SCHEMBL2605547

SCHEMBL2605547

Cc1ccc(C(=O)Nc2cc(NC(=O)c3ccc(C)cc3)c(O)cc2O)cc1

nearest known ligand 0.64

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KCNMA1 Q12791 2/20 0.64
NPC1 O15118 6/20 0.60
RAB9A P51151 5/20 0.60
ALDH1A1 P00352 5/20 0.59
HTT P42858 4/20 0.59
KMT2A Q03164 3/20 0.59
MEN1 O00255 2/20 0.59
MAPT P10636 2/20 0.59
TDP1 Q9NUW8 1/20 0.59
HPGD P15428 2/20 0.54
GAA P10253 4/20 0.53
SMN1; SMN2 Q16637 3/20 0.53
LMNA P02545 1/20 0.53
AHR P35869 1/20 0.53
HDAC1 Q13547 2/20 0.52
HDAC6 Q9UBN7 1/20 0.52
POLB P06746 1/20 0.51
KDM4E B2RXH2 2/20 0.51
MAOA P21397 1/20 0.50
ACHE P22303 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13986886 0.93 KCNMA1 (0.57) KCNMA1NPC1RAB9AALDH1A1HTT
SCHEMBL2605549 0.88 KMT2A (0.63) KCNMA1NPC1RAB9AALDH1A1HTT
SCHEMBL21360977 0.87 NPC1 (0.64) KCNMA1NPC1RAB9AALDH1A1HTT
SCHEMBL2605548 0.87 KCNMA1 (0.82) KCNMA1NPC1RAB9AALDH1A1HTT
SCHEMBL6029542 0.85 KCNMA1 (0.84) KCNMA1NPC1RAB9AALDH1A1HTT
SCHEMBL13213669 0.84 KCNMA1 (0.68) KCNMA1NPC1RAB9AALDH1A1HTT
SCHEMBL19846838 0.84 ALDH1A1 (0.66) KCNMA1NPC1RAB9AALDH1A1HTT
SCHEMBL2605544 0.83 KCNMA1 (0.66) KCNMA1NPC1RAB9AALDH1A1HTT
SCHEMBL12704788 0.83 NPC1 (0.77) KCNMA1NPC1RAB9AALDH1A1HTT
SCHEMBL14428130 0.82 MAPT (0.57) KCNMA1NPC1RAB9AALDH1A1HTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10696845-B2 Energy-sensitive resin composition TOKYO OHKA KOGYO CO., LTD. (JP) 2020-06-30 US disclosed
US-20190225804-A1 ENERGY-SENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2019-07-25 US disclosed
US-10197915-B2 Resin and photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2019-02-05 US disclosed
US-20180039174-A1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2018-02-08 US disclosed
EP-2520977-B1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2017-11-22 EP disclosed
US-20170327644-A1 RESIN AND PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2017-11-16 US disclosed
EP-3225647-A1 RESIN AND PHOTOSENSITIVE RESIN COMPOSITION Toray Industries, Inc. (JP) 2017-10-04 EP disclosed
EP-1365289-B1 PRECURSOR COMPOSITION FOR POSITIVE PHOTOSENSITIVE RESIN AND DISPLAY MADE WITH THE SAME TORAY INDUSTRIES (JP) 2016-04-20 EP disclosed
US-8883391-B2 Positive type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2014-11-11 US disclosed
EP-1508837-B1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PREPARING HEAT-RESISTANT RESIN FILM TORAY INDUSTRIES (JP) 2014-10-15 EP disclosed
US-20100099041-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2010-04-22 US disclosed
EP-1475665-B1 Positive-type photosensitive resin composition TORAY INDUSTRIES (JP) 2009-12-30 EP disclosed
EP-2110708-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION Toray Industries, Inc. (JP) 2009-10-21 EP disclosed
US-7507518-B2 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2009-03-24 US disclosed
US-7507518-B2 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2009-03-24 US disclosed
US-20080193718-A1 Positive Photosensitive Resin Compositions, and Relief Patterns and Solid-State Image Sensors Made Thereof TORAY INDUSTRIES, INC. (JP) 2008-08-14 US disclosed
US-20080193718-A1 Positive Photosensitive Resin Compositions, and Relief Patterns and Solid-State Image Sensors Made Thereof TORAY INDUSTRIES, INC. (JP) 2008-08-14 US disclosed
EP-1132773-B1 POSITIVE-TYPE PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITION TORAY INDUSTRIES (JP) 2007-07-11 EP disclosed
US-7214455-B2 Photosensitive resin composition and process for producing heat-resistant resin film TORAY INDUSTRIES, INC. (JP) 2007-05-08 US disclosed
US-7214455-B2 Photosensitive resin composition and process for producing heat-resistant resin film TORAY INDUSTRIES, INC. (JP) 2007-05-08 US disclosed