Predicted protein targets (top 3)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.36 |
| ▸ | TSHR | P16473 | 1/20 | 0.36 |
| ▸ | AKT1 | P31749 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL13172440 | 0.89 | ALDH1A1 (0.30) | ALDH1A1TSHR | |
| SCHEMBL296744 | 0.89 | ALDH1A1 (0.32) | ALDH1A1TSHR | |
| SCHEMBL12302824 | 0.89 | ALDH1A1 (0.32) | ALDH1A1TSHR | |
| SCHEMBL3481365 | 0.89 | ALDH1A1 (0.32) | ALDH1A1TSHR | |
| SCHEMBL1245805 | 0.87 | ALDH1A1 (0.31) | ALDH1A1TSHR | |
| SCHEMBL3482271 | 0.87 | ALDH1A1 (0.31) | ALDH1A1TSHR | |
| SCHEMBL4354899 | 0.85 | ALDH1A1 (0.30) | ALDH1A1TSHR | |
| SCHEMBL336006 | 0.85 | ESR1 (0.32) | ALDH1A1TSHR | |
| SCHEMBL3482068 | 0.82 | — | — | |
| SCHEMBL3481482 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 66 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9695301-B2 | Nanoparticle, method for producing nanoparticle, addition curing silicone resin composition, and semiconductor apparatus | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2017-07-04 | — | — | US | disclosed |
| US-9695301-B2 | Nanoparticle, method for producing nanoparticle, addition curing silicone resin composition, and semiconductor apparatus | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2017-07-04 | — | — | US | disclosed |
| US-9657175-B2 | Silicone resin composition for sealing optical semiconductor element and optical semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2017-05-23 | — | — | US | disclosed |
| US-9657175-B2 | Silicone resin composition for sealing optical semiconductor element and optical semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2017-05-23 | — | — | US | disclosed |
| US-20160355671-A1 | NANOPARTICLE, METHOD FOR PRODUCING NANOPARTICLE, ADDITION CURING SILICONE RESIN COMPOSITION, AND SEMICONDUCTOR APPARATUS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-12-08 | — | — | US | disclosed |
| US-20160355671-A1 | NANOPARTICLE, METHOD FOR PRODUCING NANOPARTICLE, ADDITION CURING SILICONE RESIN COMPOSITION, AND SEMICONDUCTOR APPARATUS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-12-08 | — | — | US | disclosed |
| US-9403967-B2 | Curable resin composition, cured product thereof and photosemiconductor apparatus | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-08-02 | — | — | US | disclosed |
| US-9403967-B2 | Curable resin composition, cured product thereof and photosemiconductor apparatus | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-08-02 | — | — | US | disclosed |
| US-20160185912-A1 | CURABLE SILICONE RESIN COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-06-30 | — | — | US | disclosed |
| EP-1770127-B1 | Method of reducing surface tackiness of silicone rubber cured product, liquid silicone rubber composition for sealing semiconductor, silicone rubber-sealed semiconductor device, and method of producing semiconductor device | SHINETSU CHEMICAL CO (JP) | 2016-05-04 | — | — | EP | disclosed |
| US-20080276836-A1 | Composition containing anti-misting component of reduced molecular weight and viscosity | MOMENTIVE PERFORMANCE MATERIALS INC. | 2008-11-13 | — | — | US | disclosed |
| US-20080281055-A1 | Branched polysiloxane of reduced molecular weight and viscosity | MOMENTIVE PERFORMANCE MATERIALS INC. | 2008-11-13 | — | — | US | disclosed |
| US-20080213492-A1 | INSULATING FILM FORMING COMPOSITION AND PRODUCTION METHOD OF INSULATING FILM | FUJIFILM CORPORATION (JP) | 2008-09-04 | — | — | US | disclosed |
| US-20080081121-A1 | Insulating film of silicon and silicon cage containing polymers from carbon carbon double bonds; interlayer film in semiconductor devices | FUJIFILM CORPORATION (JP) | 2008-04-03 | — | — | US | disclosed |
| WO-2008027497-A2 | BRANCHED POLYSILOXANE COMPOSITION | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2008-03-06 | — | — | WO | disclosed |
| US-20080058479-A1 | Composition containing anti-misting component | GENERAL ELECTRIC COMPANY (US) | 2008-03-06 | — | — | US | disclosed |
| US-20080058491-A1 | Branched polysiloxane composition | GENERAL ELECTRIC COMPANY (US) | 2008-03-06 | — | — | US | disclosed |
| US-20080015326-A1 | CURABLE SILICONE RUBBER COMPOSITION AND CURED PRODUCT THEREOF | SHIN -ETSU CHEMICAL CO., LTD. (JP) | 2008-01-17 | — | — | US | disclosed |
| US-20070166470-A1 | CURABLE SILICONE RUBBER COMPOSITION AND CURED PRODUCT THEREOF | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-07-19 | — | — | US | disclosed |
| US-20070077360-A1 | Method of reducing surface tackiness of silicone rubber cured product, liquid silicone rubber composition for sealing semiconductor, silicone rubber-sealed semiconductor device, and method of producing semiconductor device | SHIN -ETSU CHEMICAL CO., LTD. (JP) | 2007-04-05 | — | — | US | disclosed |