Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HDAC1 | Q13547 | 3/20 | 0.63 |
| ▸ | MEN1 | O00255 | 3/20 | 0.58 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.58 |
| ▸ | LMNA | P02545 | 1/20 | 0.58 |
| ▸ | POLB | P06746 | 1/20 | 0.58 |
| ▸ | PKM | P14618 | 1/20 | 0.58 |
| ▸ | APEX1 | P27695 | 1/20 | 0.58 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.58 |
| ▸ | MAPT | P10636 | 5/20 | 0.53 |
| ▸ | GAA | P10253 | 2/20 | 0.53 |
| ▸ | SNCA | P37840 | 1/20 | 0.53 |
| ▸ | CA12 | O43570 | 1/20 | 0.50 |
| ▸ | CA1 | P00915 | 1/20 | 0.50 |
| ▸ | CA2 | P00918 | 1/20 | 0.50 |
| ▸ | CA9 | Q16790 | 1/20 | 0.50 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.50 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.49 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.49 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.49 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.49 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL16444808 | 0.94 | HDAC1 (0.65) | HDAC1MEN1KMT2ALMNAPOLB | |
| SCHEMBL19986268 | 0.89 | HDAC1 (0.60) | HDAC1MEN1KMT2ALMNAPOLB | |
| SCHEMBL18360434 | 0.88 | HDAC1 (0.58) | HDAC1MEN1KMT2ALMNAPOLB | |
| SCHEMBL2605585 | 0.87 | HDAC1 (0.70) | HDAC1MEN1KMT2ALMNAPOLB | |
| SCHEMBL31499393 | 0.84 | HDAC1 (0.67) | HDAC1MEN1KMT2ALMNAPOLB | |
| SCHEMBL13601067 | 0.84 | HDAC1 (0.86) | HDAC1MEN1KMT2ALMNAPOLB | |
| SCHEMBL13601069 | 0.84 | HDAC1 (0.67) | HDAC1MEN1KMT2ALMNAPOLB | |
| SCHEMBL8978690 | 0.84 | HDAC1 (0.67) | HDAC1MEN1KMT2ALMNAPOLB | |
| SCHEMBL13958489 | 0.83 | MEN1 (0.66) | HDAC1MEN1KMT2ALMNAPOLB | |
| SCHEMBL2605547 | 0.81 | KCNMA1 (0.64) | HDAC1MEN1KMT2ALMNAPOLB |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 46 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11860538-B2 | Photosensitive resin composition, heterocyclic ring-containing polymer precursor, cured film, laminate, method for producing cured film, and semiconductor device | FUJIFILM CORPORATION (JP) | 2024-01-02 | — | — | US | disclosed |
| US-11860538-B2 | Photosensitive resin composition, heterocyclic ring-containing polymer precursor, cured film, laminate, method for producing cured film, and semiconductor device | FUJIFILM CORPORATION (JP) | 2024-01-02 | — | — | US | disclosed |
| US-11802181-B2 | Di-amine compound, and heat-resistant resin and resin composition using the same | TORAY INDUSTRIES, INC. (JP) | 2023-10-31 | — | — | US | disclosed |
| WO-2023182041-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT USING SAME | 東レ株式会社 | 2023-09-28 | — | — | WO | disclosed |
| WO-2023148996-A1 | RESIN COMPOSITION, RESIN COMPOSITION COATING, RESIN COMPOSITION FILM, CURED FILM, AND ELECTRONIC COMPONENT | 東レ株式会社 | 2023-08-10 | — | — | WO | disclosed |
| WO-2023139814-A1 | RESIN COMPOSITION, FILM, CURED MEMBRANE, SEMICONDUCTOR DEVICE, AND MULTILAYER CIRCUIT BOARD | 東レ株式会社 | 2023-07-27 | — | — | WO | disclosed |
| US-20230141241-A1 | SCINTILLATOR PANEL AND SCINTILLATOR PANEL MANUFACTURING METHOD | TORAY INDUSTRIES, INC. (JP) | 2023-05-11 | — | — | US | disclosed |
| US-11567405-B2 | Photosensitive resin composition, polymer precursor, cured film, laminate, method for producing cured film, and semiconductor device | FUJIFILM CORPORATION (JP) | 2023-01-31 | — | — | US | disclosed |
| US-20220171285-A1 | METHOD OF MANUFACTURING CURED FILM, PHOTOCURABLE RESIN COMPOSITION, METHOD OF MANUFACTURING LAMINATE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2022-06-02 | — | — | US | disclosed |
| US-11347146-B2 | Resin composition | TORAY INDUSTRIES, INC. (JP) | 2022-05-31 | — | — | US | disclosed |
| WO-2017002859-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, CURED FILM PRODUCTION METHOD AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2017-01-05 | — | — | WO | disclosed |
| EP-1744213-B1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC COMPONENT | HITACHI CHEM DUPONT MICROSYS (JP) | 2014-09-03 | — | — | EP | disclosed |
| EP-2469337-B1 | Positive photosensitive resin composition, method for forming pattern, and electronic component | HITACHI CHEM DUPONT MICROSYS (JP) | 2014-01-22 | — | — | EP | disclosed |
| US-7638254-B2 | Positive photosensitive resin composition, method for forming pattern, and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP) | 2009-12-29 | — | — | US | disclosed |
| US-7638254-B2 | Positive photosensitive resin composition, method for forming pattern, and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP) | 2009-12-29 | — | — | US | disclosed |
| US-7435525-B2 | Positive photosensitive resin composition, method for forming pattern, and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2008-10-14 | — | — | US | disclosed |
| US-7435525-B2 | Positive photosensitive resin composition, method for forming pattern, and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2008-10-14 | — | — | US | disclosed |
| US-20070122733-A1 | Positive photosensitive resin composition, method for forming pattern, and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2007-05-31 | — | — | US | disclosed |
| US-20070122733-A1 | Positive photosensitive resin composition, method for forming pattern, and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2007-05-31 | — | — | US | disclosed |
| EP-1744213-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC COMPONENT | Hitachi Chemical DuPont Microsystems Ltd. (JP) | 2007-01-17 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-11802181-B2 | Di-amine compound, and heat-resistant resin and resin composition using the same | CAD, ARID2, SMC3 | HDAC1 1226/4885MEN1 4033/4885KMT2A 1021/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.