Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP1A2 | P05177 | 1/20 | 0.43 |
| ▸ | NFE2L2 | Q16236 | 1/20 | 0.39 |
| ▸ | SIGMAR1 | Q99720 | 3/20 | 0.36 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.33 |
| ▸ | EPHX1 | P07099 | 1/20 | 0.33 |
| ▸ | HPGD | P15428 | 2/20 | 0.32 |
| ▸ | ADH1B | P00325 | 1/20 | 0.31 |
| ▸ | ADH1C | P00326 | 1/20 | 0.31 |
| ▸ | ADH1A | P07327 | 1/20 | 0.31 |
| ▸ | ADH4 | P08319 | 1/20 | 0.31 |
| ▸ | ADH7 | P40394 | 1/20 | 0.31 |
| ▸ | MEN1 | O00255 | 1/20 | 0.31 |
| ▸ | MAPT | P10636 | 1/20 | 0.31 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.31 |
| ▸ | ATM | Q13315 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6178915 | 0.88 | — | — | |
| SCHEMBL5215899 | 0.85 | CYP1A2 (0.48) | CYP1A2SIGMAR1EPHX1HPGD | |
| SCHEMBL15226795 | 0.83 | CYP1A2 (0.40) | CYP1A2NFE2L2SIGMAR1SMN1; SMN2EPHX1 | |
| SCHEMBL73403 | 0.77 | ADH1B (0.40) | CYP1A2NFE2L2SIGMAR1EPHX1HPGD | |
| SCHEMBL683416 | 0.77 | NFE2L2 (0.39) | CYP1A2NFE2L2SIGMAR1EPHX1HPGD | |
| SCHEMBL27705383 | 0.77 | ADH1B (0.40) | CYP1A2NFE2L2SIGMAR1EPHX1HPGD | |
| SCHEMBL5543967 | 0.77 | ADH1B (0.40) | CYP1A2NFE2L2SIGMAR1EPHX1HPGD | |
| SCHEMBL5229 | 0.76 | CYP1A2 (0.36) | CYP1A2ADH1BADH1CADH1AADH4 | |
| SCHEMBL5385 | 0.76 | CYP1A2 (0.36) | CYP1A2ADH1BADH1CADH1AADH4 | |
| SCHEMBL4977 | 0.76 | CYP1A2 (0.36) | CYP1A2ADH1BADH1CADH1AADH4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024101411-A1 | CURABLE COMPOSITION FOR ORGANIC EL ELEMENTS, CURED PRODUCT FOR ORGANIC EL ELEMENTS AND METHOD FOR PRODUCING SAME, ORGANIC EL ELEMENT, AND POLYMER | JSR株式会社 | 2024-05-16 | — | — | WO | disclosed |
| WO-2023080254-A1 | POSITIVE-ACTING PHOTOSENSITIVE RESIN COMPOSITION | 株式会社レゾナック | 2023-05-11 | — | — | WO | disclosed |
| US-20230120542-A1 | PHOTO-DECOMPOSABLE COMPOUND, PHOTORESIST COMPOSITION INCLUDING THE SAME, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE | SAMSUNG ELECTRONICS CO LTD (KR) | 2023-04-20 | — | — | US | disclosed |
| WO-2022255171-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND ORGANIC EL ELEMENT PARTITION | 昭和電工株式会社 | 2022-12-08 | — | — | WO | disclosed |
| US-20210240078-A1 | PHOTO-DECOMPOSABLE COMPOUND, PHOTORESIST COMPOSITION INCLUDING THE SAME, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2021-08-05 | — | — | US | disclosed |
| US-10289001-B2 | Pattern forming method, etching method and method for producing capacitance-type input device | FUJIFILM CORPORATION (JP) | 2019-05-14 | — | — | US | disclosed |
| US-20190011833-A1 | PHOTOSENSITIVE TRANSFER MATERIAL, PATTERN FORMATION METHOD, AND ETCHING METHOD | FUJIFILM CORPORATION (JP) | 2019-01-10 | — | — | US | disclosed |
| US-10133175-B2 | Photosensitive resin composition, cured product and method for producing same, method for producing resin pattern, cured film, liquid crystal display device, organic el display device, infrared cut filter, and solid-state imaging device | FUJIFILM CORPORATION (JP) | 2018-11-20 | — | — | US | disclosed |
| US-20180307140-A1 | PHOTOSENSITIVE RESIN COMPOSITION FOR BIOCHIP AND METHOD FOR FORMING LIQUID REPELLENT FILM | ASAHI GLASS COMPANY, LIMITED (JP) | 2018-10-25 | — | — | US | disclosed |
| US-10108091-B2 | Photosensitive transfer material, pattern formation method, and etching method | FUJIFILM CORPORATION (JP) | 2018-10-23 | — | — | US | disclosed |
| CN-103163735-A | Positive type photosensitive resin composition for electron member, cured film and forming method thereof, and display device | FUJIFILM CORP | 2013-06-19 | — | — | CN | disclosed |
| CN-103149795-A | Manufacture methods of resin pattern, pattern substrate, thin film transistor substrate, layer insulation film and display device | FUJI FILM CORP | 2013-06-12 | — | — | CN | disclosed |
| CN-103091986-A | Positive-type photosensitive resin composition, cured film and method for producing cured film, liquid crystal display device, and organic electroluminescent display device | FUJIFILM CORP | 2013-05-08 | — | — | CN | disclosed |
| CN-103019034-A | Positive-type photosensitive resin composition, cured film and manufacturing method thereof, pattern, mems structure manufacturing method, dry and wet etching method | FUJIFILM CORP | 2013-04-03 | — | — | CN | disclosed |
| CN-102955361-A | Positive type photosensitive resin composition, method for forming cured film, cured film, liquid crystal display device, and organic EL display device | FUJIFILM CORP | 2013-03-06 | — | — | CN | disclosed |
| CN-102540726-A | Orthotype photosensitive resin composition, hard coating film and forming method thereof, interlayer insulated film, and display device | FUJIFILM CORP | 2012-07-04 | — | — | CN | disclosed |
| US-20120107563-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERN, MEMS STRUCTURE, METHOD FOR PRODUCING THE STRUCTURE, METHOD FOR DRY ETCHING, METHOD FOR WET ETCHING, MEMS SHUTTER DEVICE, AND IMAGE DISPLAY APPARATUS | FUJIFILM CORPORATION (JP) | 2012-05-03 | — | — | US | disclosed |
| EP-2447773-A1 | Photosensitive resin composition, method for producing pattern, MEMS structure, method for producing the structure, method for dry etching, method for wet etching, MEMS shutter device, and image display apparatus | Fujifilm Corporation (JP) | 2012-05-02 | — | — | EP | disclosed |
| CN-102141729-A | Manufacturing method of cured film, photosensitive resin composition, cured film, organic EL display device and liquid crystal display device | FUJIFILM CORP | 2011-08-03 | — | — | CN | disclosed |
| CN-102043334-A | Photosensitive resin composition, cured film, method for producing cured film, organic el display device and liquid crystal display device | FUJIFILM CORP | 2011-05-04 | — | — | CN | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20210240078-A1 | PHOTO-DECOMPOSABLE COMPOUND, PHOTORESIST COMPOSITION INCLUDING THE SAME, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE | C9, C1S, C5 | CYP1A2 2006/4885NFE2L2 2901/4885SIGMAR1 4393/4885 |
| US-20230120542-A1 | PHOTO-DECOMPOSABLE COMPOUND, PHOTORESIST COMPOSITION INCLUDING THE SAME, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE | C9, C1S, C5 | CYP1A2 2006/4885NFE2L2 2901/4885SIGMAR1 4393/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.