SCHEMBL2709689

SCHEMBL2709689

CC12CC3CC(C)(C1)CC(c1ccc(C#Cc4ccc(C(=O)O)c(C(=O)O)c4)cc1)(C3)C2

nearest known ligand 0.39

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
RARB P10826 9/20 0.39
RARG P13631 9/20 0.39
RARA P10276 7/20 0.39
CYP26A1 O43174 1/20 0.39
CYP3A4 P08684 1/20 0.39
CRABP2 P29373 1/20 0.39
HNF4A P41235 1/20 0.38
EPHX2 P34913 1/20 0.38
PGR P06401 8/20 0.37
PTPN11 Q06124 1/20 0.34
NR0B2 Q15466 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3179396 0.94 RARB (0.37) RARBRARGRARACYP26A1CYP3A4
SCHEMBL2710393 0.85 RARB (0.40) RARBRARGRARACYP26A1CYP3A4
SCHEMBL2709920 0.84 RARB (0.42) RARBRARGRARACYP26A1CYP3A4
SCHEMBL2708322 0.83 RARB (0.40) RARBRARGRARACYP26A1CYP3A4
SCHEMBL2708590 0.82 SERPINE1 (0.46) HNF4AEPHX2PGR
SCHEMBL2706663 0.81 PGR (0.35) RARBRARGRARACYP26A1CYP3A4
SCHEMBL2708265 0.81 RARB (0.39) RARBRARGRARACYP26A1CYP3A4
SCHEMBL2707826 0.81 HNF4A (0.34) RARBRARGRARACYP26A1CYP3A4
SCHEMBL2709090 0.79 RARB (0.40) RARBRARGRARACYP26A1CYP3A4
SCHEMBL2710041 0.78 RARB (0.39) RARBRARGRARACYP26A1CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2000510-B1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM SUMITOMO BAKELITE CO (JP) 2012-05-02 EP disclosed
US-7863347-B2 Resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-01-04 US disclosed
US-7652125-B2 Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2010-01-26 US disclosed
US-20090118431-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE COMPANY, LTD (JP) 2009-05-07 US disclosed
EP-2000510-A1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM Sumitomo Bakelite Company, Ltd. (JP) 2008-12-10 EP disclosed
US-20080255335-A1 Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same SUMITOMO BAKELITE COMPANY LTD. (JP) 2008-10-16 US disclosed
EP-1813637-A1 RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME Sumitomo Bakelite Company, Limited (JP) 2007-08-01 EP disclosed