresist composition JSR CORP (JP) 2002-09-11 — — EP disclosed
US-5942369-A ALKALI-SOLUBLE NOVOLAK RESIN; ALKALI SOLUBLE ACRYLIC RESIN OF RADICAL-POLYMERIZABLE UNITS CONTAINING A: HYDROXYL GROUP, CARBOXYL GROUP, OR PHENOLIC HYDROXYL GROUP; QUINONEDIAZIDE AND SOLVENT; THICK FILMS AS BUMP FORMING MATERIALS JSR CORPORATION (JP) 1999-08-24 — — US disclosed
EP-0855620-A1 Positive photoresist composition JSR Corporation (JP) 1998-07-29 — — EP disclosed
US-5677102-A DISSOLVING AN ALKALI SOLUBLE RESIN AND A QUINONEDIAZIDE GROUP CONTAINING COMPOUND; HEATING TOKYO OHKA KOGYO CO., LTD. (JP) 1997-10-14 — — US disclosed
US-5604077-A MIXTURE OF ALKALI-SOLUBLE NOVOLAK AND A QUINONE DIAZIDE PHOTOSENSITIZER; HEAT RESISTANCE, RESOLUTION, ANTIFOULING AGENTS TOKYO OHKA KOGYO CO., LTD. (JP) 1997-02-18 — — US disclosed
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