SCHEMBL25294709

SCHEMBL25294709

CCC(C)C(C(=N)N)C(C)CC

nearest known ligand 0.33

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.33
NOS3 P29474 2/20 0.32
NOS1 P29475 2/20 0.32
NOS2 P35228 2/20 0.32
CYP1A2 P05177 1/20 0.32
CYP2D6 P10635 1/20 0.32
CYP2C19 P33261 1/20 0.32
BLM P54132 1/20 0.31
TDP1 Q9NUW8 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3977092 0.72 CA1 (0.39) TSHR
SCHEMBL3118205 0.71
SCHEMBL6831273 0.69 NOS3 (0.38) NOS3NOS1NOS2CYP2D6
SCHEMBL3072976 0.69 NOS3 (0.33) TSHRNOS3NOS1NOS2CYP1A2
Hydrochloric Acid SCHEMBL5693195 0.69
SCHEMBL28090209 0.69 ALDH1A1 (0.45) TSHRTDP1
SCHEMBL3686602 0.69 CA1 (0.40) TSHR
SCHEMBL3376127 0.67
SCHEMBL2943980 0.67
SCHEMBL17283415 0.65 DPP4 (0.35) TSHRTDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116924939-B Preparation method of magnesium complex 苏州源展材料科技有限公司 2024-01-26 CN claimed
CN-116419504-A Flexible high-density interconnection circuit board and preparation method thereof 宁波华远电子科技有限公司 2023-07-11 CN claimed
WO-2023124432-A1 FLEXIBLE HIGH-DENSITY INTERCONNECTOR CIRCUIT BOARD AND PREPARATION METHOD THEREOF 宁波华远电子科技有限公司 2023-07-06 WO claimed
CN-117995653-A Semiconductor oxide channel for 3D NAND and method of manufacturing the same ASM IP私人控股有限公司 2024-05-07 CN disclosed
CN-116924939-B Preparation method of magnesium complex 苏州源展材料科技有限公司 2024-01-26 CN disclosed
CN-116924939-A Preparation method of magnesium complex 苏州源展材料科技有限公司 2023-10-24 CN disclosed
CN-116419504-A Flexible high-density interconnection circuit board and preparation method thereof 宁波华远电子科技有限公司 2023-07-11 CN disclosed
WO-2023124432-A1 FLEXIBLE HIGH-DENSITY INTERCONNECTOR CIRCUIT BOARD AND PREPARATION METHOD THEREOF 宁波华远电子科技有限公司 2023-07-06 WO disclosed