SCHEMBL2631458

SCHEMBL2631458

CCC1(OC(=O)C(C)C(C)C)C2CC3CC(C2)CC1C3

nearest known ligand 0.36

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.31
LMNA P02545 1/20 0.30
HSD11B1 P28845 2/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9608680 0.86 ALDH1A1 (0.33) ALDH1A1LMNAHSD11B1
SCHEMBL25619192 0.83 ALDH1A1 (0.31) ALDH1A1LMNAHSD11B1
SCHEMBL683427 0.83 ALDH1A1 (0.34) ALDH1A1LMNAHSD11B1
SCHEMBL26939426 0.82 HSD11B1 (0.33) ALDH1A1HSD11B1
SCHEMBL14539797 0.80
SCHEMBL12425735 0.79 CYP17A1 (0.39)
SCHEMBL19261148 0.79 ALDH1A1 (0.33) ALDH1A1
SCHEMBL950003 0.78
SCHEMBL13094605 0.77 ALDH1A1 (0.36) ALDH1A1LMNAHSD11B1
SCHEMBL953131 0.77

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8158326-B2 Photosensitive composition, compound for use in the photosensitive composition, and method of pattern formation with the photosensitive composition FUJIFILM CORPORATION (JP) 2012-04-17 US disclosed
US-8017302-B2 Positive resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2011-09-13 US disclosed
US-20090186297-A1 POSITIVE RESIST COMPOSITIONS AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2009-07-23 US disclosed
US-20090075202-A1 PHOTOSENSITIVE COMPOSITION, COMPOUND FOR USE IN THE PHOTOSENSITIVE COMPOSITION, AND METHOD OF PATTERN FORMATION WITH THE PHOTOSENSITIVE COMPOSITION FUJIFILM CORPORATION (JP) 2009-03-19 US disclosed
US-20080008959-A1 Resin comprising monomers of cyclopentyl- or cyclohexyl (meth)acrylate; hydroxyadamantyl (meth)acrylate; 3,8-epoxy-6-oxabicyclo[3.2.1]octyl (meth)acrylat;, and/or fluoroalkyl (meth)acrylate; ArF lithography; resolution; forms a pattern with high rectangularity SHIN-ETSU CHEMICAL CO., LTD. (JP) 2008-01-10 US disclosed