SCHEMBL2738440

SCHEMBL2738440

CC(C)(C)OC(=O)Oc1cccc2ccccc12

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.57
HSD17B10 Q99714 3/20 0.57
GAA P10253 2/20 0.57
PGR P06401 1/20 0.57
PTGS1 P23219 1/20 0.57
MAPK1 P28482 1/20 0.57
KDM4E B2RXH2 3/20 0.55
KMT2A Q03164 3/20 0.51
MEN1 O00255 1/20 0.51
RAB9A P51151 1/20 0.51
L3MBTL1 Q9Y468 1/20 0.51
HPGD P15428 2/20 0.47
TDP1 Q9NUW8 1/20 0.46
MMP2 P08253 1/20 0.46
FABP7 O15540 4/20 0.44
FABP3 P05413 4/20 0.44
FABP5 Q01469 4/20 0.44
BCHE P06276 1/20 0.44
SLC6A3 Q01959 1/20 0.44
ELANE P08246 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7880926 0.91 ALDH1A1 (0.48) ALDH1A1HSD17B10GAAPGRPTGS1
SCHEMBL4059205 0.90 ELANE (0.49) ALDH1A1HSD17B10GAAPGRPTGS1
SCHEMBL37865 0.84 ALDH1A1 (0.65) ALDH1A1HSD17B10GAAPGRPTGS1
SCHEMBL29901836 0.84 ALDH1A1 (0.65) ALDH1A1HSD17B10GAAPGRPTGS1
SCHEMBL28010762 0.83 ALDH1A1 (0.53) ALDH1A1HSD17B10GAAPGRPTGS1
SCHEMBL14087507 0.83 ESR1 (0.47) ALDH1A1HSD17B10GAAPGRPTGS1
SCHEMBL22724977 0.82 ESR1 (0.46) ALDH1A1HSD17B10GAAPGRPTGS1
SCHEMBL1598809 0.81 HSD17B10 (0.67) ALDH1A1HSD17B10GAAPGRPTGS1
SCHEMBL29525161 0.81 HSD17B10 (0.67) ALDH1A1HSD17B10GAAPGRPTGS1
SCHEMBL14085554 0.81 ELANE (0.41) ALDH1A1HSD17B10GAAPGRPTGS1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8088554-B2 Bottom resist layer composition and patterning process using the same SHIN-ETSU CHEMICAL CO., LTD (JP) 2012-01-03 US disclosed
US-8088554-B2 Bottom resist layer composition and patterning process using the same SHIN-ETSU CHEMICAL CO., LTD (JP) 2012-01-03 US disclosed
US-20100151382-A1 Bottom resist layer composition and patterning process using the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-06-17 US disclosed
US-20100151382-A1 Bottom resist layer composition and patterning process using the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-06-17 US disclosed
US-7534547-B2 Optically active compound and photosensitive resin composition OSAKA GAS COMPANY LIMITED (JP) 2009-05-19 US disclosed
US-7534547-B2 Optically active compound and photosensitive resin composition OSAKA GAS COMPANY LIMITED (JP) 2009-05-19 US disclosed
EP-1441256-B1 Radiation-sensitive resin composition JSR CORP (JP) 2006-05-31 EP disclosed
EP-0789278-B1 Radiation-sensitive resin composition JSR CORP (JP) 2005-05-04 EP disclosed
EP-1441256-A1 Radiation-sensitive resin composition JSR Corporation (JP) 2004-07-28 EP disclosed
US-6727032-B1 USEFUL IN MICRO-PROCESSING USING VARIOUS RADIATIONS, E.G., FAR-ULTRAVIOLET RADIATION SUCH AS KRF EXCIMER LASER OR ARF EXCIMER LASER, X RAYS SUCH AS SYNCHROTRON RADIATION, CHARGED PARTICLE RADIATION SUCH AS ELECTRON BEAM, ETC. JSR CORPORATION (JP) 2004-04-27 US disclosed
US-20030073027-A1 Chemical amplification resist compositions and process for the formation of resist patterns FUJITSU LIMITED (JP) 2003-04-17 US disclosed
US-6200724-B1 CHEMICAL AMPLIFICATION RESIST COMPRISES AN ALKALI-SOLUBLE BASE RESIN, A PHOTOACID GENERATOR AND A DISSOLUTION INHIBITOR, IN WHICH A CYCLIC STRUCTURE FORMS A MATRIX PORTION CONTAINS ONE LONE PAIR CONTAINING PORTION FUJITSU LIMITED (JP) 2001-03-13 US disclosed
US-5914219-A Radiation-sensitive mixture and the production of relief structures having improved contrast BASF AKTIENGESELLSCHAFT (DE) 1999-06-22 US disclosed
US-5783354-A QUATERNARY AMMONIUM COMPOUNDS BASF AKTIENGESELLSCHAFT (DE) 1998-07-21 US disclosed
EP-0789278-A2 Radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1997-08-13 EP disclosed
US-5318876-A Solutions of water insoluble, base soluble polymeric binder, substituted sulfonium salts, substituted benzenesulfonates, having tolerance for delay between exposure and heating to develop BASF AKTIENGESELLSCHAFT (DE) 1994-06-07 US disclosed
US-5300400-A Process for the production of relief patterns and images utilizing an organic compound having at least one acid-cleavable group and a storage stability improving amount of a second organic compound BASF AKTIENGESELLSCHAFT (DE) 1994-04-05 US disclosed
US-5084371-A POSITIVE-WORKING, RADIATION-SENSITIVE MIXTURE BASED ON ACID-CLEAVABLE AND PHOTOCHEMICALLY ACID-FORMING COMPOUNDS, AND THE PRODUCTION OF RELIEF PATTERNS AND RELIEF IMAGES BASF AKTIENGESELLSCHAFT (DE) 1992-01-28 US disclosed
US-5069998-A RADIATION SENSITIVE MIXTURE AND PRODUCTION OF RELIEF PATTERNS BASF AKTIENGESELLSCHAFT (DE) 1991-12-03 US disclosed
US-4883740-A RELIEF PATTERNS AND IMAGES BASF AKTIENGESELLSCHAFT (DE) 1989-11-28 US disclosed