SCHEMBL2605545

SCHEMBL2605545

Cc1ccc(C(=O)Nc2cc(C(C)(C)c3ccc(O)c(NC(=O)c4ccc(C)cc4)c3)ccc2O)cc1

nearest known ligand 0.62

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
KCNMA1 Q12791 4/20 0.62
NPC1 O15118 5/20 0.51
ALDH1A1 P00352 3/20 0.51
MEN1 O00255 2/20 0.51
KMT2A Q03164 2/20 0.51
MAPT P10636 2/20 0.51
HTT P42858 1/20 0.51
TDP1 Q9NUW8 1/20 0.51
HDAC1 Q13547 2/20 0.49
RAB9A P51151 4/20 0.49
AKT1 P31749 1/20 0.48
ESR1 P03372 1/20 0.47
HPGD P15428 2/20 0.47
KDM4E B2RXH2 1/20 0.47
HDAC2 Q92769 1/20 0.47
MAPK1 P28482 1/20 0.46
SNCA P37840 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2605538 0.91 KCNMA1 (0.71) KCNMA1NPC1MEN1KMT2AMAPT
SCHEMBL12510861 0.88 KCNMA1 (0.54) KCNMA1NPC1MEN1KMT2AHDAC1
SCHEMBL10001969 0.87 KMT2A (0.52) KCNMA1NPC1MEN1KMT2AMAPT
SCHEMBL13601071 0.87 HDAC1 (0.60) KCNMA1MEN1KMT2AMAPTTDP1
SCHEMBL12510753 0.86 KCNMA1 (0.68) KCNMA1NPC1ALDH1A1MEN1KMT2A
SCHEMBL19846829 0.86 KCNMA1 (0.63) KCNMA1NPC1ALDH1A1MEN1KMT2A
SCHEMBL19846834 0.86 KCNMA1 (0.60) KCNMA1NPC1ALDH1A1MEN1KMT2A
SCHEMBL2605548 0.85 KCNMA1 (0.82) KCNMA1NPC1ALDH1A1MEN1KMT2A
SCHEMBL14081561 0.85 MAPT (0.50) KCNMA1ALDH1A1MEN1KMT2AMAPT
SCHEMBL7300963 0.85 KCNMA1 (0.71) KCNMA1NPC1ALDH1A1MAPTHTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10696845-B2 Energy-sensitive resin composition TOKYO OHKA KOGYO CO., LTD. (JP) 2020-06-30 US disclosed
US-20190225804-A1 ENERGY-SENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2019-07-25 US disclosed
US-10197915-B2 Resin and photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2019-02-05 US disclosed
US-20180039174-A1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2018-02-08 US disclosed
US-20180039174-A1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2018-02-08 US disclosed
US-20170327644-A1 RESIN AND PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2017-11-16 US disclosed
EP-1365289-B1 PRECURSOR COMPOSITION FOR POSITIVE PHOTOSENSITIVE RESIN AND DISPLAY MADE WITH THE SAME TORAY INDUSTRIES (JP) 2016-04-20 EP disclosed
US-8883391-B2 Positive type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2014-11-11 US disclosed
EP-1508837-B1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PREPARING HEAT-RESISTANT RESIN FILM TORAY INDUSTRIES (JP) 2014-10-15 EP disclosed
EP-2555053-A1 Positive-type photosensitive resin composition Toray Industries, Inc. (JP) 2013-02-06 EP disclosed
US-20100099041-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2010-04-22 US disclosed
EP-1475665-B1 Positive-type photosensitive resin composition TORAY INDUSTRIES (JP) 2009-12-30 EP disclosed
EP-2110708-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION Toray Industries, Inc. (JP) 2009-10-21 EP disclosed
US-7507518-B2 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2009-03-24 US disclosed
US-7507518-B2 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2009-03-24 US disclosed
US-20080193718-A1 Positive Photosensitive Resin Compositions, and Relief Patterns and Solid-State Image Sensors Made Thereof TORAY INDUSTRIES, INC. (JP) 2008-08-14 US disclosed
US-20080193718-A1 Positive Photosensitive Resin Compositions, and Relief Patterns and Solid-State Image Sensors Made Thereof TORAY INDUSTRIES, INC. (JP) 2008-08-14 US disclosed
EP-1132773-B1 POSITIVE-TYPE PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITION TORAY INDUSTRIES (JP) 2007-07-11 EP disclosed
US-7214455-B2 Photosensitive resin composition and process for producing heat-resistant resin film TORAY INDUSTRIES, INC. (JP) 2007-05-08 US disclosed
US-7214455-B2 Photosensitive resin composition and process for producing heat-resistant resin film TORAY INDUSTRIES, INC. (JP) 2007-05-08 US disclosed