SCHEMBL273206

SCHEMBL273206

Cc1cc(Sc2ccc(N)c(C)c2)ccc1N

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 8/20 0.54
TDP1 Q9NUW8 7/20 0.54
TSHR P16473 4/20 0.54
ALDH1A1 P00352 4/20 0.54
S100B P04271 1/20 0.42
MAPK1 P28482 3/20 0.42
SKP2 Q13309 1/20 0.41
THRB P10828 3/20 0.39
ALOX15 P16050 2/20 0.39
RECQL P46063 1/20 0.39
HIF1A Q16665 1/20 0.39
TP53 P04637 2/20 0.39
SMN1; SMN2 Q16637 2/20 0.39
ESR1 P03372 2/20 0.37
AR P10275 1/20 0.37
ESR2 Q92731 1/20 0.37
CASP1 P29466 1/20 0.37
GCK P35557 1/20 0.36
RAD52 P43351 2/20 0.36
KDM4E B2RXH2 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31457312 0.91 CYP3A4 (0.58) CYP3A4TDP1TSHRALDH1A1S100B
SCHEMBL7189976 0.91 CYP3A4 (0.58) CYP3A4TDP1TSHRALDH1A1S100B
SCHEMBL11354311 0.89 GCK (0.47) CYP3A4TDP1TSHRALDH1A1S100B
SCHEMBL20565650 0.88 CYP3A4 (0.45) CYP3A4TDP1TSHRALDH1A1MAPK1
SCHEMBL7195456 0.86 CYP3A4 (0.42) CYP3A4TDP1TSHRALDH1A1S100B
SCHEMBL11808310 0.85 CYP3A4 (0.54) CYP3A4TDP1TSHRALDH1A1S100B
SCHEMBL7192026 0.84 ALDH1A1 (0.43) CYP3A4TDP1TSHRALDH1A1S100B
SCHEMBL6371600 0.83 CYP3A4 (0.52) CYP3A4TDP1TSHRALDH1A1S100B
SCHEMBL7184598 0.80 PDE7A (0.44) CYP3A4TDP1TSHRALDH1A1S100B
SCHEMBL8174643 0.80 ALDH1A1 (0.54) CYP3A4TDP1TSHRALDH1A1MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 330 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8080319-B2 Thermosetting resin composition and use thereof Kippon Kayaku Kabushiki Kaisha (JP) 2011-12-20 US claimed
US-20090286087-A1 Thermosetting Resin Composition and Use thereof NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2009-11-19 US claimed
EP-1579272-A4 STABLE NON-PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITIONS FOR USE IN BILAYER IMAGING SYSTEMS FUJIFILM ELECTRONIC MATERIALS (US) 2008-12-17 EP claimed
US-7416830-B2 Photosensitive resin compositions FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2008-08-26 US claimed
US-20070009751-A1 Polyamic acid resin composition modified with laminate nanometer silica sheet and polyimide prepared therefrom CHANG CHUN PLASTICS CO., LTD. (TW) 2007-01-11 US claimed
EP-1680711-A2 NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS Fujifilm Electronic Materials USA, Inc. (US) 2006-07-19 EP claimed
US-7018776-B2 Stable non-photosensitive polyimide precursor compositions for use in bilayer imaging systems ARCH SPECIALTY CHEMICALS, INC. (US) 2006-03-28 US claimed
US-20060063095-A9 Novel photosensitive resin compositions ARCH SPECIALTY CHEMICALS, INC. 2006-03-23 US claimed
EP-1609026-A2 PROCESS FOR PRODUCING A HEAT RESISTANT RELIEF STRUCTURE FujiFilm Electronic Materials USA, Inc. (US) 2005-12-28 EP claimed
EP-1579272-A2 STABLE NON-PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITIONS FOR USE IN BILAYER IMAGING SYSTEMS Fujifilm Electronic Materials USA, Inc. (US) 2005-09-28 EP claimed
US-20050181297-A1 Novel photosensitive resin compositions ARCH SPECIALTY CHEMICALS, INC. 2005-08-18 US claimed
WO-2005038524-A2 NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS ARCH SPECIALTY CHEMICALS, INC. (US) 2005-04-28 WO claimed
US-20040161711-A1 Stable non-photosensitive polyimide precursor compositions for use in bilayer imaging systems ARCH SPECIALTY CHEMICALS, INC. 2004-08-19 US claimed
US-20040161619-A1 Process for producing a heat resistant relief structure ARCH SPECIALTY CHEMICALS, INC. 2004-08-19 US claimed
WO-2004055593-A2 PROCESS FOR PRODUCING A HEAT RESISTANT RELIEF STRUCTURE ARCH SPECIALTY CHEMICALS, INC. (US) 2004-07-01 WO claimed
WO-2004055592-A2 STABLE NON-PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOISTIONS FOR USE IN BILAYER IMAGING SYSTEMS ARCH SPECIALTY CHEMICALS, INC. (US) 2004-07-01 WO claimed
US-4886873-A ELASTICITY AND HEAT RESISTANCE DIRECTOR-GENERAL OF AGENCY OF INDUSTRIAL SCIENCE AND TECHNOLOGY (JP) 1989-12-12 US claimed
US-20230331915-A1 Isocyanate-Modified Polyimide Resin, Resin Composition and Cured Product of Same NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2023-10-19 US disclosed
US-3987003-A THERMALLY STABLE DIOXO AND DITHIO-BENZISOQUINOLINE COMPOSITIONS AND PROCESS OF SYNTHESIZING SAME THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE AIR FORCE (US) 1976-10-19 US disclosed
US-3960980-A Method of producing elastomer resins BRIDGESTONE TIRE COMPANY LIMITED (JA) 1976-06-01 US disclosed