SCHEMBL2515949

SCHEMBL2515949

O=C(OC(=O)C1CC2CCC1C2)C1CC2CCC1C2

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
POLB P06746 1/20 0.52
L3MBTL1 Q9Y468 2/20 0.43
HSD11B1 P28845 1/20 0.42
HPGD P15428 3/20 0.40
KCNQ3 O43525 1/20 0.40
KCNQ2 O43526 1/20 0.40
KCNQ4 P56696 1/20 0.40
KCNQ5 Q9NR82 1/20 0.40
MEN1 O00255 2/20 0.39
HTT P42858 2/20 0.39
KMT2A Q03164 2/20 0.39
GAA P10253 1/20 0.39
THRB P10828 1/20 0.39
NPC1 O15118 2/20 0.38
RAB9A P51151 2/20 0.38
KDM4E B2RXH2 1/20 0.38
ATM Q13315 1/20 0.38
P2RX7 Q99572 1/20 0.37
HSD17B10 Q99714 1/20 0.37
ALDH1A1 P00352 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7647666 0.86 POLB (0.52) POLBL3MBTL1HSD11B1HPGDKCNQ3
SCHEMBL7647668 0.86 POLB (0.52) POLBL3MBTL1HSD11B1HPGDKCNQ3
SCHEMBL28051420 0.86 POLB (0.44) POLBL3MBTL1HSD11B1HPGDKCNQ3
SCHEMBL7593658 0.84 POLB (0.50) POLBL3MBTL1HSD11B1HPGDKCNQ3
SCHEMBL34462074 0.83 POLB (0.53) POLBL3MBTL1HSD11B1KCNQ3KCNQ2
SCHEMBL18628997 0.83 POLB (0.53) POLBL3MBTL1HSD11B1KCNQ3KCNQ2
SCHEMBL28611784 0.83 POLB (0.48) POLBL3MBTL1HSD11B1HPGDKCNQ3
SCHEMBL1105066 0.83 POLB (0.53) POLBL3MBTL1HSD11B1KCNQ3KCNQ2
SCHEMBL17518655 0.83 POLB (0.53) POLBL3MBTL1HSD11B1KCNQ3KCNQ2
SCHEMBL12481918 0.82 KDM4E (0.42) POLBL3MBTL1HPGDKCNQ3KCNQ2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-102372887-B Heat-curable resin composition for protective film LG CHEMICAL LTD 2015-01-21 CN claimed
CN-102372887-A Heat-curable resin composition for protective film LG CHEMICAL LTD 2012-03-14 CN claimed
CN-102372826-A Heat-curable resin composition for protective film LG CHEMICAL LTD 2012-03-14 CN claimed
CN-102372887-B Heat-curable resin composition for protective film LG CHEMICAL LTD 2015-01-21 CN disclosed
US-8592546-B2 Silicon-containing alicyclic polyimide resin, polyamic acid resin, and manufacturing method for same HITACHI CHEMICAL COMPANY, LTD. (JP) 2013-11-26 US disclosed
US-20130158225-A1 NOVEL SILICON-CONTAINING ALICYCLIC POLYIMIDE RESIN, POLYAMIC ACID RESIN, AND MANUFACTURING METHOD FOR SAME RESONAC CORPORATION (JP) 2013-06-20 US disclosed
CN-102372887-A Heat-curable resin composition for protective film LG CHEMICAL LTD 2012-03-14 CN disclosed
CN-102372826-A Heat-curable resin composition for protective film LG CHEMICAL LTD 2012-03-14 CN disclosed
US-20110251337-A1 BLENDS OF POLYARYLENE ETHERS AND POLYARYLENE SULFIDES COMPRISING CARBOXYLIC ANHYDRIDES BASF SE 2011-10-13 US disclosed
CN-101516949-A Polyurethane foam composition possessing modified silicone surfactants MOMENTIVE PERFORMANCE MAT INC (US) 2009-08-26 CN disclosed
CN-1190441-C Phosphine sulfide preparing process and use thereof MITSUI CHEMICALS INC (JP) 2005-02-23 CN disclosed
EP-0972776-B1 A phosphine sulfide, a manufacturing process therefor and a use thereof MITSUI CHEMICALS INC (JP) 2003-04-23 EP disclosed
US-6153794-A Phosphine sulfide, a manufacturing process therefor and use thereof MITSUI CHEMICALS, INC. (JP) 2000-11-28 US disclosed
CN-1262276-A Phosphine sulfide preparing process and use thereof MITSUI CHEMICALS INC (JP) 2000-08-09 CN disclosed
EP-0972776-A1 A phosphine sulfide, a manufacturing process therefor and a use thereof Mitsui Chemicals, Inc. (JP) 2000-01-19 EP disclosed
EP-0112845-B1 METHOD FOR MAKING SILYLNORBORNANE ANHYDRIDES GENERAL ELECTRIC COMPANY (US) 1989-07-12 EP disclosed