SCHEMBL2686247

SCHEMBL2686247

CC1(C)CC(C)(c2ccc(N)cc2)c2cc(N)c(N)cc21

nearest known ligand 0.41

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
CYP19A1 P11511 2/20 0.41
FSHR P23945 1/20 0.36
ALDH1A1 P00352 3/20 0.33
L3MBTL1 Q9Y468 1/20 0.33
ATM Q13315 1/20 0.32
LMNA P02545 2/20 0.32
KDM4E B2RXH2 1/20 0.32
MEN1 O00255 1/20 0.32
MAPT P10636 1/20 0.32
OPRK1 P41145 1/20 0.32
KMT2A Q03164 1/20 0.32
SMN1; SMN2 Q16637 1/20 0.32
PKM P14618 1/20 0.31
HTR6 P50406 1/20 0.31
POLB P06746 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9843842 0.87 TDP1 (0.34) ALDH1A1MEN1KMT2ASMN1; SMN2
SCHEMBL27224482 0.86 FSHR (0.40) CYP19A1FSHRALDH1A1L3MBTL1ATM
SCHEMBL15427803 0.86 FSHR (0.42) FSHRALDH1A1ATMMEN1MAPT
SCHEMBL29409547 0.86 FSHR (0.42) CYP19A1FSHRALDH1A1L3MBTL1ATM
SCHEMBL137367 0.86 FSHR (0.42) CYP19A1FSHRALDH1A1L3MBTL1ATM
SCHEMBL140434 0.86 FSHR (0.42) CYP19A1FSHRALDH1A1L3MBTL1LMNA
SCHEMBL29374824 0.86 FSHR (0.42) CYP19A1FSHRALDH1A1L3MBTL1LMNA
SCHEMBL27908100 0.84 FSHR (0.41) CYP19A1FSHRALDH1A1L3MBTL1LMNA
SCHEMBL27926236 0.84 FSHR (0.41) CYP19A1FSHRALDH1A1L3MBTL1ATM
SCHEMBL24684596 0.81 RXRA (0.43) CYP19A1ALDH1A1ATMMEN1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 54 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7416830-B2 Photosensitive resin compositions FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2008-08-26 US claimed
US-20060063095-A9 Novel photosensitive resin compositions ARCH SPECIALTY CHEMICALS, INC. 2006-03-23 US claimed
US-20050181297-A1 Novel photosensitive resin compositions ARCH SPECIALTY CHEMICALS, INC. 2005-08-18 US claimed
US-9519216-B2 Positive photosensitive resin compositions FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2016-12-13 US disclosed
EP-1636648-B1 NOVEL POSITIVE PHOTOSENSITIVE RESIN COMPOSITIONS FUJIFILM ELECTRONIC MATERIALS (US) 2015-08-12 EP disclosed
EP-1636649-B1 NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS FUJIFILM ELECTRONIC MATERIALS (US) 2014-08-13 EP disclosed
US-8530003-B2 Polybenzoxazole precursor, photosensitive resin composition using the same, and manufacturing method of semiconductor device FUJIFILM CORPORATION (JP) 2013-09-10 US disclosed
US-20120115333-A1 POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2012-05-10 US disclosed
WO-2009099954-A1 NOVEL POSITIVE PHOTOSENSITIVE RESIN COMPOSITIONS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2009-08-13 WO disclosed
US-20090197067-A1 Novel Positive Photosensitive Resin Compositions FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2009-08-06 US disclosed
US-20090111050-A1 Novel Photosensitive Resin Compositions FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2009-04-30 US disclosed
WO-2004111726-A2 NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2004-12-23 WO disclosed
US-20040253542-A1 Novel positive photosensitive resin compositions ARCH SPECIALTY CHEMICALS, INC. 2004-12-16 US disclosed
US-20040253537-A1 Novel photosensitive resin compositions ARCH SPECIALTY CHEMICALS, INC. 2004-12-16 US disclosed
EP-1171802-A4 NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS ARCH SPEC CHEM INC (US) 2002-03-13 EP disclosed
EP-1171802-A1 NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS Arch Specialty Chemicals, Inc. (US) 2002-01-16 EP disclosed
US-6214516-B1 HEAT CURABLE SOLUTION OF POLYBENZOXAZOLE PRECURSOR POLYAMIDE, PHOTOSENSITIVE AGENT, AND A SILANEDIOL SOLUBILITY INHIBITOR ARCH SPECIALTY CHEMICALS, INC. 2001-04-10 US disclosed
US-6177225-B1 COMPRISING A CAPPED POLYBENZOXAZOLE PRECURSOR POLYMER, A PHOTOSENSITIVE AGENT, AND A SOLVENT ARCH SPECIALTY CHEMICALS, INC. 2001-01-23 US disclosed
US-6127086-A POSITIVE COMPOSITION COMPRISING SILANEDIOL, CAPPED POLYBENOXAZOLE PRECURSOR, PHOTOSENSITIVE AGENT, SOLVENT ARCH SPECIALTY CHEMICALS, INC. (US) 2000-10-03 US disclosed
WO-2000019275-A1 NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS ARCH SPECIALTY CHEMICALS, INC. (US) 2000-04-06 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20120115333-A1 POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE CD79B, BRIX1, SMARCB1 CYP19A1 299/4885FSHR 4254/4885ALDH1A1 1563/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.