SCHEMBL2601717

SCHEMBL2601717

CCC(C)C(=O)OC1C2CCC(O2)C1OS(N)(=O)=O

nearest known ligand 0.36

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
CA12 O43570 6/20 0.36
CA1 P00915 6/20 0.36
CA2 P00918 6/20 0.36
CA9 Q16790 6/20 0.36
PPM1B O75688 2/20 0.33
PTPN1 P18031 2/20 0.33
PPP1CC P36873 2/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12202199 0.84 PPM1B (0.31) PPM1BPTPN1PPP1CC
SCHEMBL2601707 0.81 CA12 (0.35) CA12CA1CA2CA9
SCHEMBL2601718 0.76 CA12 (0.32) CA12CA1CA2CA9PPM1B
SCHEMBL2601708 0.76 CA2 (0.42) CA12CA1CA2CA9
SCHEMBL2601716 0.72
SCHEMBL14091378 0.70 PPM1B (0.40) PPM1BPTPN1PPP1CC
SCHEMBL10224670 0.70 SMYD3 (0.31) CA12CA1CA2CA9
SCHEMBL15113823 0.66 SLC6A3 (0.35) PPM1BPTPN1
SCHEMBL10900145 0.65 CHRM2 (0.38)
SCHEMBL12202161 0.65

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8987386-B2 Method of producing polymeric compound, resist composition, and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2015-03-24 US disclosed
US-8440385-B2 Positive resist composition, method of forming resist pattern and polymeric compound TOKYO OHKA KOGYO CO., LTD. (JP) 2013-05-14 US disclosed
US-20120328993-A1 METHOD OF PRODUCING POLYMERIC COMPOUND, RESIST COMPOSITION, AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2012-12-27 US disclosed
US-20120100487-A1 RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND POLYMERIC COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2012-04-26 US disclosed
US-20110244392-A1 POSITIVE RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN AND POLYMERIC COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2011-10-06 US disclosed