SCHEMBL2707398

SCHEMBL2707398

Nc1cc(C2(c3ccc(O)c(N)c3)c3cc(C45CC6CC(CC(C6)C4)C5)ccc3-c3ccc(C45CC6CC(CC(C6)C4)C5)cc32)ccc1O

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 4/20 0.55
KMT2A Q03164 4/20 0.55
POLB P06746 1/20 0.55
GAA P10253 1/20 0.55
GFER P55789 1/20 0.55
ALDH1A1 P00352 4/20 0.44
LMNA P02545 2/20 0.44
L3MBTL1 Q9Y468 1/20 0.36
CNR2 P34972 4/20 0.36
EPHX2 P34913 1/20 0.35
ESR1 P03372 1/20 0.35
ESR2 Q92731 1/20 0.35
RAB9A P51151 1/20 0.35
NPC1 O15118 1/20 0.34
RARB P10826 3/20 0.34
RARA P10276 2/20 0.34
RARG P13631 2/20 0.34
PTPN11 Q06124 3/20 0.33
CNR1 P21554 1/20 0.33
KDM4E B2RXH2 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2710154 0.87 MEN1 (0.71) MEN1KMT2APOLBGAAGFER
SCHEMBL1150069 0.87 MEN1 (0.71) MEN1KMT2APOLBGAAGFER
SCHEMBL2706988 0.84 MEN1 (0.54) MEN1KMT2APOLBGAAGFER
SCHEMBL2709060 0.84 LMNA (0.64) MEN1KMT2APOLBGAAGFER
SCHEMBL2747752 0.84 MEN1 (0.41) MEN1KMT2APOLBGAAGFER
SCHEMBL2709672 0.83 PTPN11 (0.39) MEN1KMT2APOLBGAAGFER
SCHEMBL2707241 0.82 MEN1 (0.44) MEN1KMT2APOLBGAAGFER
SCHEMBL5000843 0.81 MEN1 (0.39) MEN1KMT2APOLBGAAGFER
SCHEMBL2710257 0.80 MEN1 (0.50) MEN1KMT2APOLBGAAGFER
SCHEMBL2747751 0.79 MEN1 (0.35) MEN1KMT2APOLBGAAGFER

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2000510-B1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM SUMITOMO BAKELITE CO (JP) 2012-05-02 EP disclosed
US-7863347-B2 Resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-01-04 US disclosed
US-7652125-B2 Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2010-01-26 US disclosed
US-20090118431-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE COMPANY, LTD (JP) 2009-05-07 US disclosed
EP-2000510-A1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM Sumitomo Bakelite Company, Ltd. (JP) 2008-12-10 EP disclosed
US-20080255335-A1 Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same SUMITOMO BAKELITE COMPANY LTD. (JP) 2008-10-16 US disclosed
EP-1813637-A1 RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME Sumitomo Bakelite Company, Limited (JP) 2007-08-01 EP disclosed