SCHEMBL2708322

SCHEMBL2708322

CC12CC3CC(C)(C1)CC(c1ccc(C#Cc4ccc(C(=O)O)cc4C(=O)O)cc1)(C3)C2

nearest known ligand 0.40

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
RARB P10826 12/20 0.40
RARG P13631 11/20 0.40
RARA P10276 9/20 0.40
CYP26A1 O43174 1/20 0.40
CYP3A4 P08684 1/20 0.40
CRABP2 P29373 1/20 0.40
PGR P06401 4/20 0.35
EPHX2 P34913 1/20 0.35
SERPINE1 P05121 1/20 0.34
HIF1A Q16665 1/20 0.34
EPAS1 Q99814 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2710041 0.94 RARB (0.39) RARBRARGRARACYP26A1CYP3A4
SCHEMBL2710393 0.92 RARB (0.40) RARBRARGRARACYP26A1CYP3A4
SCHEMBL2708265 0.86 RARB (0.39) RARBRARGRARACYP26A1CYP3A4
SCHEMBL2707858 0.84 SERPINE1 (0.47) RARBRARGRARACYP26A1CYP3A4
SCHEMBL2709920 0.84 RARB (0.42) RARBRARGRARACYP26A1CYP3A4
SCHEMBL2709689 0.83 RARB (0.39) RARBRARGRARACYP26A1CYP3A4
SCHEMBL2706663 0.81 PGR (0.35) RARBRARGRARACYP26A1CYP3A4
SCHEMBL2707876 0.79 EPHX2 (0.36) RARBRARGRARACYP26A1CYP3A4
SCHEMBL2709090 0.79 RARB (0.40) RARBRARGRARACYP26A1CYP3A4
SCHEMBL2710141 0.79 HIF1A (0.48) RARBRARGRARACYP3A4PGR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2000510-B1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM SUMITOMO BAKELITE CO (JP) 2012-05-02 EP disclosed
US-7863347-B2 Resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-01-04 US disclosed
US-7652125-B2 Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2010-01-26 US disclosed
US-20090118431-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE COMPANY, LTD (JP) 2009-05-07 US disclosed
EP-2000510-A1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM Sumitomo Bakelite Company, Ltd. (JP) 2008-12-10 EP disclosed
US-20080255335-A1 Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same SUMITOMO BAKELITE COMPANY LTD. (JP) 2008-10-16 US disclosed
EP-1813637-A1 RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME Sumitomo Bakelite Company, Limited (JP) 2007-08-01 EP disclosed