SCHEMBL2709336

SCHEMBL2709336

CC12CC3CC(C1)CC(C)(C3)C2c1ccc(C#Cc2cc(C(=O)O)cc(C(=O)O)c2)cc1

nearest known ligand 0.41

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
RARB P10826 12/20 0.41
RARG P13631 12/20 0.41
RARA P10276 9/20 0.41
CYP26A1 O43174 1/20 0.41
CYP3A4 P08684 1/20 0.41
CRABP2 P29373 1/20 0.41
P2RY14 Q15391 1/20 0.40
FFAR1 O14842 5/20 0.37
MEN1 O00255 1/20 0.34
NR1I2 O75469 1/20 0.34
LMNA P02545 1/20 0.34
PGR P06401 1/20 0.34
HSPD1 P10809 1/20 0.34
GOT1 P17174 1/20 0.34
GLRA1 P23415 1/20 0.34
BLM P54132 1/20 0.34
HSPE1 P61604 1/20 0.34
KMT2A Q03164 1/20 0.34
TDP1 Q9NUW8 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2709694 0.94 RARB (0.40) RARBRARGRARACYP26A1CYP3A4
SCHEMBL2710763 0.84 HNF4A (0.40) RARBRARGRARACYP26A1CYP3A4
SCHEMBL2707764 0.83 RARB (0.39) RARBRARGRARACYP26A1CYP3A4
SCHEMBL2710970 0.83 RARB (0.39) RARBRARGRARACYP26A1CYP3A4
SCHEMBL2709922 0.79 P2RY14 (0.38) RARBRARGRARACYP26A1CYP3A4
SCHEMBL2709793 0.79 RARB (0.38) RARBRARGRARACYP26A1CYP3A4
SCHEMBL2710060 0.79 RARB (0.38) RARBRARGRARACYP26A1CYP3A4
SCHEMBL2709733 0.79 RARA (0.37) RARBRARGRARACYP26A1CYP3A4
Hydrochloric Acid SCHEMBL5000617 0.79 P2RY14 (0.37) RARBRARGRARACYP26A1CYP3A4
SCHEMBL3177371 0.79 RARA (0.33) RARBRARGRARACYP26A1CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2000510-B1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM SUMITOMO BAKELITE CO (JP) 2012-05-02 EP disclosed
US-7863347-B2 Resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-01-04 US disclosed
US-7652125-B2 Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2010-01-26 US disclosed
US-20090118431-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE COMPANY, LTD (JP) 2009-05-07 US disclosed
EP-2000510-A1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM Sumitomo Bakelite Company, Ltd. (JP) 2008-12-10 EP disclosed
US-20080255335-A1 Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same SUMITOMO BAKELITE COMPANY LTD. (JP) 2008-10-16 US disclosed
EP-1813637-A1 RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME Sumitomo Bakelite Company, Limited (JP) 2007-08-01 EP disclosed