SCHEMBL26313010

SCHEMBL26313010

CCC(C)(C)C(=O)Oc1cccc(C(=O)OC(CS(=O)(=O)O)C(F)(F)F)c1

nearest known ligand 0.36

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 2/20 0.36
ESR2 Q92731 2/20 0.36
DDR1 Q08345 2/20 0.34
KAT6A Q92794 4/20 0.34
NPC1 O15118 1/20 0.33
POLB P06746 1/20 0.33
CYP2C9 P11712 1/20 0.33
RAB9A P51151 1/20 0.33
KDM4E B2RXH2 1/20 0.33
MEN1 O00255 1/20 0.33
CASP3 P42574 1/20 0.33
KMT2A Q03164 1/20 0.33
SENP8 Q96LD8 1/20 0.33
SENP7 Q9BQF6 1/20 0.33
SENP6 Q9GZR1 1/20 0.33
SERPINE1 P05121 1/20 0.32
ELANE P08246 1/20 0.32
MAPK1 P28482 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25845026 0.89 ESR1 (0.38) ESR1ESR2DDR1KAT6AKDM4E
SCHEMBL25844826 0.88 ESR1 (0.37) ESR1ESR2DDR1KAT6AKDM4E
SCHEMBL26938191 0.85 ESR1 (0.36) ESR1ESR2DDR1KAT6ANPC1
SCHEMBL15216266 0.84 ESR1 (0.37) ESR1ESR2DDR1KAT6ANPC1
SCHEMBL26312797 0.82 ELANE (0.38) ESR1ESR2DDR1KAT6AKDM4E
SCHEMBL23426243 0.82 KAT6A (0.34) ESR1ESR2KAT6AKDM4EMEN1
SCHEMBL25476726 0.82 TSHR (0.30)
SCHEMBL26313009 0.79 GABRA1 (0.34)
SCHEMBL18775731 0.79 MAPK1 (0.40) DDR1NPC1RAB9AKDM4EMEN1
SCHEMBL18775853 0.77 PARP1 (0.40) RAB9AKDM4EKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230296981-A1 RESIST MATERIAL AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-21 US disclosed
US-20230296980-A1 RESIST MATERIAL AND PATTERN FORMING METHOD SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-21 US disclosed
US-20230273519-A1 RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMATION METHOD JSR CORPORATION (JP) 2023-08-31 US disclosed