SCHEMBL2631734

SCHEMBL2631734

CC(=O)C1C2CC(C=C2C)C1C(=O)O

nearest known ligand 0.41

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
POLB P06746 5/20 0.41
TDP1 Q9NUW8 4/20 0.41
APEX1 P27695 1/20 0.41
ALDH1A1 P00352 4/20 0.36
LMNA P02545 3/20 0.36
HTT P42858 1/20 0.34
MEN1 O00255 2/20 0.31
KMT2A Q03164 2/20 0.31
SMN1; SMN2 Q16637 1/20 0.30
RAB9A P51151 1/20 0.30
KDM4E B2RXH2 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3278424 0.91 POLB (0.40) POLBTDP1APEX1ALDH1A1LMNA
SCHEMBL10588584 0.83 POLB (0.34) POLBTDP1APEX1ALDH1A1LMNA
SCHEMBL13518155 0.81 POLB (0.41) POLBMEN1KMT2AKDM4E
SCHEMBL11223520 0.80 POLB (0.41) POLBTDP1APEX1ALDH1A1LMNA
SCHEMBL9743683 0.79 POLB (0.34) POLBTDP1APEX1ALDH1A1LMNA
SCHEMBL13517077 0.78 POLB (0.41) POLB
SCHEMBL13517960 0.78 SLC6A4 (0.39)
SCHEMBL13517923 0.74 SLC6A4 (0.39)
SCHEMBL19204434 0.74 GAA (0.45) POLBTDP1ALDH1A1LMNAMEN1
SCHEMBL13517581 0.71 RAB9A (0.40) POLBALDH1A1LMNAHTTSMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20120100484-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INTERLAYER INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY ELEMENT USING THE SAME SUMITOMO BAKELITE CO., LTD. (JP) 2012-04-26 US disclosed
US-20110118375-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTING FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE USING THE SAME SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-05-19 US disclosed
EP-2280309-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE EACH COMPRISING THE CURED FILM Sumitomo Bakelite Co., Ltd. (JP) 2011-02-02 EP disclosed
US-20100193971-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION FOR SPRAY COATING, METHOD FOR FORMING CURED FILM USING THE SAME, CURED FILM, AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE COMPANY LIMITED (JP) 2010-08-05 US disclosed
US-20100062273-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, SEMICONDUCTOR DEVICE AND DISPLAY DEVICE USING THE SAME SUMITOMO BAKELITE CO., LTD (JP) 2010-03-11 US disclosed
US-7368205-B2 Polyamide resin, positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device SUMITOMO BAKELITE CO., LTD. (JP) 2008-05-06 US disclosed