SCHEMBL2701904

SCHEMBL2701904

CCO[C](C)C1CCCCC1

nearest known ligand 0.47

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 8/20 0.47
MEN1 O00255 1/20 0.40
KMT2A Q03164 1/20 0.40
THRB P10828 1/20 0.38
ATM Q13315 1/20 0.38
L3MBTL1 Q9Y468 1/20 0.38
HTT P42858 2/20 0.36
SMN1; SMN2 Q16637 1/20 0.36
CHRM1 P11229 2/20 0.35
LMNA P02545 1/20 0.35
HSD17B10 Q99714 1/20 0.35
CES2 O00748 1/20 0.35
CES1 P23141 1/20 0.35
POLB P06746 1/20 0.34
ELANE P08246 1/20 0.34
TSHR P16473 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17801399 0.87
SCHEMBL2700536 0.82 ALDH1A1 (0.37) ALDH1A1MEN1KMT2ACES2CES1
SCHEMBL507070 0.79 ALDH1A1 (0.46) ALDH1A1MEN1KMT2ATHRBATM
Hydrochloric Acid SCHEMBL506728 0.77 ALDH1A1 (0.44) ALDH1A1MEN1KMT2ATHRBATM
SCHEMBL27925979 0.77 NAAA (0.42) ALDH1A1CES2TSHR
SCHEMBL15661040 0.76 ALDH1A1 (0.43) ALDH1A1MEN1KMT2ATHRBATM
SCHEMBL18888 0.74 ALDH1A1 (0.71) ALDH1A1MEN1KMT2AHTTSMN1; SMN2
SCHEMBL9806822 0.74 ALDH1A1 (0.71) ALDH1A1MEN1KMT2AHTTSMN1; SMN2
SCHEMBL11807272 0.74 ALDH1A1 (0.71) ALDH1A1MEN1KMT2AHTTSMN1; SMN2
Hydrochloric Acid SCHEMBL19718051 0.74 ALDH1A1 (0.42) ALDH1A1MEN1KMT2ATHRBATM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-103019032-B Photosensitive resin composition, the forming method of cured film, cured film, organic EL display and liquid crystal display device 富士胶片株式会社 2018-01-23 CN disclosed
CN-102725692-B Photosensitive resin composition, method for forming cured film, cured film, organic EL display device, and liquid crystal display device FUJIFILM CORP 2015-04-15 CN disclosed
EP-2447773-B1 Method for producing a pattern, method for producing a MEMS structure, use of a cured film of a photosensitive composition as a sacrificial layer or as a component of a MEMS structure FUJIFILM CORP (JP) 2013-07-10 EP disclosed
CN-103019032-A Photosensitive resin composition, method of producing cured film, cured film, organic el display device, and liquid crystal display device FUJIFILM CORP 2013-04-03 CN disclosed
CN-102725692-A Photosensitive resin composition, method for forming cured film, cured film, organic EL display device, and liquid crystal display device FUJIFILM CORP 2012-10-10 CN disclosed
US-20120107563-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERN, MEMS STRUCTURE, METHOD FOR PRODUCING THE STRUCTURE, METHOD FOR DRY ETCHING, METHOD FOR WET ETCHING, MEMS SHUTTER DEVICE, AND IMAGE DISPLAY APPARATUS FUJIFILM CORPORATION (JP) 2012-05-03 US disclosed
EP-2447773-A1 Photosensitive resin composition, method for producing pattern, MEMS structure, method for producing the structure, method for dry etching, method for wet etching, MEMS shutter device, and image display apparatus Fujifilm Corporation (JP) 2012-05-02 EP disclosed