SCHEMBL2709161

SCHEMBL2709161

CC12CC3CC(C)(C1)CC(c1ccc4c(c1)C(c1ccc(C(=O)O)cc1)(c1ccc(C(=O)O)cc1)c1cc(C56CC7CC(C)(CC(C)(C7)C5)C6)ccc1-4)(C3)C2

nearest known ligand 0.41

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
RXRA P19793 15/20 0.41
PTPN11 Q06124 1/20 0.40
NR0B2 Q15466 1/20 0.40
CYP26A1 O43174 2/20 0.39
CYP26B1 Q9NR63 2/20 0.39
RXRB P28702 7/20 0.39
RARB P10826 5/20 0.36
RARG P13631 5/20 0.36
RXRG P48443 4/20 0.36
RARA P10276 2/20 0.36
EPHX2 P34913 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2708821 0.94 RXRA (0.46) RXRAPTPN11NR0B2CYP26A1CYP26B1
Hydrochloric Acid SCHEMBL3175811 0.93 RXRA (0.45) RXRAPTPN11NR0B2CYP26A1CYP26B1
Hydrochloric Acid SCHEMBL3175824 0.93 RXRA (0.45) RXRAPTPN11NR0B2CYP26A1CYP26B1
SCHEMBL2710248 0.84 RXRA (0.43) RXRAPTPN11NR0B2CYP26A1CYP26B1
SCHEMBL2708180 0.83 PTPN11 (0.40) PTPN11NR0B2EPHX2
SCHEMBL2710161 0.82 RARB (0.48) RARBRARGRARAEPHX2
Hydrochloric Acid SCHEMBL3175784 0.82 PTPN11 (0.39) PTPN11NR0B2EPHX2
SCHEMBL5568792 0.82 EPHX2 (0.42) RXRACYP26A1CYP26B1RXRBRARB
SCHEMBL3175819 0.82 RXRA (0.37) RXRAPTPN11NR0B2CYP26A1CYP26B1
SCHEMBL2709672 0.80 PTPN11 (0.39) PTPN11NR0B2EPHX2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2000510-B1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM SUMITOMO BAKELITE CO (JP) 2012-05-02 EP disclosed
US-7863347-B2 Resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-01-04 US disclosed
US-7652125-B2 Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2010-01-26 US disclosed
US-20090118431-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE COMPANY, LTD (JP) 2009-05-07 US disclosed
EP-2000510-A1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM Sumitomo Bakelite Company, Ltd. (JP) 2008-12-10 EP disclosed
US-20080255335-A1 Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same SUMITOMO BAKELITE COMPANY LTD. (JP) 2008-10-16 US disclosed
EP-1813637-A1 RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME Sumitomo Bakelite Company, Limited (JP) 2007-08-01 EP disclosed