Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Acrylic Acid SCHEMBL28493210 | 0.92 | LMNA (0.32) | — | |
| SCHEMBL28824549 | 0.81 | ALDH1A1 (0.34) | EPHX1 | |
| SCHEMBL6250642 | 0.78 | EPHX1 (0.33) | EPHX1 | |
| SCHEMBL10578670 | 0.77 | CYP19A1 (0.31) | CYP19A1EPHX1 | |
| SCHEMBL4362942 | 0.77 | EPHX1 (0.35) | EPHX1 | |
| SCHEMBL5668515 | 0.74 | — | — | |
| Methacrylic Acid SCHEMBL6987555 | 0.70 | ALDH1A1 (0.31) | — | |
| SCHEMBL28583504 | 0.69 | EPHX1 (0.32) | EPHX1 | |
| SCHEMBL6520311 | 0.68 | NAAA (0.40) | CYP19A1EPHX1 | |
| Methacrylic Acid SCHEMBL1455593 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9469763-B2 | Photo-curable organic-inorganic hybrid resin composition | DONGJIN SEMICHEM CO., LTD. (KR) | 2016-10-18 | — | — | US | claimed |
| US-9239518-B2 | Photosensitive resin composition and method of forming pattern using the same | SAMSUNG DISPLAY CO., LTD. (KR) | 2016-01-19 | — | — | US | claimed |
| US-20140234776-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN USING THE SAME | SAMSUNG DISPLAY CO., LTD. (KR) | 2014-08-21 | — | — | US | claimed |
| US-20140212809-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN USING THE SAME | SAMSUNG DISPLAY CO., LTD. (KR) | 2014-07-31 | — | — | US | claimed |
| US-20140135413-A1 | PHOTO-CURABLE ORGANIC-INORGANIC HYBRID RESIN COMPOSITION | DONGJIN SEMICHEM CO., LTD. (KR) | 2014-05-15 | — | — | US | claimed |
| US-8278021-B2 | Method of fabricating a thin film transistor substrate and a photosensitive composition used in the thin film transistor substrate | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2012-10-02 | — | — | US | claimed |
| US-20090030103-A1 | METHOD OF FABRICATING A THIN FILM TRANSISTOR SUBSTRATE AND A PHOTOSENSITIVE COMPOSITION USED IN THE THIN FILM TRANSISTOR SUBSTRATE | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2009-01-29 | — | — | US | claimed |
| US-7101650-B2 | Photosensitive resin composition for photoresist | DONGJIN SEMICHEM CO., LTD. (KR) | 2006-09-05 | — | — | US | claimed |
| US-20050042536-A1 | Photosensitive resin composition comprising quinonediazide sulfate ester compound | DONGJIN SEMICHEM CO. LTD. (KR) | 2005-02-24 | — | — | US | claimed |
| US-20040248030-A1 | Photosensitive resin composition for photoresist | DONGJIN SEMICHEM CO., LTD. (KR) | 2004-12-09 | — | — | US | claimed |
| WO-2003036388-A1 | PHOTOSNESITIVE RESIN COMPOSITION COMPRISING QUINONEDIAZIDE SULFATE ESTER COMPOUND | DONGJIN SEMICHEM CO., LTD. (KR) | 2003-05-01 | — | — | WO | claimed |
| WO-2003017001-A1 | PHOTOSENSITIVE RESIN COMPOSITION FOR PHOTORESIST | DONGJIN SEMICHEM CO., LTD. (KR) | 2003-02-27 | — | — | WO | claimed |
| US-9469763-B2 | Photo-curable organic-inorganic hybrid resin composition | DONGJIN SEMICHEM CO., LTD. (KR) | 2016-10-18 | — | — | US | disclosed |
| CN-103732689-B | Light-cured type organic inorganic hybridization resin combination | DONGJIN SEMICHEM CO.,LTD. (KR) | 2016-05-18 | — | — | CN | disclosed |
| US-9239518-B2 | Photosensitive resin composition and method of forming pattern using the same | SAMSUNG DISPLAY CO., LTD. (KR) | 2016-01-19 | — | — | US | disclosed |
| US-8936744-B2 | Photocurable resin composition containing fluorine and method for producing a resin mold using same | DONGJIN SEMICHEM CO., LTD. (KR) | 2015-01-20 | — | — | US | disclosed |
| US-20040248030-A1 | Photosensitive resin composition for photoresist | DONGJIN SEMICHEM CO., LTD. (KR) | 2004-12-09 | — | — | US | disclosed |
| WO-2003036388-A1 | PHOTOSNESITIVE RESIN COMPOSITION COMPRISING QUINONEDIAZIDE SULFATE ESTER COMPOUND | DONGJIN SEMICHEM CO., LTD. (KR) | 2003-05-01 | — | — | WO | disclosed |
| WO-2003017001-A1 | PHOTOSENSITIVE RESIN COMPOSITION FOR PHOTORESIST | DONGJIN SEMICHEM CO., LTD. (KR) | 2003-02-27 | — | — | WO | disclosed |
| US-6509494-B1 | Distillation mixture of dicyclopentenyl esters | ROHM AND HAAS COMPANY | 2003-01-21 | — | — | US | disclosed |