SCHEMBL25759008

SCHEMBL25759008

CCOc1ccc(Nc2ccc3c(c2)Oc2cc(Nc4ccc(OCC)cc4)ccc2C32OC(=O)c3ccccc32)cc1

nearest known ligand 0.77

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 1/20 0.77
HTT P42858 4/20 0.56
MAPT P10636 4/20 0.56
ALDH1A1 P00352 3/20 0.56
LMNA P02545 3/20 0.56
MEN1 O00255 2/20 0.56
KMT2A Q03164 2/20 0.56
USP2 O75604 1/20 0.56
FTO Q9C0B1 7/20 0.52
HPGD P15428 3/20 0.52
TDP1 Q9NUW8 2/20 0.52
CYP2C19 P33261 1/20 0.52
RECQL P46063 1/20 0.52
BLM P54132 1/20 0.52
SMAD3 P84022 1/20 0.52
PRMT1 Q99873 1/20 0.52
ACE2 Q9BYF1 1/20 0.52
KDM4E B2RXH2 2/20 0.47
NSD2 O96028 1/20 0.47
MAPK1 P28482 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10520141 0.88 CYP3A4 (0.61) CYP3A4HTTMAPTALDH1A1LMNA
SCHEMBL10145623 0.88 CYP3A4 (0.65) CYP3A4HTTMAPTALDH1A1LMNA
Diethoxyflourescein SCHEMBL6404797 0.87 CYP3A4 (1.00) CYP3A4HTTMAPTALDH1A1LMNA
SCHEMBL17581035 0.85 FTO (0.63) CYP3A4HTTMAPTALDH1A1LMNA
SCHEMBL10518377 0.84 FTO (0.59) CYP3A4HTTMAPTALDH1A1LMNA
SCHEMBL14357411 0.83 CYP3A4 (0.56) CYP3A4HTTMAPTALDH1A1LMNA
SCHEMBL13295494 0.82 FTO (0.56) CYP3A4HTTMAPTALDH1A1LMNA
SCHEMBL10521293 0.82 FTO (0.59) CYP3A4HTTMAPTALDH1A1LMNA
SCHEMBL3164943 0.81 CYP3A4 (0.87) CYP3A4HTTMAPTALDH1A1LMNA
SCHEMBL22900773 0.81 CYP3A4 (0.87) CYP3A4HTTMAPTALDH1A1LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023120352-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED OBJECT, CURED OBJECT MANUFACTURING METHOD, ORGANIC EL DISPLAY DEVICE, AND DISPLAY DEVICE 東レ株式会社 2023-06-29 WO disclosed