SCHEMBL2709672

SCHEMBL2709672

CC12CC3CC(C)(C1)CC(c1ccc4c(c1)C(c1ccc(O)c(N)c1)(c1ccc(O)c(N)c1)c1cc(C56CC7CC(C)(CC(C)(C7)C5)C6)ccc1-4)(C3)C2

nearest known ligand 0.39

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
PTPN11 Q06124 1/20 0.39
NR0B2 Q15466 1/20 0.39
MEN1 O00255 1/20 0.36
POLB P06746 1/20 0.36
GAA P10253 1/20 0.36
GFER P55789 1/20 0.36
KMT2A Q03164 1/20 0.36
ESR1 P03372 1/20 0.34
ESR2 Q92731 1/20 0.34
EPHX2 P34913 1/20 0.33
ALDH1A1 P00352 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2710995 0.87 PTPN11 (0.37) PTPN11NR0B2MEN1POLBGAA
SCHEMBL4583150 0.86 GAA (0.44) PTPN11NR0B2MEN1POLBGAA
SCHEMBL2707398 0.83 MEN1 (0.55) PTPN11NR0B2MEN1POLBGAA
SCHEMBL2709161 0.80 RXRA (0.41) PTPN11NR0B2EPHX2
SCHEMBL2709923 0.78 MEN1 (0.46) PTPN11NR0B2MEN1POLBGAA
SCHEMBL2710150 0.76 ESR1 (0.36) PTPN11NR0B2MEN1KMT2AESR1
SCHEMBL2708180 0.75 PTPN11 (0.40) PTPN11NR0B2POLBESR1ESR2
SCHEMBL2708821 0.75 RXRA (0.46) PTPN11NR0B2
SCHEMBL28207465 0.74 ESR1 (0.45) PTPN11NR0B2MEN1POLBGAA
Hydrochloric Acid SCHEMBL3175784 0.74 PTPN11 (0.39) PTPN11NR0B2POLBEPHX2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2000510-B1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM SUMITOMO BAKELITE CO (JP) 2012-05-02 EP disclosed
US-7863347-B2 Resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-01-04 US disclosed
US-7652125-B2 Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2010-01-26 US disclosed
US-20090118431-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE COMPANY, LTD (JP) 2009-05-07 US disclosed
EP-2000510-A1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM Sumitomo Bakelite Company, Ltd. (JP) 2008-12-10 EP disclosed
US-20080255335-A1 Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same SUMITOMO BAKELITE COMPANY LTD. (JP) 2008-10-16 US disclosed
EP-1813637-A1 RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME Sumitomo Bakelite Company, Limited (JP) 2007-08-01 EP disclosed