⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11857363 | 0.82 | NPC1 (0.33) | — | |
| SCHEMBL10897809 | 0.80 | PHF8 (0.39) | — | |
| SCHEMBL3956342 | 0.79 | — | — | |
| SCHEMBL14148322 | 0.78 | — | — | |
| SCHEMBL25563834 | 0.76 | — | — | |
| SCHEMBL14148323 | 0.76 | — | — | |
| SCHEMBL11862024 | 0.76 | LDHA (0.40) | — | |
| SCHEMBL7159510 | 0.76 | ALDH1A1 (0.42) | — | |
| SCHEMBL11855011 | 0.76 | LMNA (0.44) | — | |
| SCHEMBL11856616 | 0.74 | KDM4C (0.42) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 66 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8063161-B2 | Low temperature curing acrylate and maleimide based formulations and methods for use thereof | DESIGNER MOLECULES, INC. (US) | 2011-11-22 | — | — | US | claimed |
| US-20100063184-A1 | LOW TEMPERATURE CURING ACRYLATE AND MALEIMIDE BASED FORMULATIONS AND METHODS FOR USE THEREOF | DESIGNER MOLECULES, INC. (US) | 2010-03-11 | — | — | US | claimed |
| WO-2008130894-A1 | LOW TEMPERATURE CURING ACRYLATE AND MALEIMIDE BASED FORMULATIONS AND METHODS FOR USE THEREOF | DESIGNER MOLECULES, INC. (US) | 2008-10-30 | — | — | WO | claimed |
| US-4542202-A | EPOXY COMPOUND WITH A HYDROXY, MERCAPTO, OR HYDRAZIDE MODIFIED TERTIARY AMINE | AJINOMOTO CO., INC. (JP) | 1985-09-17 | — | — | US | claimed |
| US-20240199925-A1 | ELECTRICALLY CONDUCTIVE ADHESIVE COMPOSITION FOR BONDING SOLAR CELLS | HENKEL AG & CO KGAA (DE) | 2024-06-20 | — | — | US | disclosed |
| WO-2024089905-A1 | RESIN COMPOSITION, ADHESIVE, SEALANT, CURED PRODUCT, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT | NAMICS CORPORATION (JP) | 2024-05-02 | — | — | WO | disclosed |
| WO-2024090259-A1 | RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | ナミックス株式会社 | 2024-05-02 | — | — | WO | disclosed |
| WO-2024089906-A1 | RESIN COMPOSITION, ADHESIVE, SEALANT, CURED PRODUCT AND SEMICONDUCTOR DEVICE | NAMICS CORPORATION (JP) | 2024-05-02 | — | — | WO | disclosed |
| EP-3998252-B1 | THIOL COMPOUNDS, SYNTHESIS METHOD THEREFOR, AND UTILIZATION OF SAID THIOL COMPOUNDS | SHIKOKU CHEM (JP) | 2024-04-24 | — | — | EP | disclosed |
| US-20240124621-A1 | CURABLE COMPOSITION AND USE THEREOF | HENKEL AG & CO KGAA (DE) | 2024-04-18 | — | — | US | disclosed |
| WO-2023218702-A1 | CURING AGENT AND USE THEREOF | 四国化成工業株式会社 | 2023-11-16 | — | — | WO | disclosed |
| US-11807596-B2 | Thiol compounds, synthesis method therefor, and utilization of said thiol compounds | SHIKOKU CHEMICALS CORPORATION (JP) | 2023-11-07 | — | — | US | disclosed |
| EP-0662488-A1 | Epoxy-resin composition | Ajinomoto Co., Inc. (JP) | 1995-07-12 | — | — | EP | disclosed |
| US-5430112-A | Epoxy resin and polythiol composition | AJINOMOTO CO., INC. (JP) | 1995-07-04 | — | — | US | disclosed |
| EP-0594133-A2 | Polythiol epoxy resin composition with extended working life | Ajinomoto Co., Inc. (JP) | 1994-04-27 | — | — | EP | disclosed |
| EP-0104837-B1 | Latent curing agents for epoxy resins | AJINOMOTO KK (JP) | 1994-01-26 | — | — | EP | disclosed |
| EP-0569044-A1 | Latent curing agents for epoxy resins | AJINOMOTO CO., INC. (JP) | 1993-11-10 | — | — | EP | disclosed |
| CN-1054599-A | Heterogeneous ring compound | ICI PLC (GB) | 1991-09-18 | — | — | CN | disclosed |
| US-4542202-A | EPOXY COMPOUND WITH A HYDROXY, MERCAPTO, OR HYDRAZIDE MODIFIED TERTIARY AMINE | AJINOMOTO CO., INC. (JP) | 1985-09-17 | — | — | US | disclosed |
| EP-0104837-A2 | Latent curing agents for epoxy resins | AJINOMOTO CO., INC. (JP) | 1984-04-04 | — | — | EP | disclosed |