SCHEMBL268415

SCHEMBL268415

C=CC(=O)OCC(CC)(CCCC)COC(=O)C=C

nearest known ligand 0.55

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
TSHR P16473 8/20 0.55
ALDH1A1 P00352 5/20 0.55
TP53 P04637 3/20 0.55
HIF1A Q16665 3/20 0.55
CYP3A4 P08684 2/20 0.55
MAPK1 P28482 1/20 0.55
SMN1; SMN2 Q16637 1/20 0.55
HPGD P15428 1/20 0.55
THRB P10828 4/20 0.54
HSD17B10 Q99714 1/20 0.37
ATM Q13315 1/20 0.36
THRA P10827 1/20 0.33
HCAR2 Q8TDS4 3/20 0.33
ZDHHC20 Q5W0Z9 1/20 0.33
ZDHHC2 Q9UIJ5 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4096763 0.97 TSHR (0.55) TSHRALDH1A1TP53HIF1ACYP3A4
SCHEMBL227181 0.92 ALDH1A1 (0.64) TSHRALDH1A1TP53HIF1ACYP3A4
SCHEMBL27829221 0.90 THRB (0.46) TSHRALDH1A1TP53HIF1ACYP3A4
SCHEMBL12264265 0.89 ALDH1A1 (0.58) TSHRALDH1A1TP53HIF1ACYP3A4
SCHEMBL18812856 0.89 THRB (0.51) TSHRALDH1A1TP53HIF1ACYP3A4
SCHEMBL12221401 0.87 THRB (0.50) TSHRALDH1A1TP53HIF1ACYP3A4
SCHEMBL21392010 0.86 TSHR (0.55) TSHRALDH1A1TP53HIF1ACYP3A4
SCHEMBL10005425 0.85 THRB (0.44) TSHRALDH1A1TP53HIF1ACYP3A4
SCHEMBL15997720 0.85 ALDH1A1 (0.50) TSHRALDH1A1TP53HIF1ACYP3A4
SCHEMBL238953 0.85 THRB (0.70) TSHRALDH1A1TP53HIF1ACYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 739 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119684661-B Pressure-resistant thermal expansion microcapsule and preparation method thereof 中国科学院大连化学物理研究所 2026-05-19 CN claimed
CN-118126400-B High-temperature-resistant thermal expansion microsphere and preparation method and application thereof 山东飞皮新材料科技有限公司 2026-05-19 CN claimed
CN-117777165-B Photosensitive polyimide oligomer, preparation method and polyimide photosensitive resin composition prepared from photosensitive polyimide oligomer 信联聚科(上海)新材料有限公司 2026-05-15 CN claimed
US-20250326191-A1 METHOD FOR PRODUCING A SHAPED THERMOPLASTIC COMPOSITE, A SHAPED THERMOPLASTIC COMPOSITE AND SYSTEM FOR PRODUCING A SHAPED THERMOPLASTIC COMPOSITE ARKEMA FRANCE (FR) 2025-10-23 US claimed
EP-4110306-B1 RADIATION CURABLE PHASE CHANGE MATERIAL SOLUTIONS AND SHAPE STABLE THERMOSET PHASE CHANGE MATERIAL GELS FORMED THEREFROM MICROTEK HOLDINGS INC (US) 2025-07-23 EP claimed
US-20250197545-A1 (METH)ACRYLIC COMPOSITION, POLYMERIC COMPOSITE MATERIAL OBTAINED FROM SUCH A COMPOSITION, METHOD FOR PRODUCING SAID COMPOSITION AND MATERIAL, AND USES THEREOF ARKEMA FRANCE (FR) 2025-06-19 US claimed
CN-120157706-A Reactive flame retardant for transparent resin and flame-retardant acrylic resin 深圳职业技术大学 2025-06-17 CN claimed
CN-120118637-A Nanocellulose-enhanced photovoltaic packaging adhesive film, and preparation method and application thereof 陕西华拓新能源材料科技有限公司 2025-06-10 CN claimed
CN-120059631-A Photovoltaic packaging adhesive film and preparation method and application thereof 陕西华拓新能源材料科技有限公司 2025-05-30 CN claimed
CN-119979038-A Laminated battery packaging adhesive film, preparation method thereof and laminated battery assembly 杭州福斯特应用材料股份有限公司 2025-05-13 CN claimed
CN-115058215-A High-refraction photovoltaic module packaging adhesive film and preparation method and application thereof 万华化学集团股份有限公司 2022-09-16 CN claimed
CN-114874395-A High-temperature-resistant organic infiltration sealing material and preparation method thereof 南京艾布纳密封技术股份有限公司 2022-08-09 CN claimed
US-11400741-B2 Group IV metal chelates and their use in radiation curable ink and coating compositions SUN CHEMICAL CORPORATION (US) 2022-08-02 US claimed
CN-114685790-A Polymer, composition containing same, and polysiloxane-polyimide material 财团法人工业技术研究院 2022-07-01 CN claimed
US-20220204705-A1 POLYMER, COMPOSITION, AND POLYSILOXANE-POLYIMIDE MATERIAL THEREOF INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2022-06-30 US claimed
CN-114512562-A Double-glass assembly, packaging method thereof and electronic component 福斯特(嘉兴)新材料有限公司 2022-05-17 CN claimed
CN-114335254-A Photovoltaic module, online packaging method thereof and electronic component 浙江福斯特新材料研究院有限公司 2022-04-12 CN claimed
CN-111892878-B Method for preparing surface pre-crosslinked adhesive film and surface pre-crosslinked adhesive film prepared by method 3M创新有限公司 2022-03-04 CN claimed
EP-1958981-B1 BARRIER LAMINATE, BARRIER FILM SUBSTRATE, METHODS FOR PRODUCING THEM, AND DEVICE FUJIFILM CORP (JP) 2018-04-25 EP claimed
EP-1940984-B1 DUAL CURE COMPOSITION PERSTORP SPECIALTY CHEM AB (SE) 2013-07-03 EP claimed