Predicted protein targets (top 11)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP1A2 | P05177 | 7/20 | 0.52 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.52 |
| ▸ | HPGD | P15428 | 2/20 | 0.52 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.52 |
| ▸ | CYP2A6 | P11509 | 4/20 | 0.47 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.35 |
| ▸ | TSHR | P16473 | 1/20 | 0.35 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.35 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.35 |
| ▸ | HSD17B1 | P14061 | 1/20 | 0.32 |
| ▸ | HSD17B2 | P37059 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1310416 | 0.92 | CYP1A2 (0.47) | CYP1A2ALDH1A1HPGDHSD17B10CYP2A6 | |
| SCHEMBL27639104 | 0.80 | CYP1A2 (0.52) | CYP1A2ALDH1A1HPGDHSD17B10CYP2A6 | |
| SCHEMBL9169786 | 0.79 | CYP2A6 (0.34) | CYP1A2ALDH1A1HPGDHSD17B10CYP2A6 | |
| SCHEMBL29069153 | 0.79 | CYP1A2 (0.42) | CYP1A2ALDH1A1HPGDHSD17B10CYP2A6 | |
| SCHEMBL29069161 | 0.79 | HSD17B1 (0.31) | CYP1A2ALDH1A1HPGDHSD17B10HSD17B1 | |
| SCHEMBL2251412 | 0.79 | ALDH1A1 (0.42) | CYP1A2ALDH1A1HPGDHSD17B10CYP3A4 | |
| SCHEMBL5751424 | 0.79 | GABRA1 (0.34) | CYP1A2ALDH1A1HPGDHSD17B10 | |
| SCHEMBL2256014 | 0.79 | KDM4E (0.46) | ALDH1A1HPGDHSD17B10 | |
| SCHEMBL2251540 | 0.79 | MCL1 (0.47) | CYP1A2ALDH1A1HPGDHSD17B10CYP2A6 | |
| SCHEMBL1921671 | 0.79 | ALDH1A1 (0.32) | ALDH1A1HPGDCYP2A6 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3064997-B1 | LAMINATE AND USE OF A KIT FOR MANUFACTURING OF A LAMINATE | FUJIFILM CORP (JP) | 2021-04-28 | — | — | EP | disclosed |
| US-10833272-B2 | Laminate and kit | FUJIFILM CORPORATION (JP) | 2020-11-10 | — | — | US | disclosed |
| CN-105683835-B | Laminated body, organic semiconductor manufacture are manufactured with set group and organic semiconductor uses light resistance composition | 富士胶片株式会社 | 2019-11-26 | — | — | CN | disclosed |
| US-10439139-B2 | — | — | 2019-10-08 | — | — | US | disclosed |
| CN-105474099-B | Laminated body | 富士胶片株式会社 | 2019-09-03 | — | — | CN | disclosed |
| US-9929376-B2 | Laminate, kit for manufacturing organic semiconductor, and resist composition for manufacturing organic semiconductor | FUJIFILM CORPORATION (JP) | 2018-03-27 | — | — | US | disclosed |
| US-20180040824-A1 | LAMINATE AND KIT | FUJIFILM CORPORATION (JP) | 2018-02-08 | — | — | US | disclosed |
| US-9746771-B2 | Laminate body | FUJIFILM CORPORATION (JP) | 2017-08-29 | — | — | US | disclosed |
| EP-3064997-A1 | LAMINATE, ORGANIC-SEMICONDUCTOR MANUFACTURING KIT, AND RESIST COMPOSITION FOR MANUFACTURING ORGANIC SEMICONDUCTOR | Fujifilm Corporation (JP) | 2016-09-07 | — | — | EP | disclosed |
| US-20160240816-A1 | LAMINATE, KIT FOR MANUFACTURING ORGANIC SEMICONDUCTOR, AND RESIST COMPOSITION FOR MANUFACTURING ORGANIC SEMICONDUCTOR | FUJIFILM CORPORATION (JP) | 2016-08-18 | — | — | US | disclosed |
| EP-3037880-A1 | LAMINATE BODY | Fujifilm Corporation (JP) | 2016-06-29 | — | — | EP | disclosed |
| US-20160170303-A1 | LAMINATE BODY | FUJIFILM CORPORATION (JP) | 2016-06-16 | — | — | US | disclosed |
| US-8728716-B2 | Resin pattern, method for producing the pattern, method for producing MEMS structure, method for manufacturing semiconductor device, and method for producing plated pattern | FUJIFILM CORPORATION (JP) | 2014-05-20 | — | — | US | disclosed |
| EP-2447773-B1 | Method for producing a pattern, method for producing a MEMS structure, use of a cured film of a photosensitive composition as a sacrificial layer or as a component of a MEMS structure | FUJIFILM CORP (JP) | 2013-07-10 | — | — | EP | disclosed |
| US-20120231396-A1 | RESIN PATTERN, METHOD FOR PRODUCING THE PATTERN, METHOD FOR PRODUCING MEMS STRUCTURE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING PLATED PATTERN | FUJIFILM CORPORATION (JP) | 2012-09-13 | — | — | US | disclosed |
| EP-2498133-A2 | Resin pattern, method for producing the pattern, method for producing MEMS structure, method for manufacturing semiconductor device, and method for producing plated pattern | Fujifilm Corporation (JP) | 2012-09-12 | — | — | EP | disclosed |
| US-20120107563-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERN, MEMS STRUCTURE, METHOD FOR PRODUCING THE STRUCTURE, METHOD FOR DRY ETCHING, METHOD FOR WET ETCHING, MEMS SHUTTER DEVICE, AND IMAGE DISPLAY APPARATUS | FUJIFILM CORPORATION (JP) | 2012-05-03 | — | — | US | disclosed |
| EP-2447773-A1 | Photosensitive resin composition, method for producing pattern, MEMS structure, method for producing the structure, method for dry etching, method for wet etching, MEMS shutter device, and image display apparatus | Fujifilm Corporation (JP) | 2012-05-02 | — | — | EP | disclosed |
| US-20060293503-A1 | Polyaminopyridines and method for producing same | SUMITOMO SEIKA CHEMICALS CO., LTD (JP) | 2006-12-28 | — | — | US | disclosed |
| EP-1669390-A1 | POLYAMINOPYRIDINES AND METHOD FOR PRODUCING SAME | SUMITOMO SEIKA CHEMICALS CO., LTD. (JP) | 2006-06-14 | — | — | EP | disclosed |