SCHEMBL25836661

SCHEMBL25836661

Cc1c(F)c(F)c(Oc2ccc(S(C)(=O)=O)cc2)c(F)c1F

nearest known ligand 0.49

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
PTGS2 P35354 15/20 0.49
PTGS1 P23219 5/20 0.49
SLC6A4 P31645 1/20 0.43
CA12 O43570 1/20 0.42
CA1 P00915 1/20 0.42
CA2 P00918 1/20 0.42
CA7 P43166 1/20 0.42
CA13 Q8N1Q1 1/20 0.42
ALOX5AP P20292 1/20 0.40
FEN1 P39748 1/20 0.40
HPGD P15428 1/20 0.40
HTT P42858 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10296805 0.83 HTT (0.46) PTGS2PTGS1CA12CA1CA2
SCHEMBL21701078 0.82 CA12 (0.46) PTGS2PTGS1SLC6A4CA12CA1
SCHEMBL12770808 0.79 PKM (0.54) PTGS2PTGS1CA1CA2HTT
SCHEMBL4569587 0.77 TEAD4 (0.45) CA12CA1CA2CA7CA13
SCHEMBL12770795 0.77 PKM (0.53) PTGS2PTGS1CA12CA1CA2
SCHEMBL14424439 0.77 HSD17B10 (0.43) PTGS2PTGS1CA12CA1CA2
SCHEMBL11547843 0.77 HTT (0.58) PTGS2PTGS1HTT
SCHEMBL7363510 0.76 SOS1 (0.66) PTGS2PTGS1SLC6A4
SCHEMBL10296806 0.76 CA12 (0.49) CA12CA1CA2CA7CA13
SCHEMBL12770797 0.76 CA1 (0.46) PTGS2PTGS1CA12CA1CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12038689-B2 Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device FUJIFILM CORPORATION (JP) 2024-07-16 US disclosed
US-20230266675-A1 INSPECTION METHOD, METHOD FOR PRODUCING COMPOSITION, AND METHOD FOR VERIFYING COMPOSITION FUJIFILM CORPORATION (JP) 2023-08-24 US disclosed
US-11703758-B2 Photosensitive composition for EUV light, pattern forming method, and method for manufacturing electronic device FUJIFILM CORPORATION (JP) 2023-07-18 US disclosed
US-11656548-B2 Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, mask blank with resist film, method for producing photomask, and method for manufacturing electronic device FUJIFILM CORPORATION (JP) 2023-05-23 US disclosed