SCHEMBL25899305

SCHEMBL25899305

O=C1c2ccc(Cc3ccc4c(c3)C(=O)N(c3cccc(O)c3)C4=O)cc2C(=O)N1c1cccc(O)c1

nearest known ligand 0.74

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 4/20 0.74
NPC1 O15118 1/20 0.67
RAB9A P51151 1/20 0.67
NR1H3 Q13133 5/20 0.56
KDM4E B2RXH2 1/20 0.56
POLB P06746 1/20 0.56
MEN1 O00255 2/20 0.53
ALDH1A1 P00352 2/20 0.53
KMT2A Q03164 2/20 0.53
MAPT P10636 1/20 0.53
ESR2 Q92731 2/20 0.53
NR1H2 P55055 1/20 0.51
USP2 O75604 1/20 0.48
TNNI3 P19429 1/20 0.48
HTT P42858 1/20 0.48
TNNT2 P45379 1/20 0.48
TNNC1 P63316 1/20 0.48
TLR9 Q9NR96 1/20 0.48
L3MBTL1 Q9Y468 1/20 0.48
ANPEP P15144 2/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9588495 0.85 ESR1 (1.00) ESR1NPC1RAB9ANR1H3KDM4E
SCHEMBL25899308 0.85 MEN1 (0.64) ESR1NPC1RAB9ANR1H3KDM4E
SCHEMBL759648 0.83 ESR1 (0.81) ESR1NPC1RAB9ANR1H3KDM4E
SCHEMBL25899286 0.82 ESR1 (0.62) ESR1NR1H3POLBALDH1A1ESR2
SCHEMBL1662738 0.82 ESR1 (0.80) ESR1NPC1RAB9ANR1H3KDM4E
SCHEMBL9630819 0.80 ESR1 (0.90) ESR1NPC1RAB9AKDM4EPOLB
SCHEMBL16521526 0.80 NPC1 (1.00) ESR1NPC1RAB9ANR1H3KDM4E
SCHEMBL31012107 0.80 ESR1 (0.90) ESR1NPC1RAB9AKDM4EPOLB
SCHEMBL2631561 0.80 ESR1 (0.77) ESR1NPC1RAB9AKDM4EPOLB
SCHEMBL7360727 0.80 ESR1 (0.77) ESR1NPC1RAB9ANR1H3KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230236508-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, PATTERNED CURED FILM AND SEMICONDUCTOR ELEMENT RESONAC CORPORATION (JP) 2023-07-27 US disclosed