SCHEMBL13601071

SCHEMBL13601071

CC(C)(c1ccc(O)c(NC(=O)c2ccc(N)cc2)c1)c1ccc(O)c(NC(=O)c2ccc(N)cc2)c1

nearest known ligand 0.60

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HDAC1 Q13547 5/20 0.60
KCNMA1 Q12791 4/20 0.50
MEN1 O00255 2/20 0.47
KMT2A Q03164 2/20 0.47
LMNA P02545 1/20 0.47
POLB P06746 1/20 0.47
PKM P14618 1/20 0.47
APEX1 P27695 1/20 0.47
TDP1 Q9NUW8 1/20 0.47
PTGS1 P23219 2/20 0.47
MAPT P10636 3/20 0.46
GAA P10253 1/20 0.46
MAPK1 P28482 1/20 0.46
HDAC2 Q92769 1/20 0.46
ESRRG P62508 1/20 0.45
CA1 P00915 1/20 0.45
CA2 P00918 1/20 0.45
CYP1A2 P05177 1/20 0.44
CYP2C9 P11712 1/20 0.44
CYP2C19 P33261 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18360223 0.91 HDAC1 (0.57) HDAC1KCNMA1MEN1KMT2ALMNA
SCHEMBL19986269 0.90 HDAC1 (0.59) HDAC1KCNMA1MEN1KMT2ALMNA
SCHEMBL14081561 0.90 MAPT (0.50) HDAC1KCNMA1MEN1KMT2APKM
SCHEMBL28918150 0.88 MEN1 (0.56) HDAC1KCNMA1MEN1KMT2ALMNA
SCHEMBL29999394 0.88 MEN1 (0.56) HDAC1KCNMA1MEN1KMT2ALMNA
SCHEMBL12510861 0.87 KCNMA1 (0.54) HDAC1KCNMA1MEN1KMT2AGAA
SCHEMBL2605545 0.87 KCNMA1 (0.62) HDAC1KCNMA1MEN1KMT2ATDP1
SCHEMBL19600606 0.86 HDAC1 (0.55) HDAC1KCNMA1MEN1KMT2ALMNA
SCHEMBL30790669 0.86 HDAC1 (0.63) HDAC1KCNMA1MEN1KMT2ALMNA
SCHEMBL18360436 0.86 HDAC1 (0.63) HDAC1KCNMA1MEN1KMT2ALMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 49 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025100308-A1 RESIN COMPOSITION, CURED PRODUCT, AND DISPLAY DEVICE OR SEMICONDUCTOR DEVICE 東レ株式会社 2025-05-15 WO disclosed
CN-119954849-A Diamine monomer, slurry and polyimide film 奥克控股集团股份公司 2025-05-09 CN disclosed
CN-112368641-B Photosensitive resin composition, photosensitive sheet, cured film thereof, method for producing cured film, and electronic component 东丽株式会社 2025-05-02 CN disclosed
CN-117991590-A Photosensitive resin composition and photosensitive cured film 上海八亿时空先进材料有限公司 2024-05-07 CN disclosed
CN-117964897-A Alkali-soluble resin and application thereof 上海八亿时空先进材料有限公司 2024-05-03 CN disclosed
US-11860538-B2 Photosensitive resin composition, heterocyclic ring-containing polymer precursor, cured film, laminate, method for producing cured film, and semiconductor device FUJIFILM CORPORATION (JP) 2024-01-02 US disclosed
US-11860538-B2 Photosensitive resin composition, heterocyclic ring-containing polymer precursor, cured film, laminate, method for producing cured film, and semiconductor device FUJIFILM CORPORATION (JP) 2024-01-02 US disclosed
US-11802181-B2 Di-amine compound, and heat-resistant resin and resin composition using the same TORAY INDUSTRIES, INC. (JP) 2023-10-31 US disclosed
WO-2023139814-A1 RESIN COMPOSITION, FILM, CURED MEMBRANE, SEMICONDUCTOR DEVICE, AND MULTILAYER CIRCUIT BOARD 東レ株式会社 2023-07-27 WO disclosed
US-20230141241-A1 SCINTILLATOR PANEL AND SCINTILLATOR PANEL MANUFACTURING METHOD TORAY INDUSTRIES, INC. (JP) 2023-05-11 US disclosed
EP-1744213-B1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC COMPONENT HITACHI CHEM DUPONT MICROSYS (JP) 2014-09-03 EP disclosed
EP-2469337-B1 Positive photosensitive resin composition, method for forming pattern, and electronic component HITACHI CHEM DUPONT MICROSYS (JP) 2014-01-22 EP disclosed
US-7638254-B2 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP) 2009-12-29 US disclosed
US-7638254-B2 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP) 2009-12-29 US disclosed
US-20090011364-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC PART HATTORI TAKASHI 2009-01-08 US disclosed
US-20090011364-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC PART HATTORI TAKASHI 2009-01-08 US disclosed
US-7435525-B2 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2008-10-14 US disclosed
US-7435525-B2 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2008-10-14 US disclosed
US-20070122733-A1 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2007-05-31 US disclosed
US-20070122733-A1 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2007-05-31 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11802181-B2 Di-amine compound, and heat-resistant resin and resin composition using the same CAD, ARID2, SMC3 HDAC1 1226/4885KCNMA1 2594/4885MEN1 4033/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.