⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Fluoride SCHEMBL947078 | 1.00 | — | — | |
| Fluoride SCHEMBL1633223 | 1.00 | — | — | |
| Fluoride SCHEMBL56508 | 1.00 | — | — | |
| Fluoride SCHEMBL3098074 | 1.00 | — | — | |
| Charcoal, Activated SCHEMBL11898253 | 1.00 | — | — | |
| Fluoride SCHEMBL155068 | 1.00 | — | — | |
| Charcoal, Activated SCHEMBL3432542 | 1.00 | — | — | |
| Charcoal, Activated SCHEMBL2794579 | 1.00 | — | — | |
| Fluoride SCHEMBL6443670 | 0.82 | — | — | |
| Fluoride SCHEMBL10322495 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Appears in 30818 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12641906-B2 | Tapered backside ground structure for pixel array | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2026-05-26 | — | — | US | claimed |
| CN-122094028-A | Processing method of multilayer point blind hole filling and point thickening through hole copper of flexible circuit board | — | 2026-05-26 | — | — | CN | claimed |
| CN-122079508-A | Method for treating glass substrate | — | 2026-05-26 | — | — | CN | claimed |
| CN-116417344-B | Method for forming semiconductor structure | 中芯国际集成电路制造(上海)有限公司 | 2026-05-22 | — | — | CN | claimed |
| CN-122073931-A | Display panel, preparation method thereof and display device | 合肥维信诺科技有限公司 | 2026-05-22 | — | — | CN | claimed |
| US-20260140283-A1 | METHOD OF DEVELOPING ANTIREFLECTION COATINGS VIA PLASMA ETCHING | TIPD LLC (US) | 2026-05-21 | — | — | US | claimed |
| WO-2026106606-A1 | SELECTIVE REMOVAL OF METAL-AND-CARBON-CONTAINING MATERIALS | APPLIED MATERIALS, INC. (US) | 2026-05-21 | — | — | WO | claimed |
| US-12635454-B2 | Systems and methods for determining residual compounds in plasma process | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2026-05-19 | — | — | US | claimed |
| CN-116332120-B | Preparation method of super-hydrophilic template seal | 苏州研材微纳科技有限公司 | 2026-05-19 | — | — | CN | claimed |
| US-12635566-B2 | Integrated circuit packages and methods of forming the same | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2026-05-19 | — | — | US | claimed |
| US-4202914-A | Method of depositing thin films of small dimensions utilizing silicon nitride lift-off mask | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1980-05-13 | — | — | US | claimed |
| US-4174251-A | Method of selective gas etching on a silicon nitride layer | ITT INDUSTRIES, INC. (US) | 1979-11-13 | — | — | US | claimed |
| US-4160690-A | Gas etching method and apparatus | TOKYO SHIBAURA ELECTRIC CO., LTD. (JP) | 1979-07-10 | — | — | US | claimed |
| US-4141782-A | Bump circuits on tape utilizing chemical milling | GENERAL DYNAMICS CORPORATION (US) | 1979-02-27 | — | — | US | claimed |
| US-4078907-A | Separation and purification of xenon | THE UNITED STATES OF AMERICA AS REPRESENTED BY THE UNITED STATES DEPARTMENT OF ENERGY (US) | 1978-03-14 | — | — | US | claimed |
| US-4067100-A | Method of making a semiconductor device | KOJIMA AKIRA | 1978-01-10 | — | — | US | claimed |
| US-4062720-A | Process for forming a ledge-free aluminum-copper-silicon conductor structure | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1977-12-13 | — | — | US | claimed |
| US-4031484-A | Portable chemical laser with gas recirculation | UNITED TECHNOLOGIES CORPORATION (US) | 1977-06-21 | — | — | US | claimed |
| US-4012307-A | Method for conditioning drilled holes in multilayer wiring boards | GENERAL DYNAMICS CORPORATION (US) | 1977-03-15 | — | — | US | claimed |
| US-3986912-A | PROCESS FOR CONTROLLING THE WALL INCLINATION OF A PLASMA ETCHED VIA HOLE | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1976-10-19 | — | — | US | claimed |