Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.80 |
| ▸ | LMNA | P02545 | 3/20 | 0.80 |
| ▸ | SRD5A2 | P31213 | 3/20 | 0.74 |
| ▸ | CES2 | O00748 | 2/20 | 0.74 |
| ▸ | CES1 | P23141 | 2/20 | 0.74 |
| ▸ | AKR1C3 | P42330 | 1/20 | 0.67 |
| ▸ | RAB9A | P51151 | 3/20 | 0.65 |
| ▸ | NPC1 | O15118 | 2/20 | 0.65 |
| ▸ | MEN1 | O00255 | 2/20 | 0.65 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.65 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.61 |
| ▸ | HPGD | P15428 | 1/20 | 0.59 |
| ▸ | POLB | P06746 | 1/20 | 0.59 |
| ▸ | ATM | Q13315 | 1/20 | 0.58 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.58 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.58 |
| ▸ | ELANE | P08246 | 1/20 | 0.57 |
| ▸ | PTGS2 | P35354 | 1/20 | 0.57 |
| ▸ | MAPT | P10636 | 1/20 | 0.56 |
| ▸ | MAPK13 | O15264 | 1/20 | 0.56 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10877169 | 1.00 | ALDH1A1 (0.80) | ALDH1A1LMNASRD5A2CES2CES1 | |
| SCHEMBL235 | 1.00 | ALDH1A1 (0.80) | ALDH1A1LMNASRD5A2CES2CES1 | |
| Benzophenone SCHEMBL5162782 | 1.00 | ALDH1A1 (0.80) | ALDH1A1LMNASRD5A2CES2CES1 | |
| Hydrochloric Acid SCHEMBL4593815 | 0.98 | ALDH1A1 (0.76) | ALDH1A1LMNASRD5A2CES2CES1 | |
| SCHEMBL9500551 | 0.98 | ALDH1A1 (0.76) | ALDH1A1LMNASRD5A2CES2CES1 | |
| Bicarbonate SCHEMBL9817083 | 0.98 | ALDH1A1 (0.76) | ALDH1A1LMNASRD5A2CES2CES1 | |
| Hydrochloric Acid SCHEMBL4593809 | 0.98 | ALDH1A1 (0.76) | ALDH1A1LMNASRD5A2CES2CES1 | |
| Toluene SCHEMBL10782841 | 0.95 | ALDH1A1 (0.80) | ALDH1A1LMNASRD5A2CES2CES1 | |
| SCHEMBL15030108 | 0.93 | ALDH1A1 (0.70) | ALDH1A1LMNASRD5A2CES2CES1 | |
| SCHEMBL15496856 | 0.93 | LMNA (0.70) | ALDH1A1LMNASRD5A2CES2CES1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 205 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110850678-B | Photosensitive compound, preparation method thereof, photosensitive compound composition and cured product thereof | 株式会社力森诺科 | 2024-03-15 | — | — | CN | claimed |
| WO-2024046225-A1 | ESTER TYPE PHOTOSENSITIVE POLYIMIDE COMPOSITE MATERIAL, PREPARATION METHOD AND SEMICONDUCTOR APPARATUS | 深圳先进电子材料国际创新研究院 | 2024-03-07 | — | — | WO | claimed |
| CN-115850596-A | Transparent photosensitive polyimide resin and preparation method and application thereof | 中国科学院化学研究所 | 2023-03-28 | — | — | CN | claimed |
| CN-119912689-A | Resin, resin composition and cured film | 华为技术有限公司 | 2025-05-02 | — | — | CN | disclosed |
| CN-119912687-A | Resin composition, additive thereof, cured film and electronic device | 华为技术有限公司 | 2025-05-02 | — | — | CN | disclosed |
| CN-112368641-B | Photosensitive resin composition, photosensitive sheet, cured film thereof, method for producing cured film, and electronic component | 东丽株式会社 | 2025-05-02 | — | — | CN | disclosed |
| CN-108803240-B | Photosensitive resin composition | 株式会社东进世美肯 | 2024-12-03 | — | — | CN | disclosed |
| WO-2024147917-A1 | DIELECTRIC FILM FORMING COMPOSITION CONTAINING ACYL GERMANIUM COMPOUND | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2024-07-11 | — | — | WO | disclosed |
| US-20240210827-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-06-27 | — | — | US | disclosed |
| US-20240198368-A1 | ELECTRODE COMPOSITION FOR ELECTROSPRAYING | AMOGREENTECH CO., LTD. (KR) | 2024-06-20 | — | — | US | disclosed |
| WO-2024095927-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | 旭化成株式会社 | 2024-05-10 | — | — | WO | disclosed |
| US-6162580-A | Photosensitive polyimide precursor compositions processable by exposure to short wavelength light | ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) | 2000-12-19 | — | — | US | disclosed |
| EP-0531019-B1 | Photosensitive polyimide precursor compositions and process for preparing same | TORAY INDUSTRIES (JP) | 2000-11-15 | — | — | EP | disclosed |
| EP-0580108-B1 | A photosensitive polyimide composition | ASAHI CHEMICAL IND (JP) | 1997-03-12 | — | — | EP | disclosed |
| EP-0718696-A2 | A photosensitive polyimide composition | ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) | 1996-06-26 | — | — | EP | disclosed |
| US-5397682-A | Polyimide precursor and photosensitive composition containing the same | ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) | 1995-03-14 | — | — | US | disclosed |
| US-5310862-A | Photosensitive polyimide precursor compositions and process for preparing same | TORAY INDUSTRIES, INC. (JP) | 1994-05-10 | — | — | US | disclosed |
| WO-1994006057-A1 | POLYIMIDE PRECURSOR AND PHOTOSENSITIVE COMPOSITION CONTAINING THE SAME | ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) | 1994-03-17 | — | — | WO | disclosed |
| EP-0580108-A2 | A photosensitive polyimide composition | ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) | 1994-01-26 | — | — | EP | disclosed |
| EP-0531019-A1 | Photosensitive polyimide precursor compositions and process for preparing same | TORAY INDUSTRIES, INC. (JP) | 1993-03-10 | — | — | EP | disclosed |