Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HDAC1 | Q13547 | 5/20 | 0.70 |
| ▸ | MEN1 | O00255 | 2/20 | 0.56 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.56 |
| ▸ | LMNA | P02545 | 1/20 | 0.56 |
| ▸ | POLB | P06746 | 1/20 | 0.56 |
| ▸ | PKM | P14618 | 1/20 | 0.56 |
| ▸ | APEX1 | P27695 | 1/20 | 0.56 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.56 |
| ▸ | KCNMA1 | Q12791 | 5/20 | 0.54 |
| ▸ | HDAC2 | Q92769 | 1/20 | 0.53 |
| ▸ | MAPT | P10636 | 4/20 | 0.53 |
| ▸ | GAA | P10253 | 3/20 | 0.53 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.53 |
| ▸ | SNCA | P37840 | 1/20 | 0.51 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.51 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.51 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.51 |
| ▸ | TERT | O14746 | 1/20 | 0.50 |
| ▸ | TOP1 | P11387 | 1/20 | 0.50 |
| ▸ | RAB9A | P51151 | 1/20 | 0.50 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL13601067 | 0.90 | HDAC1 (0.86) | HDAC1MEN1KMT2ALMNAPOLB | |
| SCHEMBL13601069 | 0.90 | HDAC1 (0.67) | HDAC1MEN1KMT2ALMNAPOLB | |
| SCHEMBL16444808 | 0.89 | HDAC1 (0.65) | HDAC1MEN1KMT2ALMNAPOLB | |
| SCHEMBL18360220 | 0.89 | HDAC1 (0.58) | HDAC1MEN1KMT2ALMNAPOLB | |
| SCHEMBL20808776 | 0.89 | HDAC1 (0.62) | HDAC1MEN1KMT2ALMNAPOLB | |
| SCHEMBL13958489 | 0.88 | MEN1 (0.66) | HDAC1MEN1KMT2ALMNAPOLB | |
| SCHEMBL18360221 | 0.88 | HDAC1 (0.57) | HDAC1MEN1KMT2AKCNMA1HDAC2 | |
| SCHEMBL18360223 | 0.88 | HDAC1 (0.57) | HDAC1MEN1KMT2ALMNAPOLB | |
| SCHEMBL13601076 | 0.87 | HDAC1 (0.63) | HDAC1MEN1KMT2ALMNAPOLB | |
| SCHEMBL29167826 | 0.87 | MEN1 (0.59) | HDAC1MEN1KMT2ALMNAPOLB |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 48 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11860538-B2 | Photosensitive resin composition, heterocyclic ring-containing polymer precursor, cured film, laminate, method for producing cured film, and semiconductor device | FUJIFILM CORPORATION (JP) | 2024-01-02 | — | — | US | disclosed |
| US-11860538-B2 | Photosensitive resin composition, heterocyclic ring-containing polymer precursor, cured film, laminate, method for producing cured film, and semiconductor device | FUJIFILM CORPORATION (JP) | 2024-01-02 | — | — | US | disclosed |
| US-11567405-B2 | Photosensitive resin composition, polymer precursor, cured film, laminate, method for producing cured film, and semiconductor device | FUJIFILM CORPORATION (JP) | 2023-01-31 | — | — | US | disclosed |
| US-20220171285-A1 | METHOD OF MANUFACTURING CURED FILM, PHOTOCURABLE RESIN COMPOSITION, METHOD OF MANUFACTURING LAMINATE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2022-06-02 | — | — | US | disclosed |
| US-20220002488-A1 | CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR MANUFACTURING CURED FILM, SEMICONDUCTOR DEVICE, AND POLYMER PRECURSOR | FUJIFILM CORPORATION (JP) | 2022-01-06 | — | — | US | disclosed |
| US-20210302836-A1 | PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE | FUJIFILM CORPORATION (JP) | 2021-09-30 | — | — | US | disclosed |
| US-20210302835-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, LAMINATE, AND DEVICE | FUJIFILM CORPORATION (JP) | 2021-09-30 | — | — | US | disclosed |
| EP-3492982-B1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORP (JP) | 2020-11-11 | — | — | EP | disclosed |
| US-10780679-B2 | Laminate, method for manufacturing laminate, semiconductor device, and method for manufacturing the semiconductor device | FUJIFILM CORPORATION (JP) | 2020-09-22 | — | — | US | disclosed |
| WO-2020031958-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE SHEET, CURED FILMS OF THESE PRODUCTS AND METHODS FOR PRODUCING SAID CURED FILMS, AND ELECTRONIC COMPONENT | 東レ株式会社 | 2020-02-13 | — | — | WO | disclosed |
| US-20100099041-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION | TORAY INDUSTRIES, INC. (JP) | 2010-04-22 | — | — | US | disclosed |
| US-7615324-B2 | Photosensitive composition, and cured relief pattern production method and semiconductor device using the same | FUJIFILM CORPORATION (JP) | 2009-11-10 | — | — | US | disclosed |
| US-7615324-B2 | Photosensitive composition, and cured relief pattern production method and semiconductor device using the same | FUJIFILM CORPORATION (JP) | 2009-11-10 | — | — | US | disclosed |
| US-7507518-B2 | Photosensitive resin precursor composition | TORAY INDUSTRIES, INC. (JP) | 2009-03-24 | — | — | US | disclosed |
| US-7507518-B2 | Photosensitive resin precursor composition | TORAY INDUSTRIES, INC. (JP) | 2009-03-24 | — | — | US | disclosed |
| US-7455948-B2 | Photosensitive resin composition | TORAY INDUSTRIES, INC. (JP) | 2008-11-25 | — | — | US | disclosed |
| US-7455948-B2 | Photosensitive resin composition | TORAY INDUSTRIES, INC. (JP) | 2008-11-25 | — | — | US | disclosed |
| US-20080227024-A1 | PHOTOSENSITIVE COMPOSITION, AND CURED RELIEF PATTERN PRODUCTION METHOD AND SEMICONDUCTOR DEVICE USING THE SAME | FUJIFILM CORPORATION (JP) | 2008-09-18 | — | — | US | disclosed |
| US-20080227024-A1 | PHOTOSENSITIVE COMPOSITION, AND CURED RELIEF PATTERN PRODUCTION METHOD AND SEMICONDUCTOR DEVICE USING THE SAME | FUJIFILM CORPORATION (JP) | 2008-09-18 | — | — | US | disclosed |
| US-4018735-A | Anisotropic dopes of aromatic polyamides | TEIJIN LIMITED (JA) | 1977-04-19 | — | — | US | disclosed |