SCHEMBL13601069

SCHEMBL13601069

Nc1ccc(C(=O)Nc2cc(C(=O)c3ccc(O)c(NC(=O)c4ccc(N)cc4)c3)ccc2O)cc1

nearest known ligand 0.67

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HDAC1 Q13547 5/20 0.67
H4C1; H4C2; H4C3; H4C4; H4C5; H4C6; H4C8; H4C9; H4C11; H4C12; H4C13; H4C14; H4C15; H4C16 P62805 1/20 0.54
EP300 Q09472 1/20 0.54
PRMT1 Q99873 1/20 0.54
MEN1 O00255 2/20 0.53
KMT2A Q03164 2/20 0.53
LMNA P02545 1/20 0.53
POLB P06746 1/20 0.53
PKM P14618 1/20 0.53
APEX1 P27695 1/20 0.53
TDP1 Q9NUW8 1/20 0.53
KCNMA1 Q12791 5/20 0.51
HDAC2 Q92769 1/20 0.50
SNCA P37840 1/20 0.49
MAPT P10636 3/20 0.48
RAB9A P51151 1/20 0.48
TERT O14746 1/20 0.47
TOP1 P11387 1/20 0.47
GAA P10253 3/20 0.47
HPSE Q9Y251 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2605585 0.90 HDAC1 (0.70) HDAC1MEN1KMT2ALMNAPOLB
SCHEMBL13601067 0.87 HDAC1 (0.86) HDAC1MEN1KMT2ALMNAPOLB
SCHEMBL16444808 0.86 HDAC1 (0.65) HDAC1MEN1KMT2ALMNAPOLB
SCHEMBL13958489 0.85 MEN1 (0.66) HDAC1MEN1KMT2ALMNAPOLB
SCHEMBL13601076 0.84 HDAC1 (0.63) HDAC1MEN1KMT2ALMNAPOLB
SCHEMBL13601068 0.83 HDAC1 (0.62) HDAC1MEN1KMT2ALMNAPOLB
SCHEMBL20808776 0.83 HDAC1 (0.62) HDAC1MEN1KMT2ALMNAPOLB
SCHEMBL12693964 0.83 HDAC1 (0.62) HDAC1MEN1KMT2ALMNAPOLB
SCHEMBL13601071 0.81 HDAC1 (0.60) HDAC1MEN1KMT2ALMNAPOLB
SCHEMBL28093236 0.81 HDAC1 (0.60) HDAC1MEN1KMT2ALMNAPOLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1744213-B1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC COMPONENT HITACHI CHEM DUPONT MICROSYS (JP) 2014-09-03 EP disclosed
US-7638254-B2 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP) 2009-12-29 US disclosed
US-20090011364-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC PART HATTORI TAKASHI 2009-01-08 US disclosed
US-7435525-B2 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2008-10-14 US disclosed
US-20070122733-A1 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2007-05-31 US disclosed
EP-1744213-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC COMPONENT Hitachi Chemical DuPont Microsystems Ltd. (JP) 2007-01-17 EP disclosed