SCHEMBL252064

SCHEMBL252064

C=CC[Si]1(c2ccccc2)CCCCO1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2835242 0.78
SCHEMBL27903706 0.78
SCHEMBL29053180 0.77
SCHEMBL641834 0.77
SCHEMBL1635012 0.74
SCHEMBL11358785 0.74 LTA4H (0.30)
SCHEMBL8765569 0.73 HDAC3 (0.32)
SCHEMBL28247118 0.73 MAOA (0.31)
SCHEMBL28549618 0.73
SCHEMBL28861810 0.72 FAAH (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 119 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20150054425-A1 NANOCOMPOSITE COMPOSITIONS AND METHODS OF MAKING CREELED, INC. 2015-02-26 US claimed
US-8377553-B2 Constrained layer damper, and related methods MATERIAL SCIENCES CORPORATION (US) 2013-02-19 US claimed
US-20090145541-A1 CONSTRAINED LAYER DAMPER, AND RELATED METHODS MATERIAL SCIENCES CORPORATION 2009-06-11 US claimed
EP-0791190-B1 SIGNAGE ARTICLES AND METHODS OF MAKING SAME MINNESOTA MINING & MFG (US) 1999-09-29 EP claimed
EP-0107811-B1 COLD HARDENING POLYURETHANE-FORMING FOUNDRY AGGREGATE BINDER, ITS PREPARATION AND ITS USE Hüttenes-Albertus Chemische-Werke GmbH (DE) 1986-12-10 EP claimed
US-4507408-A NONHYDROLYZING, SILANE-MODIFIED PHENOLIC RESIN HUETTENES-ALBERTUS CHEMISCHE WERKE GMBH (DE) 1985-03-26 US claimed
CN-118019806-A Moisture curable composition 美国陶氏有机硅公司 2024-05-10 CN disclosed
US-20230272123-A1 PARAMYLON-BASED RESIN, MOLDING MATERIAL, MOLDED BODY, AND METHOD FOR PRODUCING PARAMYLON-BASED RESIN NEC CORPORATION (JP) 2023-08-31 US disclosed
US-11591410-B2 Cellulose derivative and resin composition for molding NEC CORPORATION (JP) 2023-02-28 US disclosed
US-11572416-B2 Cellulose resin, molding material, molded body, and method for producing cellulose resin NEC CORPORATION (JP) 2023-02-07 US disclosed
US-20220010169-A1 CURABLE COATING COMPOSITIONS, METHODS, AND ARTICLES 3M INNOVATIVE PROPERTIES COMPANY 2022-01-13 US disclosed
US-20210340282-A1 PARAMYLON-BASED RESIN, MOLDING MATERIAL, MOLDED BODY, AND METHOD FOR PRODUCING PARAMYLON-BASED RESIN NEC CORPORATION (JP) 2021-11-04 US disclosed
US-10982009-B2 Cellulose derivative and use thereof NEC CORPORATION (JP) 2021-04-20 US disclosed
US-5932157-A Sealable composite polypropylene film and processes for producing and using it HOECHST AKTIENGESELLSCHAFT (DE) 1999-08-03 US disclosed
US-5777055-A Resin-containing, biaxially oriented polypropylene film, process for the production thereof, and the use thereof HOECHST AKTIENGESELLSCHAFT (DE) 1998-07-07 US disclosed
EP-0591784-B1 Use of grafted polyorganosiloxane products for the finishing of leather BAYER AG (DE) 1997-08-13 EP disclosed
EP-0591784-A2 Use of grafted polyorganosiloxane products for the finishing of leather BAYER AG (DE) 1994-04-13 EP disclosed
US-4507408-A NONHYDROLYZING, SILANE-MODIFIED PHENOLIC RESIN HUETTENES-ALBERTUS CHEMISCHE WERKE GMBH (DE) 1985-03-26 US disclosed
US-4507408-A NONHYDROLYZING, SILANE-MODIFIED PHENOLIC RESIN HUETTENES-ALBERTUS CHEMISCHE WERKE GMBH (DE) 1985-03-26 US disclosed
US-4220342-A Gasket having polysiloxane sealant layer containing organotitanate DANA CORPORATION (US) 1980-09-02 US disclosed