⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL20733533 | 0.79 | — | — | |
| SCHEMBL488039 | 0.77 | — | — | |
| SCHEMBL4556157 | 0.74 | — | — | |
| SCHEMBL12760684 | 0.72 | THRB (0.50) | — | |
| SCHEMBL10940757 | 0.72 | — | — | |
| SCHEMBL7164575 | 0.72 | — | — | |
| Butane SCHEMBL1268678 | 0.70 | — | — | |
| SCHEMBL14024374 | 0.69 | — | — | |
| SCHEMBL3308281 | 0.67 | — | — | |
| SCHEMBL21927809 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 115 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-112526822-B | Composition for forming silicon-containing resist underlayer film and pattern forming method | 信越化学工业株式会社 | 2025-02-28 | — | — | CN | disclosed |
| CN-112286000-B | Composition for forming silicon-containing resist underlayer film and pattern forming method | 信越化学工业株式会社 | 2024-12-03 | — | — | CN | disclosed |
| CN-116670096-B | Ceramic matrix composite and method of making the same | 东曹株式会社 | 2024-11-12 | — | — | CN | disclosed |
| CN-118891239-A | Ceramic matrix composite and method of making the same | 东曹株式会社 | 2024-11-01 | — | — | CN | disclosed |
| CN-118843724-A | Ceramic continuous fiber, method for producing same, and ceramic matrix composite material comprising same | 东曹株式会社 | 2024-10-25 | — | — | CN | disclosed |
| CN-118620392-A | Composition for forming silicon-containing resist underlayer film and pattern forming method | 信越化学工业株式会社 | 2024-09-10 | — | — | CN | disclosed |
| CN-114660896-B | Composition for forming silicon-containing resist underlayer film, pattern forming method, and silicon compound | 信越化学工业株式会社 | 2024-06-11 | — | — | CN | disclosed |
| CN-117402184-B | Preparation method of diethyl methoxyborane | 山东国邦药业有限公司 | 2024-04-26 | — | — | CN | disclosed |
| CN-117402184-A | Preparation method of diethyl methoxyborane | 山东国邦药业有限公司 | 2024-01-16 | — | — | CN | disclosed |
| CN-111458980-B | Composition for forming underlayer film of silicon-containing resist and method for forming pattern | 信越化学工业株式会社 | 2023-08-11 | — | — | CN | disclosed |
| WO-2008099903-A2 | FINE PATTERN TRANSFER MATERIAL | SHOWA DENKO K.K. (JP) | 2008-08-21 | — | — | WO | disclosed |
| US-7401884-B2 | Inkjet printhead with integral nozzle plate | SILVERBROOK RESEARCH PTY LTD (AU) | 2008-07-22 | — | — | US | disclosed |
| US-20080165226-A1 | NOZZLE ASSEMBLY HAVING A SPRUNG ELECTROMAGNETICALLY OPERATED PLUNGER | SILVERBROOK RESEARCH PTY LTD | 2008-07-10 | — | — | US | disclosed |
| US-7387365-B2 | Nozzle for an inkjet printer incorporating a plunger assembly | SILVERBROOK RESEARCH PTY LTD (AU) | 2008-06-17 | — | — | US | disclosed |
| US-20080117258-A1 | Printhead Nozzle Arrangement Incorporating A Corrugated Electrode | SILVERBROOK RESEARCH PTY LTD | 2008-05-22 | — | — | US | disclosed |
| US-7371072-B2 | Spring interconnect structures | FORMFACTOR, INC. (US) | 2008-05-13 | — | — | US | disclosed |
| CN-1950425-A | Method for producing elastomeric copolyesters | ZIMMER AG (DE) | 2007-04-18 | — | — | CN | disclosed |
| CN-1730548-A | Resin composition, method for producing same, and cured product | NIPPON CATALYTIC CHEM IND (JP) | 2006-02-08 | — | — | CN | disclosed |
| EP-0376145-A2 | Method for producing a stereoregular polyolefin | Tosoh Corporation (JP) | 1990-07-04 | — | — | EP | disclosed |
| US-4381345-A | Pretreatment of glucose feedstock with reducing agents | UOP INC. (US) | 1983-04-26 | — | — | US | disclosed |