SCHEMBL26612976

SCHEMBL26612976

CCC=CC(=O)OCCOC(C)(C)C

nearest known ligand 0.42

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
ATM Q13315 1/20 0.42
HCAR2 Q8TDS4 6/20 0.40
MAPT P10636 2/20 0.36
THRB P10828 1/20 0.34
APP P05067 4/20 0.33
RAB9A P51151 1/20 0.33
NPSR1 Q6W5P4 1/20 0.33
ALDH1A1 P00352 3/20 0.33
TSHR P16473 3/20 0.32
HPGD P15428 1/20 0.32
TP53 P04637 2/20 0.31
HIF1A Q16665 2/20 0.31
HSD17B10 Q99714 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25622958 0.79 HCAR2 (0.50) ATMHCAR2MAPTTHRBRAB9A
SCHEMBL12594176 0.79 HCAR2 (0.60) ATMHCAR2MAPTRAB9ANPSR1
SCHEMBL534938 0.79 ATM (0.47) ATMHCAR2MAPTAPPRAB9A
SCHEMBL9561910 0.78 HCAR2 (0.63) ATMHCAR2MAPTAPPRAB9A
SCHEMBL691276 0.78 HCAR2 (0.63) ATMHCAR2MAPTAPPRAB9A
SCHEMBL691277 0.78 HCAR2 (0.63) ATMHCAR2MAPTAPPRAB9A
SCHEMBL19055835 0.78 ATM (0.38) ATMHCAR2MAPTTHRBRAB9A
SCHEMBL3390981 0.77 ALDH1A1 (0.52) ATMHCAR2MAPTTHRBAPP
SCHEMBL181611 0.77 ATM (0.45) ATMHCAR2MAPTAPPRAB9A
SCHEMBL14765609 0.76 ATM (0.41) ATMHCAR2MAPTTHRBRAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230408921-A1 Polymerizable Monomer, Polymer Compound, Resist Composition, And Patterning Process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-12-21 US disclosed
EP-4273624-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, INTERLAYER INSULATING FILM, SURFACE PROTECTION FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-11-08 EP disclosed
US-20230350294-A1 Negative Photosensitive Resin Composition, Patterning Process, Interlayer Insulating Film, Surface Protection Film, And Electronic Component SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-11-02 US disclosed