SCHEMBL2709686

SCHEMBL2709686

O=C(O)c1ccc(C(=O)O)c(C#CC23CC4CC(CC(C4)C2)C3)c1

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
STS P08842 2/20 0.40
RARB P10826 4/20 0.39
RARG P13631 4/20 0.39
MEN1 O00255 4/20 0.39
KMT2A Q03164 4/20 0.39
RARA P10276 3/20 0.39
KDM4E B2RXH2 3/20 0.39
ALDH1A1 P00352 1/20 0.39
TP53 P04637 1/20 0.39
CYP3A4 P08684 1/20 0.39
MAPT P10636 1/20 0.39
HPGD P15428 1/20 0.39
ALOX15 P16050 1/20 0.39
ALOX12 P18054 1/20 0.39
MAPK1 P28482 1/20 0.39
SMN1; SMN2 Q16637 1/20 0.39
HSD17B10 Q99714 1/20 0.39
EPHX2 P34913 4/20 0.38
SERPINE1 P05121 1/20 0.36
NR1I2 O75469 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2706953 0.89 STS (0.40) STSRARBRARGMEN1KMT2A
SCHEMBL2707010 0.82 EPHX2 (0.36) RARBRARGMEN1KMT2ARARA
SCHEMBL2747221 0.81 KDM4E (0.44) STSRARBRARGMEN1KMT2A
SCHEMBL2707051 0.78 SERPINE1 (0.47) STSRARBRARGMEN1KMT2A
SCHEMBL2710316 0.77 HNF4A (0.39) KDM4EHSD17B10EPHX2SERPINE1P2RX7
SCHEMBL2707899 0.76 STS (0.34) STSRARBRARGMEN1KMT2A
SCHEMBL2710897 0.75 KDM4E (0.36) STSKDM4E
SCHEMBL2708211 0.75 KDM4E (0.41) MEN1KMT2AKDM4EALDH1A1MAPT
SCHEMBL2708596 0.75 MEN1 (0.36) STSRARBRARGMEN1KMT2A
SCHEMBL2746657 0.74 MEN1 (0.45) RARBRARGMEN1KMT2ARARA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2000510-B1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM SUMITOMO BAKELITE CO (JP) 2012-05-02 EP disclosed
US-7863347-B2 Resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-01-04 US disclosed
US-7652125-B2 Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2010-01-26 US disclosed
US-20090118431-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE COMPANY, LTD (JP) 2009-05-07 US disclosed
EP-2000510-A1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM Sumitomo Bakelite Company, Ltd. (JP) 2008-12-10 EP disclosed
US-20080255335-A1 Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same SUMITOMO BAKELITE COMPANY LTD. (JP) 2008-10-16 US disclosed
EP-1813637-A1 RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME Sumitomo Bakelite Company, Limited (JP) 2007-08-01 EP disclosed