Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HSD17B1 | P14061 | 4/20 | 0.59 |
| ▸ | HSD17B2 | P37059 | 4/20 | 0.59 |
| ▸ | GRIN2D | O15399 | 1/20 | 0.48 |
| ▸ | GRIN2A | Q12879 | 1/20 | 0.48 |
| ▸ | GRIN2B | Q13224 | 1/20 | 0.48 |
| ▸ | GRIN2C | Q14957 | 1/20 | 0.48 |
| ▸ | PLAU | P00749 | 1/20 | 0.48 |
| ▸ | CTDSP1 | Q9GZU7 | 1/20 | 0.48 |
| ▸ | CYP1A2 | P05177 | 3/20 | 0.48 |
| ▸ | ESR1 | P03372 | 2/20 | 0.46 |
| ▸ | ESR2 | Q92731 | 2/20 | 0.46 |
| ▸ | TRPM4 | Q8TD43 | 1/20 | 0.45 |
| ▸ | TLR8 | Q9NR97 | 1/20 | 0.45 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.44 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.44 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.44 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.44 |
| ▸ | MAPT | P10636 | 1/20 | 0.44 |
| ▸ | G6PD | P11413 | 1/20 | 0.44 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.44 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10054046 | 0.91 | HSD17B1 (0.59) | HSD17B1HSD17B2GRIN2DGRIN2AGRIN2B | |
| SCHEMBL5083275 | 0.89 | HSD17B1 (0.56) | HSD17B1HSD17B2GRIN2DGRIN2AGRIN2B | |
| SCHEMBL19425721 | 0.83 | HSD17B1 (0.55) | HSD17B1HSD17B2GRIN2DGRIN2AGRIN2B | |
| SCHEMBL19615843 | 0.82 | HSD17B1 (0.50) | HSD17B1HSD17B2GRIN2DGRIN2AGRIN2B | |
| SCHEMBL22743919 | 0.82 | HSD17B1 (0.46) | HSD17B1HSD17B2CYP1A2ESR2TRPM4 | |
| SCHEMBL7793914 | 0.81 | GRIN2D (0.61) | HSD17B1HSD17B2GRIN2DGRIN2AGRIN2B | |
| SCHEMBL2115683 | 0.81 | CYP1A2 (0.62) | HSD17B1HSD17B2GRIN2DGRIN2AGRIN2B | |
| SCHEMBL29857010 | 0.81 | CYP1A2 (0.62) | HSD17B1HSD17B2GRIN2DGRIN2AGRIN2B | |
| SCHEMBL7048770 | 0.79 | HSD17B1 (0.47) | HSD17B1HSD17B2GRIN2DGRIN2AGRIN2B | |
| SCHEMBL7047251 | 0.79 | HSD17B1 (0.47) | HSD17B1HSD17B2GRIN2DGRIN2AGRIN2B |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 38 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10017604-B2 | Modified phenolic resin, method for producing modified phenolic resin, modified epoxy resin, method for producing modified epoxy resin, curable resin composition, cured product of same, and printed wiring board | DIC CORPORATION (JP) | 2018-07-10 | — | — | US | disclosed |
| US-10017604-B2 | Modified phenolic resin, method for producing modified phenolic resin, modified epoxy resin, method for producing modified epoxy resin, curable resin composition, cured product of same, and printed wiring board | DIC CORPORATION (JP) | 2018-07-10 | — | — | US | disclosed |
| US-20160122269-A1 | COMPOUND CONTAINING PHENOLIC HYDROXYL GROUP, PHENOLIC RESIN, CURABLE COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, AND PRINTED CIRCUIT BOARD | DIC CORPORATION (JP) | 2016-05-05 | — | — | US | disclosed |
| US-20160122269-A1 | COMPOUND CONTAINING PHENOLIC HYDROXYL GROUP, PHENOLIC RESIN, CURABLE COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, AND PRINTED CIRCUIT BOARD | DIC CORPORATION (JP) | 2016-05-05 | — | — | US | disclosed |
| US-20160060384-A1 | MODIFIED PHENOLIC RESIN, METHOD FOR PRODUCING MODIFIED PHENOLIC RESIN, MODIFIED EPOXY RESIN, METHOD FOR PRODUCING MODIFIED EPOXY RESIN, CURABLE RESIN COMPOSITION, CURED PRODUCT OF SAME, AND PRINTED WIRING BOARD | DIC CORPORATION (JP) | 2016-03-03 | — | — | US | disclosed |
| US-20160060384-A1 | MODIFIED PHENOLIC RESIN, METHOD FOR PRODUCING MODIFIED PHENOLIC RESIN, MODIFIED EPOXY RESIN, METHOD FOR PRODUCING MODIFIED EPOXY RESIN, CURABLE RESIN COMPOSITION, CURED PRODUCT OF SAME, AND PRINTED WIRING BOARD | DIC CORPORATION (JP) | 2016-03-03 | — | — | US | disclosed |
| US-9217053-B2 | Active ester resin, thermosetting resin composition, cured product of same, semiconductor encapsulation material, prepreg, circuit board, and build-up film | DIC CORPORATION (JP) | 2015-12-22 | — | — | US | disclosed |
| US-9217053-B2 | Active ester resin, thermosetting resin composition, cured product of same, semiconductor encapsulation material, prepreg, circuit board, and build-up film | DIC CORPORATION (JP) | 2015-12-22 | — | — | US | disclosed |
| US-20150118499-A1 | ACTIVE ESTER RESIN, THERMOSETTING RESIN COMPOSITION, CURED PRODUCT OF SAME, SEMICONDUCTOR ENCAPSULATION MATERIAL, PREPREG, CIRCUIT BOARD, AND BUILD-UP FILM | DIC CORPORATION (JP) | 2015-04-30 | — | — | US | disclosed |
| US-20150118499-A1 | ACTIVE ESTER RESIN, THERMOSETTING RESIN COMPOSITION, CURED PRODUCT OF SAME, SEMICONDUCTOR ENCAPSULATION MATERIAL, PREPREG, CIRCUIT BOARD, AND BUILD-UP FILM | DIC CORPORATION (JP) | 2015-04-30 | — | — | US | disclosed |
| US-20090054585-A1 | EPOXY RESIN COMPOSITION AND CURED ARTICLE THEREOF, SEMICONDUCTOR ENCAPSULATION MATERIAL, NOVEL PHENOL RESIN, AND NOVEL EPOXY RESIN | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2009-02-26 | — | — | US | disclosed |
| US-20080255315-A1 | Epoxy Resin Composition,Cured Article Thereof, Semiconductor Sealing Material, Novel Phenol Resin, Novel Epoxy Resin,Method for Producing Novel Phenol Resin, And Method For Producing Novel Epoxy Resin | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2008-10-16 | — | — | US | disclosed |
| US-20080255315-A1 | Epoxy Resin Composition,Cured Article Thereof, Semiconductor Sealing Material, Novel Phenol Resin, Novel Epoxy Resin,Method for Producing Novel Phenol Resin, And Method For Producing Novel Epoxy Resin | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2008-10-16 | — | — | US | disclosed |
| EP-1854819-A1 | EPOXY RESIN COMPOSITION, CURED OBJECT OBTAINED THEREFROM, SEMICONDUCTOR-ENCAPSULATING MATERIAL, NOVEL PHENOLIC RESIN, AND NOVEL EPOXY RESIN | Dainippon Ink and Chemicals, Incorporated (JP) | 2007-11-14 | — | — | EP | disclosed |
| CN-1309783-C | Epoxy resin compositing, its solidification product, new-type epoxy resin, phenol compound, and its preparation method | DAINIPPON INK & CHEMICALS (JP) | 2007-04-11 | — | — | CN | disclosed |
| EP-1275673-B1 | Epoxy resin composition, cured article thereof, novel epoxy resin, novel phenol compound, and process for preparing the same | DAINIPPON INK & CHEMICALS (JP) | 2006-08-23 | — | — | EP | disclosed |
| US-6784228-B2 | HEAT RESISTANCE, WATERPROOFING, DIMENSIONAL STABILITY, MULTILAYER LAMINATE | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2004-08-31 | — | — | US | disclosed |
| US-20030092852-A1 | Epoxy resin composition, cured article thereof, novel epoxy resin, novel phenol compound, and process for preparing the same | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2003-05-15 | — | — | US | disclosed |
| CN-1414031-A | Epoxy resin compositing, its solidification product, new-type epoxy resin, phenol compound, and its preparation method | DAINIPPON INK & CHEMICALS (JP) | 2003-04-30 | — | — | CN | disclosed |
| EP-1275673-A2 | Epoxy resin composition, cured article thereof, novel epoxy resin, novel phenol compound, and process for preparing the same | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2003-01-15 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20030092852-A1 | Epoxy resin composition, cured article thereof, novel epoxy resin, novel phenol compound, and process for preparing the same | KDM5C, KDM5B, KDM4C | HSD17B1 3938/4885HSD17B2 4100/4885GRIN2D 2642/4885 |
| US-20160122269-A1 | COMPOUND CONTAINING PHENOLIC HYDROXYL GROUP, PHENOLIC RESIN, CURABLE COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, AND PRINTED CIRCUIT BOARD | ASH2L, SEM1, KDM1A | HSD17B1 906/4885HSD17B2 1591/4885GRIN2D 2463/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.