Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PDE4D | Q08499 | 13/20 | 0.43 |
| ▸ | FFAR1 | O14842 | 2/20 | 0.35 |
| ▸ | PDK2 | Q15119 | 1/20 | 0.35 |
| ▸ | GRM5 | P41594 | 1/20 | 0.34 |
| ▸ | HNF4A | P41235 | 1/20 | 0.34 |
| ▸ | MMP2 | P08253 | 1/20 | 0.33 |
| ▸ | MMP14 | P50281 | 1/20 | 0.33 |
| ▸ | ALOX5 | P09917 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2710472 | 0.85 | PDE4D (0.36) | PDE4DMMP2MMP14 | |
| SCHEMBL2707919 | 0.82 | PDE4D (0.43) | PDE4DGRM5HNF4A | |
| SCHEMBL2748044 | 0.81 | MEN1 (0.50) | PDE4DPDK2MMP2MMP14 | |
| SCHEMBL2747518 | 0.80 | MMP2 (0.34) | PDE4DMMP2MMP14 | |
| SCHEMBL3146256 | 0.77 | MAPT (0.56) | PDE4DGRM5 | |
| SCHEMBL18184907 | 0.75 | PDE4D (0.50) | PDE4DGRM5HNF4A | |
| SCHEMBL3675046 | 0.74 | ESR1 (0.41) | PDE4DGRM5 | |
| SCHEMBL29133183 | 0.74 | MEN1 (0.40) | PDK2MMP2MMP14 | |
| SCHEMBL2746914 | 0.73 | MAPT (0.42) | FFAR1MMP2MMP14 | |
| SCHEMBL2707241 | 0.73 | MEN1 (0.44) | MMP2MMP14 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8337982-B2 | Comprising first repeating unit obtained by reaction of bisaminophenol compound and dicarboxylic acid, at least one of which has diamondoid structure and second repeating unit obtained by reaction of bisaminophenol compound having no diamondoid structure and dicarboxylic acid; heat resistance | SUMITOMO BAKELITE CO., LTD. (JP) | 2012-12-25 | — | — | US | disclosed |
| US-8178631-B2 | Resin composition, varnish, resin film and semiconductor device | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2012-05-15 | — | — | US | disclosed |
| EP-2000510-B1 | RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM | SUMITOMO BAKELITE CO (JP) | 2012-05-02 | — | — | EP | disclosed |
| US-7863347-B2 | Resin composition, varnish, resin film and semiconductor device using the same | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2011-01-04 | — | — | US | disclosed |
| US-7652125-B2 | Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2010-01-26 | — | — | US | disclosed |
| US-7608928-B2 | Laminated body and semiconductor device | JSR CORPORATION (JP) | 2009-10-27 | — | — | US | disclosed |
| US-20090214860-A1 | Resin Composition, Varnish, Resin Film and Semiconductor Device | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2009-08-27 | — | — | US | disclosed |
| US-20090118431-A1 | RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME | SUMITOMO BAKELITE COMPANY, LTD (JP) | 2009-05-07 | — | — | US | disclosed |
| EP-2000510-A1 | RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM | Sumitomo Bakelite Company, Ltd. (JP) | 2008-12-10 | — | — | EP | disclosed |
| US-20080255335-A1 | Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same | SUMITOMO BAKELITE COMPANY LTD. (JP) | 2008-10-16 | — | — | US | disclosed |
| US-20080206548-A1 | Benzoxazole Resin Precursor, Polybenzoxazole Resin, Resin Film And Semiconductor Device | SUMITOMO BAKELITE CO., LTD (JP) | 2008-08-28 | — | — | US | disclosed |
| EP-1953181-A1 | RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE | Sumitomo Bakelite Company, Ltd. (JP) | 2008-08-06 | — | — | EP | disclosed |
| US-20080044664-A1 | Laminated Body and Semiconductor Drive | JSR CORPORATION (JP) | 2008-02-21 | — | — | US | disclosed |
| EP-1832619-A1 | BENZOXAZOLE RESIN PRECURSOR, POLYBENZOXAZOLE RESIN, RESIN FILM, AND SEMICONDUCTOR DEVICE | Sumitomo Bakelite Company, Limited (JP) | 2007-09-12 | — | — | EP | disclosed |
| EP-1813637-A1 | RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME | Sumitomo Bakelite Company, Limited (JP) | 2007-08-01 | — | — | EP | disclosed |
| EP-1760774-A1 | LAMINATED BODY AND SEMICONDUCTOR DEVICE | JSR Corporation (JP) | 2007-03-07 | — | — | EP | disclosed |