SCHEMBL2605544

SCHEMBL2605544

Cc1ccc(C(=O)Nc2ccc(O)c(NC(=O)c3ccc(C)cc3)c2)cc1

nearest known ligand 0.66

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ KCNMA1 Q12791 2/20 0.66
▸ NPC1 O15118 9/20 0.66
▸ RAB9A P51151 8/20 0.66
▸ MAPT P10636 7/20 0.56
▸ SMN1; SMN2 Q16637 4/20 0.56
▸ ALDH1A1 P00352 3/20 0.56
▸ NFKB1 P19838 2/20 0.56
▸ NFKB2 Q00653 2/20 0.56
▸ RELA Q04206 2/20 0.56
▸ KDM4E B2RXH2 1/20 0.56
▸ CYP1A2 P05177 1/20 0.56
▸ CYP3A4 P08684 1/20 0.56
▸ CYP2C9 P11712 1/20 0.56
▸ HPGD P15428 1/20 0.56
▸ CYP2C19 P33261 1/20 0.56
▸ KLK7 P49862 1/20 0.56
▸ MEN1 O00255 2/20 0.55
▸ KMT2A Q03164 2/20 0.55
▸ TP53 P04637 1/20 0.55
▸ POLB P06746 1/20 0.55

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2605548 0.88 KCNMA1 (0.82) KCNMA1NPC1RAB9AMAPTSMN1; SMN2
SCHEMBL6029542 0.86 KCNMA1 (0.84) KCNMA1NPC1RAB9AMAPTSMN1; SMN2
SCHEMBL13721353 0.85 HPSE (0.57) KCNMA1CYP3A4MEN1KMT2AHDAC1
SCHEMBL13213669 0.85 KCNMA1 (0.68) KCNMA1NPC1RAB9AMAPTSMN1; SMN2
SCHEMBL13958489 0.84 MEN1 (0.66) KCNMA1NPC1RAB9AMAPTSMN1; SMN2
SCHEMBL12704788 0.84 NPC1 (0.77) KCNMA1NPC1RAB9AMAPTSMN1; SMN2
SCHEMBL7817331 0.83 HDAC1 (0.69) KCNMA1NPC1RAB9AMAPTKDM4E
SCHEMBL21360973 0.83 KCNK3 (0.69) KCNMA1NPC1RAB9AMAPTALDH1A1
SCHEMBL2605547 0.83 KCNMA1 (0.64) KCNMA1NPC1RAB9AMAPTSMN1; SMN2
SCHEMBL6580244 0.83 NPC1 (0.64) NPC1RAB9AMAPTSMN1; SMN2ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10908500-B2 Cured film and method for producing same TORAY INDUSTRIES, INC. (JP) 2021-02-02 — — US disclosed
US-10696845-B2 Energy-sensitive resin composition TOKYO OHKA KOGYO CO., LTD. (JP) 2020-06-30 — — US disclosed
US-10545406-B2 Cured film formed by curing photosensitive resin composition and method for manufacturing same TORAY INDUSTRIES, INC. (JP) 2020-01-28 — — US disclosed
US-20190225804-A1 ENERGY-SENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2019-07-25 — — US disclosed
US-10197915-B2 Resin and photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2019-02-05 — — US disclosed
US-20190004423-A1 CURED FILM AND METHOD FOR PRODUCING SAME TORAY INDUSTRIES, INC. (JP) 2019-01-03 — — US disclosed
US-20180203353-A1 CURED FILM AND METHOD FOR MANUFACTURING SAME TORAY INDUSTRIES, INC. (JP) 2018-07-19 — — US disclosed
US-20180039174-A1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2018-02-08 — — US disclosed
EP-2520977-B1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2017-11-22 — — EP disclosed
US-20170327644-A1 RESIN AND PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2017-11-16 — — US disclosed
US-20100099041-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2010-04-22 — — US disclosed
EP-1475665-B1 Positive-type photosensitive resin composition TORAY INDUSTRIES (JP) 2009-12-30 — — EP disclosed
EP-2110708-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION Toray Industries, Inc. (JP) 2009-10-21 — — EP disclosed
US-7507518-B2 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2009-03-24 — — US disclosed
US-7507518-B2 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2009-03-24 — — US disclosed
US-20080193718-A1 Positive Photosensitive Resin Compositions, and Relief Patterns and Solid-State Image Sensors Made Thereof TORAY INDUSTRIES, INC. (JP) 2008-08-14 — — US disclosed
US-20080193718-A1 Positive Photosensitive Resin Compositions, and Relief Patterns and Solid-State Image Sensors Made Thereof TORAY INDUSTRIES, INC. (JP) 2008-08-14 — — US disclosed
EP-1132773-B1 POSITIVE-TYPE PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITION TORAY INDUSTRIES (JP) 2007-07-11 — — EP disclosed
US-7214455-B2 Photosensitive resin composition and process for producing heat-resistant resin film TORAY INDUSTRIES, INC. (JP) 2007-05-08 — — US disclosed
US-7214455-B2 Photosensitive resin composition and process for producing heat-resistant resin film TORAY INDUSTRIES, INC. (JP) 2007-05-08 — — US disclosed
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