SCHEMBL5568792

SCHEMBL5568792

CC12CC3CC(c4ccc(C(=O)O)cc4)(C1)CC(c1ccc(C(=O)O)cc1)(C3)C2

nearest known ligand 0.42

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
EPHX2 P34913 2/20 0.42
RXRA P19793 8/20 0.41
PGR P06401 4/20 0.39
CYP26A1 O43174 2/20 0.39
CYP26B1 Q9NR63 2/20 0.39
HDAC8 Q9BY41 1/20 0.39
HDAC6 Q9UBN7 1/20 0.39
RXRB P28702 3/20 0.38
RARB P10826 1/20 0.38
RARG P13631 1/20 0.38
RXRG P48443 1/20 0.38
NPC1 O15118 1/20 0.38
TP53 P04637 1/20 0.38
TSHR P16473 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5084601 0.90 TSHR (0.46) EPHX2PGRRARBRARGNPC1
SCHEMBL5568183 0.85 GRIN2D (0.44) PGRRARBRARGTP53TSHR
SCHEMBL5082233 0.83 RXRA (0.47) RXRACYP26A1CYP26B1RXRBRARB
SCHEMBL25309350 0.83 TSHR (0.50) EPHX2RARBRARGNPC1TP53
SCHEMBL5481142 0.82 HIF1A (0.47) EPHX2PGRNPC1TSHR
SCHEMBL5141270 0.82 HIF1A (0.47) EPHX2PGRNPC1TSHR
SCHEMBL2709161 0.82 RXRA (0.41) EPHX2RXRACYP26A1CYP26B1RXRB
SCHEMBL11550092 0.82 RXRA (0.46) RXRACYP26A1CYP26B1RXRBRARB
SCHEMBL17042512 0.80 ESR1 (0.45) EPHX2PGRNPC1
SCHEMBL2745792 0.80 PGR (0.50) PGRRARBRARGNPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20070078256-A1 Prepolymers, prepolymer compositions, high-molecular-weight polymers with pore structure, and dielectric films DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2007-04-05 US disclosed
EP-1683822-A1 PREPOLYMER, PREPOLYMER COMPOSITION, HIGH MOLECULAR WEIGHT POLYMER HAVING STRUCTURE CONTAINING HOLE AND ELECTRICALLY INSULATING FILM Daicel Chemical Industries, Ltd. (JP) 2006-07-26 EP disclosed