SCHEMBL13601067

SCHEMBL13601067

Nc1ccc(C(=O)Nc2cc(-c3ccc(O)c(NC(=O)c4ccc(N)cc4)c3)ccc2O)cc1

nearest known ligand 0.86

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
HDAC1 Q13547 16/20 0.86
HDAC2 Q92769 3/20 0.67
MEN1 O00255 1/20 0.53
LMNA P02545 1/20 0.53
POLB P06746 1/20 0.53
PKM P14618 1/20 0.53
APEX1 P27695 1/20 0.53
KMT2A Q03164 1/20 0.53
TDP1 Q9NUW8 1/20 0.53
HDAC3 O15379 1/20 0.53
KCNMA1 Q12791 2/20 0.51

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2605585 0.90 HDAC1 (0.70) HDAC1HDAC2MEN1LMNAPOLB
SCHEMBL13601069 0.87 HDAC1 (0.67) HDAC1HDAC2MEN1LMNAPOLB
SCHEMBL31499393 0.87 HDAC1 (0.67) HDAC1HDAC2MEN1LMNAPOLB
SCHEMBL8978690 0.87 HDAC1 (0.67) HDAC1HDAC2MEN1LMNAPOLB
SCHEMBL16444808 0.86 HDAC1 (0.65) HDAC1HDAC2MEN1LMNAPOLB
SCHEMBL13958489 0.85 MEN1 (0.66) HDAC1MEN1LMNAPOLBPKM
SCHEMBL13601076 0.84 HDAC1 (0.63) HDAC1HDAC2MEN1LMNAPOLB
SCHEMBL12693964 0.83 HDAC1 (0.62) HDAC1HDAC2MEN1LMNAPOLB
SCHEMBL20808776 0.83 HDAC1 (0.62) HDAC1HDAC2MEN1LMNAPOLB
SCHEMBL13601068 0.83 HDAC1 (0.62) HDAC1HDAC2MEN1LMNAPOLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1744213-B1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC COMPONENT HITACHI CHEM DUPONT MICROSYS (JP) 2014-09-03 EP disclosed
EP-2469337-B1 Positive photosensitive resin composition, method for forming pattern, and electronic component HITACHI CHEM DUPONT MICROSYS (JP) 2014-01-22 EP disclosed
US-7638254-B2 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP) 2009-12-29 US disclosed
US-7638254-B2 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP) 2009-12-29 US disclosed
US-20090011364-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC PART HATTORI TAKASHI 2009-01-08 US disclosed
US-20090011364-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC PART HATTORI TAKASHI 2009-01-08 US disclosed
US-7435525-B2 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2008-10-14 US disclosed
US-7435525-B2 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2008-10-14 US disclosed
US-20070122733-A1 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2007-05-31 US disclosed
US-20070122733-A1 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2007-05-31 US disclosed