SCHEMBL26147227

SCHEMBL26147227

O=C(CN1CCOCC1)OCC1CC2CCC1O2

nearest known ligand 0.39

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
POLB P06746 2/20 0.39
MEN1 O00255 2/20 0.39
KMT2A Q03164 2/20 0.39
KDM4E B2RXH2 4/20 0.37
HSD17B10 Q99714 2/20 0.37
ALOX15 P16050 2/20 0.36
TSHR P16473 2/20 0.36
ALDH1A1 P00352 6/20 0.36
SMN1; SMN2 Q16637 2/20 0.35
HPGD P15428 2/20 0.31
GAA P10253 1/20 0.30
NPC1 O15118 1/20 0.30
USP2 O75604 1/20 0.30
LMNA P02545 1/20 0.30
RAB9A P51151 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11989211 0.75 SLC6A4 (0.35) POLBALDH1A1LMNA
SCHEMBL12858245 0.74 KMT2A (0.39) POLBMEN1KMT2AKDM4EHSD17B10
SCHEMBL12551159 0.73 SLC6A4 (0.35) TSHRALDH1A1SMN1; SMN2
SCHEMBL18775964 0.72 PER2 (0.33)
SCHEMBL13564252 0.72 SLC6A3 (0.35) MEN1KMT2A
SCHEMBL502008 0.71 ATM (0.41) MEN1KMT2AALDH1A1SMN1; SMN2GAA
SCHEMBL14424136 0.70 ATM (0.40) MEN1KMT2AKDM4EHSD17B10ALDH1A1
SCHEMBL15826724 0.69 ALDH1A1 (0.41) MEN1KMT2AHSD17B10ALDH1A1
SCHEMBL14305160 0.68 KDM4E (0.53) POLBMEN1KMT2AKDM4EHSD17B10
SCHEMBL835061 0.67 HSD17B10 (0.52) POLBMEN1KMT2AKDM4EHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230152692-A1 CHEMICALLY AMPLIFIED RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-05-18 US disclosed
US-20230152692-A1 CHEMICALLY AMPLIFIED RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-05-18 US disclosed